CA2202576A1 - Montage de circuit electronique - Google Patents

Montage de circuit electronique

Info

Publication number
CA2202576A1
CA2202576A1 CA002202576A CA2202576A CA2202576A1 CA 2202576 A1 CA2202576 A1 CA 2202576A1 CA 002202576 A CA002202576 A CA 002202576A CA 2202576 A CA2202576 A CA 2202576A CA 2202576 A1 CA2202576 A1 CA 2202576A1
Authority
CA
Canada
Prior art keywords
leads
circuit assembly
electronic circuit
connecting member
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002202576A
Other languages
English (en)
Other versions
CA2202576C (fr
Inventor
Fumio Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2202576A1 publication Critical patent/CA2202576A1/fr
Application granted granted Critical
Publication of CA2202576C publication Critical patent/CA2202576C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CA002202576A 1996-04-15 1997-04-14 Montage de circuit electronique Expired - Fee Related CA2202576C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92155/1996 1996-04-15
JP8092155A JP2910668B2 (ja) 1996-04-15 1996-04-15 電子部品組立体およびその製造方法ならびに電子部品の接続部材

Publications (2)

Publication Number Publication Date
CA2202576A1 true CA2202576A1 (fr) 1997-10-15
CA2202576C CA2202576C (fr) 2001-05-29

Family

ID=14046541

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002202576A Expired - Fee Related CA2202576C (fr) 1996-04-15 1997-04-14 Montage de circuit electronique

Country Status (2)

Country Link
JP (1) JP2910668B2 (fr)
CA (1) CA2202576C (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19933265A1 (de) 1999-07-15 2001-02-01 Siemens Ag TSOP-Speicherchipgehäuseanordnung
JP7128436B2 (ja) * 2018-04-02 2022-08-31 Tdk株式会社 電子部品組立体

Also Published As

Publication number Publication date
CA2202576C (fr) 2001-05-29
JP2910668B2 (ja) 1999-06-23
JPH09283702A (ja) 1997-10-31

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed