CA2326202C - Procede et appareil pour deposer des revetements a texture biaxiale - Google Patents

Procede et appareil pour deposer des revetements a texture biaxiale Download PDF

Info

Publication number
CA2326202C
CA2326202C CA002326202A CA2326202A CA2326202C CA 2326202 C CA2326202 C CA 2326202C CA 002326202 A CA002326202 A CA 002326202A CA 2326202 A CA2326202 A CA 2326202A CA 2326202 C CA2326202 C CA 2326202C
Authority
CA
Canada
Prior art keywords
substrate
flux
energetic particles
target
directed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002326202A
Other languages
English (en)
Other versions
CA2326202A1 (fr
Inventor
Roger De Gryse
Jurgen Denul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bekaert NV SA
Original Assignee
Bekaert NV SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert NV SA filed Critical Bekaert NV SA
Publication of CA2326202A1 publication Critical patent/CA2326202A1/fr
Application granted granted Critical
Publication of CA2326202C publication Critical patent/CA2326202C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/46—Sputtering by ion beam produced by an external ion source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

L'invention concerne un procédé et un appareil de dépôt permettant de fabriquer des revêtements à texture biaxiale, cette texture biaxiale étant induite par un bombardement de particules énergétiques au cours du dépôt, ce bombardement étant effectué sous un angle adéquat. Ce procédé de dépôt de revêtements à texture biaxiale sur un substrat (6) utilise un ou plusieurs dispositifs de pulvérisation à magnétron (1), qui produisent un flux de matière destiné à être déposé et un flux (5) de particules énergétiques, dans un sens et donc dans un angle d'incidence réglables sur ledit substrat (6). La source de pulvérisation à magnétron (1) produit un faisceau (5) de particules énergétiques avec la matière destinée à être déposée, cette source étant par ailleurs conçue pour orienter ledit faisceau (5) en direction d'un substrat (6), sous un angle calculé de sorte qu'un revêtement à texture biaxiale peut être déposé sur ce substrat (6).
CA002326202A 1998-03-31 1999-03-30 Procede et appareil pour deposer des revetements a texture biaxiale Expired - Fee Related CA2326202C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP98201006.8 1998-03-31
EP98201006 1998-03-31
PCT/EP1999/002168 WO1999050471A1 (fr) 1998-03-31 1999-03-30 Procede et appareil pour deposer des revetements a texture biaxiale

Publications (2)

Publication Number Publication Date
CA2326202A1 CA2326202A1 (fr) 1999-10-07
CA2326202C true CA2326202C (fr) 2008-06-17

Family

ID=8233538

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002326202A Expired - Fee Related CA2326202C (fr) 1998-03-31 1999-03-30 Procede et appareil pour deposer des revetements a texture biaxiale

Country Status (8)

Country Link
EP (1) EP1070154A1 (fr)
JP (1) JP2002509988A (fr)
KR (1) KR20010042128A (fr)
CN (1) CN1295628A (fr)
AU (1) AU746645C (fr)
CA (1) CA2326202C (fr)
RU (1) RU2224050C2 (fr)
WO (1) WO1999050471A1 (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352976B1 (ko) * 1999-12-24 2002-09-18 한국기계연구원 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및 그 제조방법
EA200601832A1 (ru) * 2006-08-16 2008-02-28 Владимир Яковлевич ШИРИПОВ Способ ионной обработки поверхности диэлектрика и устройство для осуществления способа
US9545360B2 (en) 2009-05-13 2017-01-17 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
MX345403B (es) 2009-05-13 2017-01-30 Sio2 Medical Products Inc Revestimiento por pecvd utilizando un precursor organosilícico.
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
KR101794586B1 (ko) 2011-05-23 2017-11-08 삼성디스플레이 주식회사 스퍼터링용 분할 타겟 장치 및 그것을 이용한 스퍼터링 방법
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
EP2776603B1 (fr) 2011-11-11 2019-03-06 SiO2 Medical Products, Inc. Revêtement de passivation, de protection de ph ou à pouvoir lubrifiant pour conditionnement pharmaceutique, processus et appareil de revêtement
US9554968B2 (en) 2013-03-11 2017-01-31 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging
RU2502151C1 (ru) * 2012-04-24 2013-12-20 Федеральное государственное бюджетное учреждение науки Институт общей физики им. А.М. Прохорова Российской академии наук (ИОФ РАН) Способ изготовления фотокатода и устройство для изготовления фотокатода
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
CA2890066C (fr) 2012-11-01 2021-11-09 Sio2 Medical Products, Inc. Procedes d'inspection de revetement
US9903782B2 (en) 2012-11-16 2018-02-27 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
KR102211950B1 (ko) 2012-11-30 2021-02-04 에스아이오2 메디컬 프로덕츠, 인크. 의료용 주사기 카트리지 등의 pecvd 증착 균일성 제어
KR20150119188A (ko) 2013-02-15 2015-10-23 리젠츠 오브 더 유니버시티 오브 미네소타 입자 기능화
US20160015898A1 (en) 2013-03-01 2016-01-21 Sio2 Medical Products, Inc. Plasma or cvd pre-treatment for lubricated pharmaceutical package, coating process and apparatus
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
US9863042B2 (en) 2013-03-15 2018-01-09 Sio2 Medical Products, Inc. PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases
JP6530713B2 (ja) * 2013-09-04 2019-06-12 東洋鋼鈑株式会社 酸化物層の成膜方法、並びにエピタキシャル成長用積層基材及びその製造方法
US11066745B2 (en) 2014-03-28 2021-07-20 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
KR102140210B1 (ko) * 2014-06-23 2020-07-31 어플라이드 머티어리얼스, 인코포레이티드 층을 증착하는 방법, 트랜지스터를 제조하는 방법, 전자 디바이스에 대한 층 스택, 및 전자 디바이스
CN104109841B (zh) * 2014-07-23 2016-08-24 中国科学院上海光学精密机械研究所 磁控溅射倾斜沉积镀膜装置
CN104593742B (zh) * 2015-01-20 2017-02-22 清华大学深圳研究生院 一种制备具有双轴织构的氧化物薄膜的设备和方法
CN108138316A (zh) 2015-08-18 2018-06-08 Sio2医药产品公司 具有低氧气传输速率的药物和其他包装
RU2620534C2 (ru) * 2015-09-08 2017-05-26 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Казанский (Приволжский) федеральный университет" (ФГАОУВПО КФУ) Способ нанесения покрытий и устройство для его осуществления
CN113808935B (zh) * 2020-06-16 2023-12-15 中微半导体设备(上海)股份有限公司 耐腐蚀涂层形成方法和装置、等离子体零部件和反应装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1665717A1 (ru) * 1989-07-21 1995-02-09 Московский институт электронной техники Магнетронное распылительное устройство с термоэлектронным ионизатором
SU1697453A1 (ru) * 1989-09-19 1995-11-20 Киевский политехнический институт Устройство для ионно-плазменного распыления материалов в вакууме
RU2032766C1 (ru) * 1992-04-28 1995-04-10 Санкт-Петербургский государственный электротехнический университет им.В.И.Ульянова (Ленина) Магнетронное распылительное устройство
DE4333022A1 (de) * 1993-09-29 1995-03-30 Ronald Dipl Phys Gottzein Verfahren zur Herstellung bitexturierter Dünnfilme auf amorphen oder beliebig strukturierten Substraten
DE4436285C2 (de) * 1994-10-11 2002-01-10 Univ Stuttgart Verfahren und Vorrichtung zum Aufbringen von Orientierungsschichten auf ein Substrat zum Ausrichten von Flüssigkristallmolekülen
DE19641584C1 (de) * 1996-09-30 1998-01-08 Siemens Ag Anordnung und Verfahren zum Aufbringen einer dünnen Schicht auf ein Substrat

Also Published As

Publication number Publication date
AU3418899A (en) 1999-10-18
RU2224050C2 (ru) 2004-02-20
CN1295628A (zh) 2001-05-16
CA2326202A1 (fr) 1999-10-07
AU746645C (en) 2003-02-20
WO1999050471A1 (fr) 1999-10-07
KR20010042128A (ko) 2001-05-25
JP2002509988A (ja) 2002-04-02
EP1070154A1 (fr) 2001-01-24
AU746645B2 (en) 2002-05-02

Similar Documents

Publication Publication Date Title
AU746645C (en) Method and apparatus for deposition of biaxially textured coatings
US5234560A (en) Method and device for sputtering of films
KR100396456B1 (ko) 절단된 코니칼 스퍼터링 타겟용 고 타겟 이용 자기 장치
EP0328076B1 (fr) Appareil pour former des films minces et source d'ions utilisant la pulvérisation par plasma micro-onde
US7327089B2 (en) Beam plasma source
US7932678B2 (en) Magnetic mirror plasma source and method using same
US4885070A (en) Method and apparatus for the application of materials
US7578908B2 (en) Sputter coating system
EP0413291B1 (fr) Procédé et dispositif de deposition de films par pulvérisation cathodique
US6143124A (en) Apparatus and method for generating a plasma from an electromagnetic field having a lissajous pattern
US5378341A (en) Conical magnetron sputter source
US20090020415A1 (en) "Iontron" ion beam deposition source and a method for sputter deposition of different layers using this source
US6432286B1 (en) Conical sputtering target
WO2005091329A2 (fr) Dispositif de pulverisation cathodique pour realiser des films minces
Golan et al. Ring etching zones on magnetron sputtering targets
JPS63307272A (ja) イオンビ−ムスパツタ装置
MXPA00009560A (en) Method and apparatus for deposition of biaxially textured coatings
JPH06116724A (ja) 薄膜形成装置
Hoshi et al. High‐rate, low‐temperature sputtering method of facing‐targets type and its application for deposition of magnetic films
Shibata et al. Application of sheet shaped plasma supplemented with radio frequency plasma source for production of thin films
JPH0273966A (ja) スパッタリングによる多成分系薄膜作成方法
JPH1150245A (ja) スパッタ成膜装置およびスパッタリングターゲット
JPS62280357A (ja) 電子ビ−ム蒸発イオンプレ−テイングとその装置
JPH02194174A (ja) スパッタリング装置
JPH04183854A (ja) 薄膜形成装置

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed