CA2210883A1 - Method of selective or partial electrolytic plating of surfaces of substrates comprising non-conductive material - Google Patents

Method of selective or partial electrolytic plating of surfaces of substrates comprising non-conductive material

Info

Publication number: CA2210883A1
Authority: CA; Canada
Prior art keywords: plastics; metallisation; metal; metallised; solution
Prior art date: 1995-03-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

CA002210883A

Other languages

English (en)

French (fr)

Inventor

Hermann Middeke

John Mccaskie

Nayan H. Joshi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Atotech Deutschland GmbH and Co KG

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-03-17

Filing date

1996-03-15

Publication date

1996-09-26

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7757663&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2210883(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1996-03-15 Application filed by Individual filed Critical Individual

1996-09-26 Publication of CA2210883A1 publication Critical patent/CA2210883A1/en

Status Abandoned legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 71
239000012811 non-conductive material Substances 0.000 title claims abstract description 7
239000000758 substrate Substances 0.000 title abstract description 44
238000009713 electroplating Methods 0.000 title description 5
239000000243 solution Substances 0.000 claims abstract description 75
238000001465 metallisation Methods 0.000 claims abstract description 54
229910052751 metal Inorganic materials 0.000 claims abstract description 44
239000002184 metal Substances 0.000 claims abstract description 44
239000004033 plastic Substances 0.000 claims abstract description 29
229920003023 plastic Polymers 0.000 claims abstract description 29
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 19
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
150000001875 compounds Chemical class 0.000 claims abstract description 12
150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 8
238000005530 etching Methods 0.000 claims abstract description 8
239000003929 acidic solution Substances 0.000 claims abstract description 5
150000002736 metal compounds Chemical class 0.000 claims abstract description 5
229910000000 metal hydroxide Inorganic materials 0.000 claims abstract description 4
150000004692 metal hydroxides Chemical class 0.000 claims abstract description 4
238000001556 precipitation Methods 0.000 claims abstract description 4
239000003513 alkali Substances 0.000 claims abstract description 3
150000002941 palladium compounds Chemical class 0.000 claims abstract description 3
238000011282 treatment Methods 0.000 claims description 32
238000000576 coating method Methods 0.000 claims description 14
239000011248 coating agent Substances 0.000 claims description 11
239000000463 material Substances 0.000 claims description 11
WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 9
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
239000004800 polyvinyl chloride Substances 0.000 claims description 5
229920000915 polyvinyl chloride Polymers 0.000 claims description 5
239000004952 Polyamide Substances 0.000 claims description 4
FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
229920002647 polyamide Polymers 0.000 claims description 4
239000011975 tartaric acid Substances 0.000 claims description 4
235000002906 tartaric acid Nutrition 0.000 claims description 4
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
239000005749 Copper compound Substances 0.000 claims description 3
FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
229910001854 alkali hydroxide Inorganic materials 0.000 claims description 3
229920001577 copolymer Polymers 0.000 claims description 3
150000001880 copper compounds Chemical class 0.000 claims description 3
239000000203 mixture Substances 0.000 claims description 3
229920000515 polycarbonate Polymers 0.000 claims description 2
239000004417 polycarbonate Substances 0.000 claims description 2
239000002991 molded plastic Substances 0.000 claims 2
229920006149 polyester-amide block copolymer Polymers 0.000 claims 2
229940095064 tartrate Drugs 0.000 claims 1
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 34
229910052763 palladium Inorganic materials 0.000 description 17
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
239000007864 aqueous solution Substances 0.000 description 16
229910052802 copper Inorganic materials 0.000 description 16
239000010949 copper Substances 0.000 description 16
239000012190 activator Substances 0.000 description 11
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
238000004519 manufacturing process Methods 0.000 description 8
150000003606 tin compounds Chemical class 0.000 description 8
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
150000003839 salts Chemical class 0.000 description 6
239000001117 sulphuric acid Substances 0.000 description 6
235000011149 sulphuric acid Nutrition 0.000 description 6
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
239000002253 acid Substances 0.000 description 5
239000003795 chemical substances by application Substances 0.000 description 5
230000003750 conditioning effect Effects 0.000 description 5
229920001940 conductive polymer Polymers 0.000 description 5
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
150000004770 chalcogenides Chemical class 0.000 description 4
239000003638 chemical reducing agent Substances 0.000 description 4
239000000084 colloidal system Substances 0.000 description 4
229910052500 inorganic mineral Inorganic materials 0.000 description 4
229910021645 metal ion Inorganic materials 0.000 description 4
150000002739 metals Chemical class 0.000 description 4
239000011707 mineral Substances 0.000 description 4
239000002245 particle Substances 0.000 description 4
239000000126 substance Substances 0.000 description 4
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
238000000151 deposition Methods 0.000 description 3
230000008021 deposition Effects 0.000 description 3
238000007654 immersion Methods 0.000 description 3
238000009434 installation Methods 0.000 description 3
229910000510 noble metal Inorganic materials 0.000 description 3
150000002940 palladium Chemical class 0.000 description 3
238000001179 sorption measurement Methods 0.000 description 3
HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical group [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 2
JWUXJYZVKZKLTJ-UHFFFAOYSA-N Triacetonamine Chemical compound CC1(C)CC(=O)CC(C)(C)N1 JWUXJYZVKZKLTJ-UHFFFAOYSA-N 0.000 description 2
WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
239000012670 alkaline solution Substances 0.000 description 2
239000002585 base Substances 0.000 description 2
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
UGWKCNDTYUOTQZ-UHFFFAOYSA-N copper;sulfuric acid Chemical compound [Cu].OS(O)(=O)=O UGWKCNDTYUOTQZ-UHFFFAOYSA-N 0.000 description 2
238000002474 experimental method Methods 0.000 description 2
230000002349 favourable effect Effects 0.000 description 2
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
150000004679 hydroxides Chemical class 0.000 description 2
AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
239000007788 liquid Substances 0.000 description 2
GLXDVVHUTZTUQK-UHFFFAOYSA-M lithium;hydroxide;hydrate Chemical compound [Li+].O.[OH-] GLXDVVHUTZTUQK-UHFFFAOYSA-M 0.000 description 2
239000000178 monomer Substances 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
239000000615 nonconductor Substances 0.000 description 2
229920000867 polyelectrolyte Polymers 0.000 description 2
229920000728 polyester Polymers 0.000 description 2
238000002203 pretreatment Methods 0.000 description 2
239000000047 product Substances 0.000 description 2
230000001681 protective effect Effects 0.000 description 2
239000008237 rinsing water Substances 0.000 description 2
239000004289 sodium hydrogen sulphite Substances 0.000 description 2
235000010267 sodium hydrogen sulphite Nutrition 0.000 description 2
238000012360 testing method Methods 0.000 description 2
239000002351 wastewater Substances 0.000 description 2
FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
229920004142 LEXAN™ Polymers 0.000 description 1
239000004418 Lexan Substances 0.000 description 1
FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
239000004727 Noryl Substances 0.000 description 1
229920001207 Noryl Polymers 0.000 description 1
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
238000010306 acid treatment Methods 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
235000019270 ammonium chloride Nutrition 0.000 description 1
229910052788 barium Inorganic materials 0.000 description 1
DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
150000001639 boron compounds Chemical class 0.000 description 1
239000011575 calcium Substances 0.000 description 1
229910052791 calcium Inorganic materials 0.000 description 1
150000001786 chalcogen compounds Chemical class 0.000 description 1
-1 chalcogenide compound Chemical class 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
210000001520 comb Anatomy 0.000 description 1
230000009918 complex formation Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
229910001431 copper ion Inorganic materials 0.000 description 1
OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
230000001419 dependent effect Effects 0.000 description 1
239000012895 dilution Substances 0.000 description 1
238000010790 dilution Methods 0.000 description 1
YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
229960001484 edetic acid Drugs 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000003792 electrolyte Substances 0.000 description 1
230000005670 electromagnetic radiation Effects 0.000 description 1
150000002240 furans Chemical class 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
239000012535 impurity Substances 0.000 description 1
238000001746 injection moulding Methods 0.000 description 1
239000011777 magnesium Substances 0.000 description 1
229910052749 magnesium Inorganic materials 0.000 description 1
238000005259 measurement Methods 0.000 description 1
229910052976 metal sulfide Inorganic materials 0.000 description 1
XONPDZSGENTBNJ-UHFFFAOYSA-N molecular hydrogen;sodium Chemical compound [Na].[H][H] XONPDZSGENTBNJ-UHFFFAOYSA-N 0.000 description 1
238000011328 necessary treatment Methods 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
239000012454 non-polar solvent Substances 0.000 description 1
239000006259 organic additive Substances 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
239000002798 polar solvent Substances 0.000 description 1
229920002851 polycationic polymer Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
239000001267 polyvinylpyrrolidone Substances 0.000 description 1
229910052700 potassium Inorganic materials 0.000 description 1
239000011591 potassium Substances 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
150000003233 pyrroles Chemical class 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
239000012279 sodium borohydride Substances 0.000 description 1
229910000033 sodium borohydride Inorganic materials 0.000 description 1
239000002904 solvent Substances 0.000 description 1
238000005507 spraying Methods 0.000 description 1
230000008961 swelling Effects 0.000 description 1
150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
229930192474 thiophene Natural products 0.000 description 1
150000003577 thiophenes Chemical class 0.000 description 1
231100000331 toxic Toxicity 0.000 description 1
230000002588 toxic effect Effects 0.000 description 1
239000010891 toxic waste Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Electroplating Methods And Accessories (AREA)
Manufacturing Of Printed Wiring (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

CA002210883A 1995-03-17 1996-03-15 Method of selective or partial electrolytic plating of surfaces of substrates comprising non-conductive material Abandoned CA2210883A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19510855A DE19510855C2 (de)	1995-03-17	1995-03-17	Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
DE19510855.8		1995-03-17

Publications (1)

Publication Number	Publication Date
CA2210883A1 true CA2210883A1 (en)	1996-09-26

Family

ID=7757663

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA002210883A Abandoned CA2210883A1 (en)	1995-03-17	1996-03-15	Method of selective or partial electrolytic plating of surfaces of substrates comprising non-conductive material

Country Status (9)

Country	Link
EP (1)	EP0815292B1 (de)
JP (1)	JPH11502263A (de)
KR (1)	KR19980703108A (de)
AT (1)	ATE189274T1 (de)
BR (1)	BR9607848A (de)
CA (1)	CA2210883A1 (de)
DE (2)	DE19510855C2 (de)
ES (1)	ES2142572T3 (de)
WO (1)	WO1996029452A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8152914B2 (en)	2007-05-03	2012-04-10	Atotech Deutschland Gmbh	Process for applying a metal coating to a non-conductive substrate

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DE19857290C2 (de) *	1998-12-14	2001-02-01	Lpw Chemie Gmbh	Verfahren zur direkten Metallisierung der Oberfläche eines Kunststoffgegenstandes
US6541080B1 (en)	1998-12-14	2003-04-01	Enthone Inc.	Double-dip Pd/Sn crosslinker
DE10208674B4 (de) *	2002-02-28	2011-07-07	BIA Kunststoff- und Galvanotechnik GmbH & Co. KG, 42655	Verfahren zur Herstellung galvanisch beschichteter Elemente mit hinterleuchtbaren Symbolen und nach dem Verfahren hergestellte Elemente
DE10223081A1 (de) *	2002-05-17	2003-12-04	Hansgrohe Ag	Verfahren zur Herstellung von galvanisierten Sanitärgegenständen aus Kunststoff
KR100913265B1 (ko) *	2002-07-30	2009-08-21	엘지전자 주식회사	전원 공급 단자
DE102005026633A1 (de)	2005-06-03	2006-12-28	Hansgrohe Ag	Verfahren zur Herstellung von galvanisierten Sanitärgegenständen aus Kunststoff
DE102005031454A1 (de) *	2005-07-04	2007-01-11	Huf Hülsbeck & Fürst Gmbh & Co. Kg	Türgriff, Türgriff-Gehäuse und Verfahren zum Herstellen des Türgriff-Gehäuses
DE102005051632B4 (de) *	2005-10-28	2009-02-19	Enthone Inc., West Haven	Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
DE102006042269B4 (de) *	2006-09-08	2014-08-28	Automobile Patentverwaltungs- und -verwertungsgesellschaft mbH	Verfahren zum galvanischen Beschichten von Trägerteilen aus Kunststoffen
EP2305856A1 (de)	2009-09-28	2011-04-06	ATOTECH Deutschland GmbH	Verfahren zum Aufbringen einer Metallbeschichtung auf ein nichtleitfähiges Substrat
EP2602357A1 (de)	2011-12-05	2013-06-12	Atotech Deutschland GmbH	Neuartiges Haftmittel zur Metallisierung von Substratoberflächen
EP2639333A1 (de)	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639332A1 (de)	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2644744A1 (de)	2012-03-29	2013-10-02	Atotech Deutschland GmbH	Verfahren zur Förderung der Haftung zwischen dielektrischen Substraten und Metallschichten
US10036097B2 (en)	2012-12-21	2018-07-31	Okuno Chemical Industries Co., Ltd.	Conductive coating film forming bath
CN105593410A (zh)	2013-09-26	2016-05-18	德国艾托特克公司	用于衬底表面金属化的新颖粘着促进方法
WO2015111291A1 (ja)	2014-01-27	2015-07-30	奥野製薬工業株式会社	導電性皮膜形成浴
EP3059277B2 (de)	2015-02-23	2022-03-30	MacDermid Enthone Inc.	Inhibitorzusammensetzung für Gestelle bei Verwendung chromfreier Ätzmittel in einem Plattierungsverfahren auf Kunststoffen

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Publication number	Priority date	Publication date	Assignee	Title
US5376248A (en) *	1991-10-15	1994-12-27	Enthone-Omi, Inc.	Direct metallization process
DE4206680C1 (de) *	1992-02-28	1994-01-27	Schering Ag	Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
DE69426732T3 (de) *	1993-03-18	2010-11-25	Atotech Deutschland Gmbh	Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd
GB2277745A (en) *	1993-04-20	1994-11-09	Enthone Omi	Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s

1995
- 1995-03-17 DE DE19510855A patent/DE19510855C2/de not_active Revoked
1996
- 1996-03-15 CA CA002210883A patent/CA2210883A1/en not_active Abandoned
- 1996-03-15 AT AT96907505T patent/ATE189274T1/de active
- 1996-03-15 EP EP96907505A patent/EP0815292B1/de not_active Revoked
- 1996-03-15 KR KR1019970706510A patent/KR19980703108A/ko not_active Ceased
- 1996-03-15 ES ES96907505T patent/ES2142572T3/es not_active Expired - Lifetime
- 1996-03-15 WO PCT/EP1996/001190 patent/WO1996029452A1/de not_active Ceased
- 1996-03-15 DE DE59604301T patent/DE59604301D1/de not_active Revoked
- 1996-03-15 BR BR9607848A patent/BR9607848A/pt not_active IP Right Cessation
- 1996-03-15 JP JP8528081A patent/JPH11502263A/ja active Pending

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8152914B2 (en)	2007-05-03	2012-04-10	Atotech Deutschland Gmbh	Process for applying a metal coating to a non-conductive substrate

Also Published As

Publication number	Publication date
JPH11502263A (ja)	1999-02-23
ES2142572T3 (es)	2000-04-16
KR19980703108A (ko)	1998-10-15
DE19510855C2 (de)	1998-04-30
EP0815292A1 (de)	1998-01-07
ATE189274T1 (de)	2000-02-15
HK1008552A1 (en)	1999-05-14
WO1996029452A1 (de)	1996-09-26
DE19510855A1 (de)	1996-09-19
EP0815292B1 (de)	2000-01-26
DE59604301D1 (de)	2000-03-02
BR9607848A (pt)	1998-07-14

Legal Events

Date	Code	Title	Description
2000-03-14	EEER	Examination request
2004-09-07	FZDE	Discontinued

Publication	Publication Date	Title
CA2866786C (en)	2020-03-31	Process for metallizing nonconductive plastic surfaces
EP0905285B1 (de)	2000-12-27	Verfahren zum elektrobeschichten nichtleitender materialien
KR100541893B1 (ko)	2006-01-10	금속으로 기판을 코팅하는 방법
US20050199587A1 (en)	2005-09-15	Non-chrome plating on plastic
GB2075063A (en)	1981-11-11	Process for plating polumeric substrates
CN102791907B (zh)	2015-08-05	对表面上具有至少两种不同塑料的物体进行金属化的方法
KR19980703108A (ko)	1998-10-15	비전도성 물질로 제조된 기판 표면을 선택적 또는 부분적으로 전해 메탈라이징하는 방법
JPH0544075A (ja)	1993-02-23	無電解銅めつき代替銅ストライクめつき方法
CA2866769A1 (en)	2013-09-19	Process for metallizing nonconductive plastic surfaces
EP2305856A1 (de)	2011-04-06	Verfahren zum Aufbringen einer Metallbeschichtung auf ein nichtleitfähiges Substrat
JP6150822B2 (ja)	2017-06-21	非導電性プラスチック表面の金属化方法
JP4789361B2 (ja)	2011-10-12	誘電体表面上に導電層を製造する方法
CN104204294A (zh)	2014-12-10	促进介电衬底与金属层之间粘着度的方法
TW391993B (en)	2000-06-01	Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials
HK1008552B (en)	2000-07-14	Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials
JPH0250196B2 (de)	1990-11-01
Mittal	1998	Jim Y. Lee and CQ Cui¹ Department of Chemical Engineering National University of Singapore
Lee et al.	1998	Economical selective metallization of insulating surfaces
WO2001007686A1 (en)	2001-02-01	Article in which a non-conductive substrate is coated with electroplated metal and process for its manufacture

CA2210883A1 - Method of selective or partial electrolytic plating of surfaces of substrates comprising non-conductive material - Google Patents

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