CA2273865A1 - Boitier pour composants optiques plans thermosensibles - Google Patents

Boitier pour composants optiques plans thermosensibles Download PDF

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Publication number
CA2273865A1
CA2273865A1 CA002273865A CA2273865A CA2273865A1 CA 2273865 A1 CA2273865 A1 CA 2273865A1 CA 002273865 A CA002273865 A CA 002273865A CA 2273865 A CA2273865 A CA 2273865A CA 2273865 A1 CA2273865 A1 CA 2273865A1
Authority
CA
Canada
Prior art keywords
package
component
temperature
heating element
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002273865A
Other languages
English (en)
Inventor
Felice Scotta
Alain M. J. Beguin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority claimed from PCT/US1997/023168 external-priority patent/WO1998024695A2/fr
Publication of CA2273865A1 publication Critical patent/CA2273865A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating

Landscapes

  • Control Of Resistance Heating (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Measuring Fluid Pressure (AREA)
  • Control Of Temperature (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Un boîtier pour un composant optique thermosensible (20) comprend des récipients interne (14) et externe (12) en matière plastique à faible conductivité thermique, une mousse isolante (18) placée entre les deux récipients. Dans le récipient interne (14) est prévue une plaque thermoconductrice à laquelle le composant (20), une résistance thermosensible et un élément chauffant résistif sont fixés. Un circuit de correction de température (16) est placé à l'extérieur du récipient interne. La résistance thermosensible fait partie d'un pont de Wheatstone prévu à l'entrée du circuit (16), le circuit corrigeant les variations de tension de fonctionnement. Le transistor de sortie du circuit régule le courant passant dans l'élément chauffant résistif en réaction aux variations de résistance de la résistance thermosensible. Ledit transistor s'étend dans le récipient (14) et est en contact avec la plaque thermoconductrice, la chaleur provenant du transistor étant dissipée dans la plaque. Ainsi, la température du transistor reste sensiblement constante.
CA002273865A 1996-12-06 1997-12-02 Boitier pour composants optiques plans thermosensibles Abandoned CA2273865A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR96/15002 1996-12-06
FR9615002 1996-12-06
PCT/US1997/023168 WO1998024695A2 (fr) 1996-12-06 1997-12-02 Boitier pour composants optiques plans thermosensibles

Publications (1)

Publication Number Publication Date
CA2273865A1 true CA2273865A1 (fr) 1998-06-11

Family

ID=9498410

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002273865A Abandoned CA2273865A1 (fr) 1996-12-06 1997-12-02 Boitier pour composants optiques plans thermosensibles

Country Status (5)

Country Link
JP (1) JP2002516596A (fr)
KR (1) KR20000057385A (fr)
CN (1) CN1238898A (fr)
CA (1) CA2273865A1 (fr)
TW (1) TW339322B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111891533A (zh) * 2020-08-13 2020-11-06 袁亚 一种医疗仪器收纳储存设备

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102386557A (zh) * 2010-08-25 2012-03-21 Agx技术股份有限公司 内部冷却的热封闭模块式激光器封装系统
CN102183977B (zh) * 2011-01-31 2013-08-21 北京东方计量测试研究所 可控温电阻器及自控温电阻装置
JP5842584B2 (ja) * 2011-09-29 2016-01-13 富士通株式会社 光コネクタ及びこれを用いた電子機器
WO2017188351A1 (fr) * 2016-04-27 2017-11-02 北陸電気工業株式会社 Dispositif de type capteur de pression
US10460966B2 (en) * 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
WO2019058634A1 (fr) * 2017-09-25 2019-03-28 オリンパス株式会社 Module optique
JP7135645B2 (ja) * 2018-09-19 2022-09-13 住友大阪セメント株式会社 光モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111891533A (zh) * 2020-08-13 2020-11-06 袁亚 一种医疗仪器收纳储存设备

Also Published As

Publication number Publication date
KR20000057385A (ko) 2000-09-15
CN1238898A (zh) 1999-12-15
TW339322B (en) 1998-09-01
JP2002516596A (ja) 2002-06-04

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Legal Events

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