CA2305069A1 - Element micro-usine et methode de fabrication connexe - Google Patents

Element micro-usine et methode de fabrication connexe Download PDF

Info

Publication number: CA2305069A1
Authority: CA; Canada
Prior art keywords: cantilever; layer; element according; substrate; micromachined element
Prior art date: 2000-04-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

CA 2305069

Other languages

English (en)

Inventor

Yanwei Zhang

Robert B. Marcus

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

New Jersey Institute of Technology

Original Assignee

New Jersey Institute of Technology

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-04-12

Filing date

2000-04-12

Publication date

2001-10-12

2000-04-12 Application filed by New Jersey Institute of Technology filed Critical New Jersey Institute of Technology

2000-04-12 Priority to CA 2305069 priority Critical patent/CA2305069A1/fr

2001-10-12 Publication of CA2305069A1 publication Critical patent/CA2305069A1/fr

Status Abandoned legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title claims abstract description 11
239000000758 substrate Substances 0.000 claims abstract description 61
238000000151 deposition Methods 0.000 claims abstract description 25
230000005291 magnetic effect Effects 0.000 claims abstract description 13
238000005452 bending Methods 0.000 claims abstract description 10
229910052751 metal Inorganic materials 0.000 claims description 31
239000002184 metal Substances 0.000 claims description 31
238000010438 heat treatment Methods 0.000 claims description 28
239000000463 material Substances 0.000 claims description 24
238000000034 method Methods 0.000 claims description 22
229910052710 silicon Inorganic materials 0.000 claims description 15
239000010703 silicon Substances 0.000 claims description 15
238000000059 patterning Methods 0.000 claims description 10
239000004020 conductor Substances 0.000 claims description 4
230000005672 electromagnetic field Effects 0.000 claims description 4
230000007423 decrease Effects 0.000 claims description 3
238000009713 electroplating Methods 0.000 claims description 3
239000000523 sample Substances 0.000 description 68
235000012431 wafers Nutrition 0.000 description 30
238000012360 testing method Methods 0.000 description 29
239000012528 membrane Substances 0.000 description 24
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
238000005516 engineering process Methods 0.000 description 13
239000002243 precursor Substances 0.000 description 13
238000000429 assembly Methods 0.000 description 9
230000000712 assembly Effects 0.000 description 9
239000010949 copper Substances 0.000 description 8
239000004065 semiconductor Substances 0.000 description 8
230000015572 biosynthetic process Effects 0.000 description 7
238000006073 displacement reaction Methods 0.000 description 7
230000001965 increasing effect Effects 0.000 description 7
238000003491 array Methods 0.000 description 6
239000010408 film Substances 0.000 description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
230000006835 compression Effects 0.000 description 5
238000007906 compression Methods 0.000 description 5
229910052802 copper Inorganic materials 0.000 description 5
230000004044 response Effects 0.000 description 5
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
229910052737 gold Inorganic materials 0.000 description 4
239000010931 gold Substances 0.000 description 4
239000010409 thin film Substances 0.000 description 4
239000004642 Polyimide Substances 0.000 description 3
230000005540 biological transmission Effects 0.000 description 3
230000000694 effects Effects 0.000 description 3
230000006870 function Effects 0.000 description 3
239000004033 plastic Substances 0.000 description 3
229920001721 polyimide Polymers 0.000 description 3
229910000679 solder Inorganic materials 0.000 description 3
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
229910052721 tungsten Inorganic materials 0.000 description 3
239000010937 tungsten Substances 0.000 description 3
229910000881 Cu alloy Inorganic materials 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
230000008901 benefit Effects 0.000 description 2
238000004364 calculation method Methods 0.000 description 2
239000003990 capacitor Substances 0.000 description 2
230000008859 change Effects 0.000 description 2
238000010276 construction Methods 0.000 description 2
230000008021 deposition Effects 0.000 description 2
238000001035 drying Methods 0.000 description 2
238000005530 etching Methods 0.000 description 2
230000015654 memory Effects 0.000 description 2
238000001465 metallisation Methods 0.000 description 2
238000005459 micromachining Methods 0.000 description 2
238000000206 photolithography Methods 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
JIJQKFPGBBEJNF-KBPBESRZSA-N Curlone Natural products CC(C)=CC(=O)C[C@H](C)[C@@H]1CCC(=C)C=C1 JIJQKFPGBBEJNF-KBPBESRZSA-N 0.000 description 1
XOCANRBEOZQNAQ-KBPBESRZSA-N alpha-turmerone Natural products O=C(/C=C(\C)/C)C[C@H](C)[C@H]1C=CC(C)=CC1 XOCANRBEOZQNAQ-KBPBESRZSA-N 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
238000012512 characterization method Methods 0.000 description 1
239000002131 composite material Substances 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
JIJQKFPGBBEJNF-UHFFFAOYSA-N curlone Chemical compound CC(C)=CC(=O)CC(C)C1CCC(=C)C=C1 JIJQKFPGBBEJNF-UHFFFAOYSA-N 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
238000004090 dissolution Methods 0.000 description 1
230000005489 elastic deformation Effects 0.000 description 1
239000002659 electrodeposit Substances 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
230000001939 inductive effect Effects 0.000 description 1
239000012212 insulator Substances 0.000 description 1
238000001459 lithography Methods 0.000 description 1
230000007246 mechanism Effects 0.000 description 1
239000000203 mixture Substances 0.000 description 1
229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
229920005591 polysilicon Polymers 0.000 description 1
230000008569 process Effects 0.000 description 1
239000000047 product Substances 0.000 description 1
230000009467 reduction Effects 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
239000013589 supplement Substances 0.000 description 1
238000010998 test method Methods 0.000 description 1

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0024—Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0118—Cantilevers

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Analytical Chemistry (AREA)
Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Measuring Leads Or Probes (AREA)
Micromachines (AREA)

CA 2305069 2000-04-12 2000-04-12 Element micro-usine et methode de fabrication connexe Abandoned CA2305069A1 (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA 2305069 CA2305069A1 (fr)	2000-04-12	2000-04-12	Element micro-usine et methode de fabrication connexe

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA 2305069 CA2305069A1 (fr)	2000-04-12	2000-04-12	Element micro-usine et methode de fabrication connexe

Publications (1)

Publication Number	Publication Date
CA2305069A1 true CA2305069A1 (fr)	2001-10-12

Family

ID=4165874

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA 2305069 Abandoned CA2305069A1 (fr)	2000-04-12	2000-04-12	Element micro-usine et methode de fabrication connexe

Country Status (1)

Country	Link
CA (1)	CA2305069A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2004109794A3 (fr) *	2003-06-06	2005-04-28	Northrop Grumman Corp	Dispositif a circuit bobine et son procede de fabrication
US7667283B1 (en)	2003-06-06	2010-02-23	Northrop Grumman Systems Corporation	Coiled circuit camera
US7795647B2 (en)	2003-06-06	2010-09-14	Northrop Grumman Systems Corporation	Curled semiconductor transistor
US7868358B2 (en)	2003-06-06	2011-01-11	Northrop Grumman Systems Corporation	Coiled circuit device with active circuitry and methods for making the same
JP2018501666A (ja) *	2014-11-24	2018-01-18	ライプニッツ−インスティトゥートフュアフェストケルパー− ウントヴェルクシュトフフォルシュングドレスデンエーファオＬｅｉｂｎｉｚ−ＩｎｓｔｉｔｕｔｆｕｅｒＦｅｓｔｋｏｅｒｐｅｒ− ｕｎｄＷｅｒｋｓｔｏｆｆｆｏｒｓｃｈｕｎｇＤｒｅｓｄｅｎｅ．Ｖ．	巻回型の電気構成素子または電子構成素子の製造方法
US11944411B2 (en) *	2018-11-30	2024-04-02	Lifeware Labs, LLC	Wearable device with mechanical spring to detect pulse transit time

2000
- 2000-04-12 CA CA 2305069 patent/CA2305069A1/fr not_active Abandoned

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2004109794A3 (fr) *	2003-06-06	2005-04-28	Northrop Grumman Corp	Dispositif a circuit bobine et son procede de fabrication
US7488994B2 (en)	2003-06-06	2009-02-10	Northrop Grumman Corporation	Coiled circuit device and method of making the same
US7667283B1 (en)	2003-06-06	2010-02-23	Northrop Grumman Systems Corporation	Coiled circuit camera
US7795647B2 (en)	2003-06-06	2010-09-14	Northrop Grumman Systems Corporation	Curled semiconductor transistor
US7868358B2 (en)	2003-06-06	2011-01-11	Northrop Grumman Systems Corporation	Coiled circuit device with active circuitry and methods for making the same
JP2018501666A (ja) *	2014-11-24	2018-01-18	ライプニッツ−インスティトゥートフュアフェストケルパー− ウントヴェルクシュトフフォルシュングドレスデンエーファオＬｅｉｂｎｉｚ−ＩｎｓｔｉｔｕｔｆｕｅｒＦｅｓｔｋｏｅｒｐｅｒ− ｕｎｄＷｅｒｋｓｔｏｆｆｆｏｒｓｃｈｕｎｇＤｒｅｓｄｅｎｅ．Ｖ．	巻回型の電気構成素子または電子構成素子の製造方法
US11944411B2 (en) *	2018-11-30	2024-04-02	Lifeware Labs, LLC	Wearable device with mechanical spring to detect pulse transit time

Legal Events

Date	Code	Title	Description
2005-04-12	FZDE	Dead

Publication	Publication Date	Title
US6245444B1 (en)	2001-06-12	Micromachined element and method of fabrication thereof
US8638113B2 (en)	2014-01-28	Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US6956389B1 (en)	2005-10-18	Highly resilient cantilever spring probe for testing ICs
US6640432B1 (en)	2003-11-04	Method of fabricating shaped springs
CN100585411C (zh)	2010-01-27	制造微电子弹簧触点阵列的方法
JP2004186670A (ja)	2004-07-02	リソグラフィ接触要素
JP2001266983A (ja)	2001-09-28	半導体装置試験用コンタクタ及びその製造方法
TW200806995A (en)	2008-02-01	AC coupled parameteric test probe
CN101652901A (zh)	2010-02-17	碳纳米管接触结构
US8917106B2 (en)	2014-12-23	Fine pitch microelectronic contact array and method of making same
CA2305069A1 (fr)	2001-10-12	Element micro-usine et methode de fabrication connexe
EP1200992B1 (fr)	2008-10-29	Structure d'interconnexion elastique pour composants electroniques et son procede de fabrication
KR100835027B1 (ko)	2008-06-03	성형 스프링을 제조하는 방법
US8115504B2 (en)	2012-02-14	Microspring array having reduced pitch contact elements
Kataoka et al.	2004	Contact properties of Ni micro-springs for MEMS probe card
Marcus	2001	A new coiled microspring contact technology
JPH11504725A (ja)	1999-04-27	マイクロエレクトロニクスばね接触部品
Wang et al.	2008	A MEMS probe card with 2D dense-arrayed ‘hoe’-shaped metal tips
JP4188546B2 (ja)	2008-11-26	マイクロエレクトロニクスばね接触部品
KR100324064B1 (ko)	2002-06-22	초소형전자상호접속요소용접촉팁구조체와그제조방법
Spanier et al.	2007	Platform for temporary testing of hybrid microsystems at high frequencies
KR100312872B1 (ko)	2001-12-12	초소형전자스프링접촉요소
JP2007171138A (ja)	2007-07-05	プローブ、プローブカード、プローブの製造方法およびプローブ支持基板の製造方法
Tsou et al.	2006	Design and fabrication of Electroplating Nickel Micromachined Probe with out-of-plane predeformation