CA2302078A1 - Capacitive pressure sensor or capacitive differential pressure sensor - Google Patents
Capacitive pressure sensor or capacitive differential pressure sensor Download PDFInfo
- Publication number
- CA2302078A1 CA2302078A1 CA 2302078 CA2302078A CA2302078A1 CA 2302078 A1 CA2302078 A1 CA 2302078A1 CA 2302078 CA2302078 CA 2302078 CA 2302078 A CA2302078 A CA 2302078A CA 2302078 A1 CA2302078 A1 CA 2302078A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- pressure sensor
- electrode
- capacitive
- major surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 abstract 2
- 239000013078 crystal Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0075—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The electrodes of these pressure or differential pressure sensors are formed using a technique other than silk-screen printing or sputtering: The pressure sensor (10) has a substrate (1) and a first major surface (11), a second major surface (12) and a circumferential surface (13. A plate-shaped electrode (14) of electrically conductive material is secured in a recess (15) in the major surface (11) in a high-pressure-resistant and high-vacuum-tight manner by a joining material (16). A through connection (17) is provided from the electrode (14) through the substrate (1) to the major surface (12) or the circumferential surface (13).
A diaphragm (2) of ceramic, glass, or single-crystal material is attached to the substrate (1) outside the recess (15) along a joint (18) by a joining material (26), and forms itself a further electrode or is covered, on a surface facing the electrode (14), with a further electrode (24) which is contacted through the joint (18). Substrate and diaphragm consist of a ceramic, glass, or single-crystal material. Respective differential pressure sensors have either a common central diaphragm and two substrates or a common substrate and two diaphragms.
A diaphragm (2) of ceramic, glass, or single-crystal material is attached to the substrate (1) outside the recess (15) along a joint (18) by a joining material (26), and forms itself a further electrode or is covered, on a surface facing the electrode (14), with a further electrode (24) which is contacted through the joint (18). Substrate and diaphragm consist of a ceramic, glass, or single-crystal material. Respective differential pressure sensors have either a common central diaphragm and two substrates or a common substrate and two diaphragms.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99105939A EP1039284A1 (en) | 1999-03-24 | 1999-03-24 | Capacitive sensor of pressure or differential pressure |
| DE99105939.5 | 1999-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2302078A1 true CA2302078A1 (en) | 2000-09-26 |
| CA2302078C CA2302078C (en) | 2005-08-23 |
Family
ID=8237849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2302078 Expired - Fee Related CA2302078C (en) | 1999-03-24 | 2000-03-24 | Capacitive pressure sensor or capacitive differential pressure sensor |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1039284A1 (en) |
| JP (1) | JP3205325B2 (en) |
| CA (1) | CA2302078C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150135844A1 (en) * | 2012-07-11 | 2015-05-21 | Endress + Hauser Gmbh + Co. Kg | Method for joining ceramic bodies by means of an active hard solder, or braze, assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell |
| US20150160086A1 (en) * | 2012-07-11 | 2015-06-11 | Endress + Hauser Gmbh + Co. Kg | Method for Joining Ceramic Bodies by means of an Active Hard Solder, or Braze, Assembly having at least two Ceramic Bodies joined with one another, especially a Pressure Measuring Cell |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4974424B2 (en) * | 2001-07-26 | 2012-07-11 | 京セラ株式会社 | Package for pressure detection device |
| DE10212947C1 (en) * | 2002-03-22 | 2003-09-18 | Nord Micro Ag & Co Ohg | Pressure sensor determining absolute pressure capacitatively comprises main body, membrane, spacer and holder forming measurement cell assembly |
| US7353711B2 (en) * | 2003-08-11 | 2008-04-08 | Analog Devices, Inc. | Capacitive sensor |
| JP2005134221A (en) * | 2003-10-29 | 2005-05-26 | Kyocera Corp | Package for pressure detection device |
| JP2005214735A (en) * | 2004-01-28 | 2005-08-11 | Kyocera Corp | Package for pressure detection device |
| JP4508666B2 (en) * | 2004-01-28 | 2010-07-21 | 京セラ株式会社 | Package for pressure detection device |
| DE102006021203B3 (en) | 2006-05-06 | 2008-01-17 | Tyco Electronics Austria Gmbh | Electric relay |
| DE102007026243A1 (en) * | 2007-06-04 | 2008-12-11 | Endress + Hauser Gmbh + Co. Kg | Capacitive pressure sensor |
| DE102010048903B4 (en) * | 2010-10-08 | 2014-10-30 | Hydac Electronic Gmbh | Electrical feedthrough for high pressure applications as a carrier for sensors |
| DE102010063723A1 (en) | 2010-12-21 | 2012-06-21 | Endress + Hauser Gmbh + Co. Kg | Pressure sensor has measuring diaphragm that rests on front supporting ends of profiled elements which are extended radially inward from outer surface of base, during overload condition |
| CN102539049B (en) * | 2012-01-16 | 2014-07-02 | 中北大学 | Capacitance pressure tester |
| CN116324363A (en) * | 2020-10-12 | 2023-06-23 | 株式会社村田制作所 | Pressure sensor chip and pressure sensor |
| CN114459666B (en) * | 2022-02-14 | 2023-03-17 | 北京航空航天大学 | A capacitive differential pressure sensor, manufacturing method and application thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4227419A (en) | 1979-09-04 | 1980-10-14 | Kavlico Corporation | Capacitive pressure transducer |
| GB2125167B (en) * | 1982-07-15 | 1986-06-04 | Tekflo Ltd | Electrical fluid pressure transducer diaphragms |
| DE3404262A1 (en) * | 1983-03-09 | 1984-09-13 | Fuji Electric Co., Ltd., Kawasaki | CAPACITIVE PROBE |
| DE3909185A1 (en) * | 1989-03-21 | 1990-09-27 | Endress Hauser Gmbh Co | CAPACITIVE PRESSURE SENSOR AND METHOD FOR THE PRODUCTION THEREOF |
| EP0516579B1 (en) * | 1991-05-26 | 1994-06-22 | Endress + Hauser Gmbh + Co. | Interface connection through an insulating part |
| DE19653427A1 (en) * | 1996-12-20 | 1998-07-02 | Siemens Ag | Force sensor |
-
1999
- 1999-03-24 EP EP99105939A patent/EP1039284A1/en not_active Withdrawn
-
2000
- 2000-03-23 JP JP2000082457A patent/JP3205325B2/en not_active Expired - Fee Related
- 2000-03-24 CA CA 2302078 patent/CA2302078C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150135844A1 (en) * | 2012-07-11 | 2015-05-21 | Endress + Hauser Gmbh + Co. Kg | Method for joining ceramic bodies by means of an active hard solder, or braze, assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell |
| US20150160086A1 (en) * | 2012-07-11 | 2015-06-11 | Endress + Hauser Gmbh + Co. Kg | Method for Joining Ceramic Bodies by means of an Active Hard Solder, or Braze, Assembly having at least two Ceramic Bodies joined with one another, especially a Pressure Measuring Cell |
| US9631994B2 (en) * | 2012-07-11 | 2017-04-25 | Endress + Hauser Gmbh + Co. Kg | Method for joining ceramic bodies by means of an active hard solder, or braze, assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3205325B2 (en) | 2001-09-04 |
| JP2001013026A (en) | 2001-01-19 |
| CA2302078C (en) | 2005-08-23 |
| EP1039284A1 (en) | 2000-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |