CA2303979A1 - Systeme chimique ameliore de sechage et de nettoyage - Google Patents

Systeme chimique ameliore de sechage et de nettoyage Download PDF

Info

Publication number
CA2303979A1
CA2303979A1 CA002303979A CA2303979A CA2303979A1 CA 2303979 A1 CA2303979 A1 CA 2303979A1 CA 002303979 A CA002303979 A CA 002303979A CA 2303979 A CA2303979 A CA 2303979A CA 2303979 A1 CA2303979 A1 CA 2303979A1
Authority
CA
Canada
Prior art keywords
workpiece
liquid
exposed surface
processing liquid
hfe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002303979A
Other languages
English (en)
Inventor
Robert J. Elson
John F. Schipper
Gary W. Ferrell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/034,369 external-priority patent/US5974689A/en
Priority claimed from US09/109,460 external-priority patent/US6119366A/en
Application filed by Individual filed Critical Individual
Publication of CA2303979A1 publication Critical patent/CA2303979A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

L'invention concerne un système (11) permettant de sécher et/ou de nettoyer un objet (17A), tel qu'un composant électronique, une tranche de semi-conducteur, une plaquette de circuit imprimé etc. Lorsque l'objet est retiré d'un liquide (13) de traitement ou de rinçage, un liquide de séchage et/ou de nettoyage sélectionné tel que l'hydrofluoroéther (HFE), un hydrofluoroéther éthylé ou un azéotrope d'un hydrofluoroéther ou d'un hydrofluoroéther éthylé, qui présente une tension superficielles très faible, est volatile et présente une densité largement supérieure à celle du liquide de traitement, est vaporisé, appliqué sous forme de gouttes ou transféré d'une autre façon sur une surface exposée de l'objet. Dans la plupart des cas, l'objet peut être séché en 7-45 secondes, voire moins, et peut être nettoyé en utilisant le système de l'invention. Le séchage et/ou le nettoyage peuvent être exécutés dans le cours d'un traitement par pièce, un traitement en continu par pièce ou un traitement par lots.
CA002303979A 1997-09-23 1998-09-22 Systeme chimique ameliore de sechage et de nettoyage Abandoned CA2303979A1 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US93567197A 1997-09-23 1997-09-23
US09/034,369 US5974689A (en) 1997-09-23 1998-03-03 Chemical drying and cleaning system
US09/109,460 1998-07-02
US09/034,369 1998-07-02
US09/109,460 US6119366A (en) 1998-03-03 1998-07-02 Chemical drying and cleaning method
US08/935,671 1998-07-02
PCT/US1998/019793 WO1999015845A1 (fr) 1997-09-23 1998-09-22 Systeme chimique ameliore de sechage et de nettoyage

Publications (1)

Publication Number Publication Date
CA2303979A1 true CA2303979A1 (fr) 1999-04-01

Family

ID=27364636

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002303979A Abandoned CA2303979A1 (fr) 1997-09-23 1998-09-22 Systeme chimique ameliore de sechage et de nettoyage

Country Status (5)

Country Link
EP (1) EP1025409A1 (fr)
JP (1) JP4299966B2 (fr)
CN (1) CN1125963C (fr)
CA (1) CA2303979A1 (fr)
WO (1) WO1999015845A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322633B1 (en) 1999-07-28 2001-11-27 Semitool, Inc. Wafer container cleaning system
US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
US6372700B1 (en) 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
US20060035475A1 (en) * 2004-08-12 2006-02-16 Applied Materials, Inc. Semiconductor substrate processing apparatus
EP2160456A1 (fr) * 2007-06-07 2010-03-10 L'air Liquide-societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Solvants ininflammables pour des applications de semi-conducteurs
US20110139183A1 (en) * 2009-12-11 2011-06-16 Katrina Mikhaylichenko System and method of preventing pattern collapse using low surface tension fluid
CN102425922B (zh) * 2011-11-22 2015-04-08 洛阳伟信电子科技有限公司 一种高洁净度电镀板烘干装置
JP6005702B2 (ja) * 2014-09-18 2016-10-12 株式会社東芝 半導体基板の超臨界乾燥方法および基板処理装置
CN112992740A (zh) * 2021-03-01 2021-06-18 李军平 一种切割晶圆用的清洗设备
CN113369237A (zh) * 2021-06-04 2021-09-10 深圳市创裕达电子有限公司 一种液晶显示屏内部电器元件智能清灰装置
WO2025084192A1 (fr) * 2023-10-16 2025-04-24 セントラル硝子株式会社 Liquide de nettoyage pour éliminer des particules, et procédé de nettoyage

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553607B2 (fr) * 1973-01-05 1980-01-25
US5226242A (en) * 1992-02-18 1993-07-13 Santa Clara Plastics, Division Of Preco, Inc. Vapor jet dryer apparatus and method
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid

Also Published As

Publication number Publication date
WO1999015845A1 (fr) 1999-04-01
CN1125963C (zh) 2003-10-29
EP1025409A1 (fr) 2000-08-09
CN1284159A (zh) 2001-02-14
JP4299966B2 (ja) 2009-07-22
JP2001517864A (ja) 2001-10-09

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Legal Events

Date Code Title Description
FZDE Discontinued