CA2153022C - Feuille metallique de type circuit servant a indiquer la frequence de resonance et methode de fabrication - Google Patents
Feuille metallique de type circuit servant a indiquer la frequence de resonance et methode de fabricationInfo
- Publication number
- CA2153022C CA2153022C CA002153022A CA2153022A CA2153022C CA 2153022 C CA2153022 C CA 2153022C CA 002153022 A CA002153022 A CA 002153022A CA 2153022 A CA2153022 A CA 2153022A CA 2153022 C CA2153022 C CA 2153022C
- Authority
- CA
- Canada
- Prior art keywords
- circuit
- metallic foil
- resonant
- laminate
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
- Burglar Alarm Systems (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32350694 | 1994-12-01 | ||
| JPHEI6-323506 | 1994-12-01 | ||
| JP07167978A JP3116209B2 (ja) | 1994-12-01 | 1995-06-10 | 共振タグ等の回路様金属箔シートの製造方法 |
| JPHEI7-167978 | 1995-06-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2153022A1 CA2153022A1 (fr) | 1996-06-02 |
| CA2153022C true CA2153022C (fr) | 1999-11-30 |
Family
ID=26491853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002153022A Expired - Fee Related CA2153022C (fr) | 1994-12-01 | 1995-06-29 | Feuille metallique de type circuit servant a indiquer la frequence de resonance et methode de fabrication |
Country Status (8)
| Country | Link |
|---|---|
| KR (1) | KR100197509B1 (fr) |
| CN (1) | CN1100999C (fr) |
| AU (1) | AU700075B2 (fr) |
| BR (1) | BR9502961A (fr) |
| CA (1) | CA2153022C (fr) |
| MY (1) | MY117567A (fr) |
| SG (1) | SG71080A1 (fr) |
| TW (1) | TW404092B (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5754110A (en) * | 1996-03-07 | 1998-05-19 | Checkpoint Systems, Inc. | Security tag and manufacturing method |
| KR100605480B1 (ko) | 2004-04-19 | 2006-07-31 | 고상근 | 알에프아이디 시스템의 태그 제조방법 |
| JP5377096B2 (ja) | 2008-09-08 | 2013-12-25 | 株式会社東芝 | 高周波パッケージ装置およびその製造方法 |
| KR20120028418A (ko) | 2010-09-14 | 2012-03-23 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치용 밀봉기판의 제조 방법 및 유기 발광 표시 장치용 밀봉기판 |
| EP2642838A4 (fr) | 2010-11-19 | 2016-08-31 | Toppan Printing Co Ltd | Feuille métallique stratifiée à motifs, procédé de poinçonnage de feuille métallique, carte de circuits imprimés, procédé de production de cette dernière et module de cellule solaire |
| ES2660212T3 (es) | 2011-06-06 | 2018-03-21 | Toppan Printing Co., Ltd. | Laminado con patrón de hoja metálica y un módulo solar |
| CN112621891B (zh) * | 2019-09-24 | 2022-10-14 | 泰州隆基乐叶光伏科技有限公司 | 导电金属箔冲压方法及冲压装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3116078A1 (de) * | 1981-04-22 | 1983-01-20 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | "praegefolie" |
| CH677988A5 (fr) * | 1986-07-30 | 1991-07-15 | Actron Entwicklungs Ag | |
| CH680483A5 (fr) * | 1989-10-20 | 1992-08-31 | Kobe Properties Ltd |
-
1995
- 1995-06-20 MY MYPI95001653A patent/MY117567A/en unknown
- 1995-06-20 SG SG1998000182A patent/SG71080A1/en unknown
- 1995-06-20 TW TW084106329A patent/TW404092B/zh not_active IP Right Cessation
- 1995-06-27 AU AU23294/95A patent/AU700075B2/en not_active Ceased
- 1995-06-28 BR BR9502961A patent/BR9502961A/pt not_active IP Right Cessation
- 1995-06-29 CA CA002153022A patent/CA2153022C/fr not_active Expired - Fee Related
- 1995-06-29 CN CN95108149A patent/CN1100999C/zh not_active Expired - Lifetime
- 1995-06-30 KR KR1019950018841A patent/KR100197509B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1126841A (zh) | 1996-07-17 |
| TW404092B (en) | 2000-09-01 |
| CN1100999C (zh) | 2003-02-05 |
| MY117567A (en) | 2004-07-31 |
| CA2153022A1 (fr) | 1996-06-02 |
| KR100197509B1 (ko) | 1999-06-15 |
| SG71080A1 (en) | 2000-03-21 |
| BR9502961A (pt) | 1997-05-27 |
| AU2329495A (en) | 1996-06-06 |
| AU700075B2 (en) | 1998-12-17 |
| KR960021510A (ko) | 1996-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0665705B1 (fr) | Feuille comportant feuille métallique en forme de circuit ou similaire et procédé de production | |
| US6458465B1 (en) | Circuit-like metallic foil sheet and the like and process for producing them | |
| US6214444B1 (en) | Circuit-like metallic foil sheet and the like and processing for producing them | |
| US6383616B1 (en) | Circuit-like metallic foil sheet and the like and process for producing them | |
| JP3116209B2 (ja) | 共振タグ等の回路様金属箔シートの製造方法 | |
| AU2002326876B2 (en) | Security tag and process for making same | |
| EP0059723B1 (fr) | Constructions de circuits d'index resonnants modifies et procedes de fabrication | |
| US4970495A (en) | Resonant frequency characteristic tag and method of manufacturing the same | |
| US3913219A (en) | Planar circuit fabrication process | |
| CN100367834C (zh) | 谐振标签的制造方法和谐振标签 | |
| JP3096069B2 (ja) | 共振タグ及びその製造方法 | |
| AU2002326876A1 (en) | Security tag and process for making same | |
| EP0203083B1 (fr) | Marqueur hf plie pour systemes electroniques de surveillance d'articles | |
| JP2863770B2 (ja) | 盗難防止用マーカ | |
| AU2007238242A1 (en) | Transfer tape strap process | |
| US20020018880A1 (en) | Stamping foils for use in making printed circuits and radio frequency antennas | |
| CA2153022C (fr) | Feuille metallique de type circuit servant a indiquer la frequence de resonance et methode de fabrication | |
| AU723222B2 (en) | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it | |
| JPH11316882A (ja) | 共振タグ等の回路様金属箔シ―ト | |
| JP2899781B2 (ja) | 共振タグ | |
| JP3455898B2 (ja) | 共振タグ | |
| AU2008201883A8 (en) | Security Tag and Process for Making Same | |
| HK1034793A (en) | Process for producing resonant tag |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |