CA2363386A1 - Microcommutateur bistable et son procede de fabrication - Google Patents
Microcommutateur bistable et son procede de fabrication Download PDFInfo
- Publication number
- CA2363386A1 CA2363386A1 CA002363386A CA2363386A CA2363386A1 CA 2363386 A1 CA2363386 A1 CA 2363386A1 CA 002363386 A CA002363386 A CA 002363386A CA 2363386 A CA2363386 A CA 2363386A CA 2363386 A1 CA2363386 A1 CA 2363386A1
- Authority
- CA
- Canada
- Prior art keywords
- flexible sheet
- power source
- contact
- substrate
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 47
- 230000009975 flexible effect Effects 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 7
- 238000002788 crimping Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- -1 lock-on-chip tape Substances 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- 239000003353 gold alloy Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 44
- 230000009466 transformation Effects 0.000 description 11
- 230000000087 stabilizing effect Effects 0.000 description 9
- 239000000956 alloy Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000005459 micromachining Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- HLXZNVUGXRDIFK-UHFFFAOYSA-N nickel titanium Chemical group [Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni] HLXZNVUGXRDIFK-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H61/01—Details
- H01H61/0107—Details making use of shape memory materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H2061/006—Micromechanical thermal relay
Landscapes
- Micromachines (AREA)
- Thermally Actuated Switches (AREA)
- Semiconductor Memories (AREA)
Abstract
L'invention concerne un commutateur bistable utilisant un alliage à mémoire de forme et son procédé de fabrication. L'invention concerne plus particulièrement un commutateur bistable comprenant un substrat ayant au moins une alimentation ; une feuille souple dont une première extrémité distale est fixée au substrat ; un montage en pont formé au niveau d'une seconde extrémité distale opposée de la feuille souple et au moins un élément thermoactivé connecté à une première surface de la feuille souple et venant entre la seconde extrémité distale et l'alimentation. En cours d'opération, le courant provenant de l'alimentation circulant à travers l'élément thermoactivé fléchit indirectement la feuille souple et raccourcit les signaux entrant en contact sur le substrat sous l'effet d'une force renouvelable.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1999/006450 WO2000058980A1 (fr) | 1999-03-26 | 1999-03-26 | Microcommutateur bistable et son procede de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2363386A1 true CA2363386A1 (fr) | 2000-10-05 |
Family
ID=22272430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002363386A Abandoned CA2363386A1 (fr) | 1999-03-26 | 1999-03-26 | Microcommutateur bistable et son procede de fabrication |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1166298A1 (fr) |
| KR (1) | KR20020018655A (fr) |
| CN (1) | CN1348597A (fr) |
| AU (1) | AU3114299A (fr) |
| BR (1) | BR9917232A (fr) |
| CA (1) | CA2363386A1 (fr) |
| WO (1) | WO2000058980A1 (fr) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004001781A1 (fr) * | 2002-06-25 | 2003-12-31 | Gerard Industries Pty Ltd | Commutateur electrique perfectionne |
| US8319596B2 (en) * | 2009-05-20 | 2012-11-27 | GM Global Technology Operations LLC | Active material circuit protector |
| US11105319B2 (en) | 2017-05-05 | 2021-08-31 | Hutchinson Technology Incorporated | Shape memory alloy actuators and methods thereof |
| US11333134B2 (en) | 2017-05-05 | 2022-05-17 | Hutchinson Technology Incorporated | Shape memory alloy actuators and methods thereof |
| US11448853B2 (en) | 2017-05-05 | 2022-09-20 | Hutchinson Technology Incorporated | Shape memory alloy actuators and methods thereof |
| US11815794B2 (en) | 2017-05-05 | 2023-11-14 | Hutchinson Technology Incorporated | Shape memory alloy actuators and methods thereof |
| US11306706B2 (en) | 2017-05-05 | 2022-04-19 | Hutchinson Technology Incorporated | Shape memory alloy actuators and methods thereof |
| CN110709757B (zh) * | 2017-05-05 | 2022-11-22 | 哈钦森技术股份有限公司 | 形状记忆合金致动器及其方法 |
| GB2602950B (en) | 2017-05-05 | 2022-10-26 | Hutchinson Technology | Shape memory alloy actuators and methods thereof |
| US11859598B2 (en) | 2021-06-10 | 2024-01-02 | Hutchinson Technology Incorporated | Shape memory alloy actuators and methods thereof |
| WO2023136306A1 (fr) * | 2022-01-17 | 2023-07-20 | アルプスアルパイン株式会社 | Dispositif d'imagerie, module de caméra et procédé de commande pour dispositif d'imagerie |
| US12510061B2 (en) | 2023-04-12 | 2025-12-30 | Hutchinson Technology Incorporated | Shape memory alloy (SMA) bimorph actuators and methods for manufacturing the same |
| US11982263B1 (en) | 2023-05-02 | 2024-05-14 | Hutchinson Technology Incorporated | Shape metal alloy (SMA) bimorph actuators with reduced wire exit angle |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3893055A (en) * | 1973-04-16 | 1975-07-01 | Texas Instruments Inc | High gain relays and systems |
| US4570139A (en) * | 1984-12-14 | 1986-02-11 | Eaton Corporation | Thin-film magnetically operated micromechanical electric switching device |
| DE4205029C1 (en) * | 1992-02-19 | 1993-02-11 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate |
| US5619177A (en) * | 1995-01-27 | 1997-04-08 | Mjb Company | Shape memory alloy microactuator having an electrostatic force and heating means |
| US5825275A (en) * | 1995-10-27 | 1998-10-20 | University Of Maryland | Composite shape memory micro actuator |
| US6407482B2 (en) * | 1996-08-27 | 2002-06-18 | Omron Corporation | Micro-relay and method for manufacturing the same |
| US5796152A (en) * | 1997-01-24 | 1998-08-18 | Roxburgh Ltd. | Cantilevered microstructure |
-
1999
- 1999-03-26 CN CN99816529A patent/CN1348597A/zh active Pending
- 1999-03-26 CA CA002363386A patent/CA2363386A1/fr not_active Abandoned
- 1999-03-26 BR BR9917232-1A patent/BR9917232A/pt not_active IP Right Cessation
- 1999-03-26 AU AU31142/99A patent/AU3114299A/en not_active Abandoned
- 1999-03-26 EP EP99912877A patent/EP1166298A1/fr not_active Withdrawn
- 1999-03-26 KR KR1020017012183A patent/KR20020018655A/ko not_active Withdrawn
- 1999-03-26 WO PCT/US1999/006450 patent/WO2000058980A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN1348597A (zh) | 2002-05-08 |
| AU3114299A (en) | 2000-10-16 |
| EP1166298A1 (fr) | 2002-01-02 |
| BR9917232A (pt) | 2002-02-19 |
| WO2000058980A1 (fr) | 2000-10-05 |
| KR20020018655A (ko) | 2002-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |