CA2375897C - Methode d'ejection de liquide et appareil correspondant - Google Patents

Methode d'ejection de liquide et appareil correspondant Download PDF

Info

Publication number: CA2375897C
Authority: CA; Canada
Prior art keywords: liquid; bubble; flow path; separation film; movable separation
Prior art date: 1996-06-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CA002375897A

Other languages

English (en)

Other versions

CA2375897A1 (fr

Inventor

Toshio Kashino

Hiroyuki Ishinaga

Aya Yoshihira

Kiyomitsu Kudo

Yoshie Asakawa

Yoichi Taneya

Hiroyuki Sugiyama

Satoshi Shimazu

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Canon Inc

Original Assignee

Canon Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-06-07

Filing date

1997-06-06

Publication date

2003-09-16

1997-06-02 Priority claimed from JP14401397A external-priority patent/JP3542460B2/ja

1997-06-06 Application filed by Canon Inc filed Critical Canon Inc

1997-12-07 Publication of CA2375897A1 publication Critical patent/CA2375897A1/fr

2003-09-16 Application granted granted Critical

2003-09-16 Publication of CA2375897C publication Critical patent/CA2375897C/fr

2017-06-06 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

239000007788 liquid Substances 0.000 title claims abstract description 980
238000000034 method Methods 0.000 title claims abstract description 97
238000000926 separation method Methods 0.000 claims abstract description 424
238000007599 discharging Methods 0.000 claims abstract description 29
239000010408 film Substances 0.000 claims description 505
238000006073 displacement reaction Methods 0.000 claims description 77
239000010409 thin film Substances 0.000 claims description 13
238000011144 upstream manufacturing Methods 0.000 abstract description 118
238000004891 communication Methods 0.000 abstract description 24
239000000758 substrate Substances 0.000 description 67
230000001105 regulatory effect Effects 0.000 description 46
239000000463 material Substances 0.000 description 32
230000008569 process Effects 0.000 description 25
238000009835 boiling Methods 0.000 description 24
230000004048 modification Effects 0.000 description 23
238000012986 modification Methods 0.000 description 23
230000007423 decrease Effects 0.000 description 22
239000011347 resin Substances 0.000 description 20
229920005989 resin Polymers 0.000 description 20
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
238000010438 heat treatment Methods 0.000 description 16
238000004519 manufacturing process Methods 0.000 description 15
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
229920001721 polyimide Polymers 0.000 description 14
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
230000008602 contraction Effects 0.000 description 13
239000010703 silicon Substances 0.000 description 13
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230000003247 decreasing effect Effects 0.000 description 12
239000009719 polyimide resin Substances 0.000 description 12
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
-1 iridium-tantalum-aluminum Chemical compound 0.000 description 10
229910052782 aluminium Inorganic materials 0.000 description 9
230000000694 effects Effects 0.000 description 9
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239000006185 dispersion Substances 0.000 description 8
238000011049 filling Methods 0.000 description 8
230000033001 locomotion Effects 0.000 description 8
229910052759 nickel Inorganic materials 0.000 description 8
238000004528 spin coating Methods 0.000 description 8
230000004044 response Effects 0.000 description 7
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
239000003795 chemical substances by application Substances 0.000 description 6
229910052751 metal Inorganic materials 0.000 description 6
239000002184 metal Substances 0.000 description 6
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
238000009826 distribution Methods 0.000 description 5
235000019441 ethanol Nutrition 0.000 description 5
OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
150000001875 compounds Chemical class 0.000 description 4
230000020169 heat generation Effects 0.000 description 4
238000005304 joining Methods 0.000 description 4
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GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
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239000004952 Polyamide Substances 0.000 description 3
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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239000002904 solvent Substances 0.000 description 3
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239000008096 xylene Substances 0.000 description 3
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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239000004696 Poly ether ether ketone Substances 0.000 description 2
229930182556 Polyacetal Natural products 0.000 description 2
239000004698 Polyethylene Substances 0.000 description 2
239000004642 Polyimide Substances 0.000 description 2
239000004743 Polypropylene Substances 0.000 description 2
229910052581 Si3N4 Inorganic materials 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
LRTTZMZPZHBOPO-UHFFFAOYSA-N [B].[B].[Hf] Chemical compound [B].[B].[Hf] LRTTZMZPZHBOPO-UHFFFAOYSA-N 0.000 description 2
125000003172 aldehyde group Chemical group 0.000 description 2
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
230000008901 benefit Effects 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
239000000470 constituent Substances 0.000 description 2
238000000151 deposition Methods 0.000 description 2
238000011161 development Methods 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000005323 electroforming Methods 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
229910052760 oxygen Inorganic materials 0.000 description 2
239000001301 oxygen Substances 0.000 description 2
239000005022 packaging material Substances 0.000 description 2
238000005192 partition Methods 0.000 description 2
239000005011 phenolic resin Substances 0.000 description 2
229920001568 phenolic resin Polymers 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
229920002492 poly(sulfone) Polymers 0.000 description 2
229920002530 polyetherether ketone Polymers 0.000 description 2
229920000573 polyethylene Polymers 0.000 description 2
229920006324 polyoxymethylene Polymers 0.000 description 2
229920001155 polypropylene Polymers 0.000 description 2
BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
238000001454 recorded image Methods 0.000 description 2
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239000004065 semiconductor Substances 0.000 description 2
239000000377 silicon dioxide Substances 0.000 description 2
235000012239 silicon dioxide Nutrition 0.000 description 2
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
229910052814 silicon oxide Inorganic materials 0.000 description 2
229910001220 stainless steel Inorganic materials 0.000 description 2
239000010935 stainless steel Substances 0.000 description 2
230000008961 swelling Effects 0.000 description 2
MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
229910052719 titanium Inorganic materials 0.000 description 2
239000010936 titanium Substances 0.000 description 2
OIICUUGPVAEJSH-UHFFFAOYSA-M (2-bromophenyl)methyl-ethyl-dimethylazanium;bromide Chemical compound [Br-].CC[N+](C)(C)CC1=CC=CC=C1Br OIICUUGPVAEJSH-UHFFFAOYSA-M 0.000 description 1
AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
229910000906 Bronze Inorganic materials 0.000 description 1
XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
229920000106 Liquid crystal polymer Polymers 0.000 description 1
239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
239000005062 Polybutadiene Substances 0.000 description 1
239000004695 Polyether sulfone Substances 0.000 description 1
239000002202 Polyethylene glycol Substances 0.000 description 1
XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
241001147388 Uncia Species 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
238000009825 accumulation Methods 0.000 description 1
KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
125000000217 alkyl group Chemical group 0.000 description 1
RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 1
239000012296 anti-solvent Substances 0.000 description 1
238000004380 ashing Methods 0.000 description 1
239000010974 bronze Substances 0.000 description 1
239000006229 carbon black Substances 0.000 description 1
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
230000000593 degrading effect Effects 0.000 description 1
230000000994 depressogenic effect Effects 0.000 description 1
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229910003460 diamond Inorganic materials 0.000 description 1
239000010432 diamond Substances 0.000 description 1
230000008034 disappearance Effects 0.000 description 1
239000000428 dust Substances 0.000 description 1
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125000003700 epoxy group Chemical group 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
238000009472 formulation Methods 0.000 description 1
235000011187 glycerol Nutrition 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
125000005462 imide group Chemical group 0.000 description 1
238000009413 insulation Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
125000000468 ketone group Chemical group 0.000 description 1
238000010030 laminating Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
230000007774 longterm Effects 0.000 description 1
239000011159 matrix material Substances 0.000 description 1
239000007769 metal material Substances 0.000 description 1
125000005245 nitryl group Chemical group [N+](=O)([O-])* 0.000 description 1
238000005457 optimization Methods 0.000 description 1
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230000000149 penetrating effect Effects 0.000 description 1
239000002304 perfume Substances 0.000 description 1
239000000825 pharmaceutical preparation Substances 0.000 description 1
229940127557 pharmaceutical product Drugs 0.000 description 1
239000000049 pigment Substances 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
229920002857 polybutadiene Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920006393 polyether sulfone Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
229940113115 polyethylene glycol 200 Drugs 0.000 description 1
229940057847 polyethylene glycol 600 Drugs 0.000 description 1
229920000139 polyethylene terephthalate Polymers 0.000 description 1
239000005020 polyethylene terephthalate Substances 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000000565 sealant Substances 0.000 description 1
230000035939 shock Effects 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
238000000638 solvent extraction Methods 0.000 description 1
230000006641 stabilisation Effects 0.000 description 1
238000011105 stabilization Methods 0.000 description 1
238000003860 storage Methods 0.000 description 1
125000001174 sulfone group Chemical group 0.000 description 1
239000004753 textile Substances 0.000 description 1
YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
229950006389 thiodiglycol Drugs 0.000 description 1
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
229910052721 tungsten Inorganic materials 0.000 description 1
239000010937 tungsten Substances 0.000 description 1
238000009834 vaporization Methods 0.000 description 1
230000008016 vaporization Effects 0.000 description 1

Landscapes

Ink Jet (AREA)
Separation Using Semi-Permeable Membranes (AREA)

CA002375897A 1996-06-07 1997-06-06 Methode d'ejection de liquide et appareil correspondant Expired - Fee Related CA2375897C (fr)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
JP14568396		1996-06-07
JP8-145683		1996-06-07
JP14401397A JP3542460B2 (ja)	1996-06-07	1997-06-02	液体吐出方法及び液体吐出装置
JP9-144013		1997-06-02
CA002207206A CA2207206C (fr)	1996-06-07	1997-06-06	Methode d'ejection de liquide et appareil correspondant

Related Parent Applications (1)

Application Number	Title	Priority Date	Filing Date
CA002207206A Division CA2207206C (fr)	1996-06-07	1997-06-06	Methode d'ejection de liquide et appareil correspondant

Publications (2)

Publication Number	Publication Date
CA2375897A1 CA2375897A1 (fr)	1997-12-07
CA2375897C true CA2375897C (fr)	2003-09-16

Family

ID=27170398

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA002375897A Expired - Fee Related CA2375897C (fr)	1996-06-07	1997-06-06	Methode d'ejection de liquide et appareil correspondant

Country Status (1)

Country	Link
CA (1)	CA2375897C (fr)

1997
- 1997-06-06 CA CA002375897A patent/CA2375897C/fr not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CA2375897A1 (fr)	1997-12-07

Legal Events

Date	Code	Title	Description
2002-03-20	EEER	Examination request
2008-06-06	MKLA	Lapsed

Publication	Publication Date	Title
US5943074A (en)	1999-08-24	Liquid discharge method and liquid discharge apparatus
JPH1024582A (ja)	1998-01-27	液体吐出ヘッド並びに該液体吐出ヘッドの回復方法及び製造方法、並びに該液体吐出ヘッドを用いた液体吐出装置
KR100234800B1 (ko)	1999-12-15	액체 토출 헤드, 액체 토출 장치 및 액체 토출 방법
AU710549B2 (en)	1999-09-23	Liquid ejecting method, liquid ejecting head, head cartridge and liquid ejecting apparatus using same
CA2275113C (fr)	2004-11-02	Tete et appareil de rejet de liquides
EP0882890B1 (fr)	2004-08-25	Procédé et dispositif de transport de liquide, procédé de décharge de liquide et tête de décharge de liquide utilisant un tel procédé et un tel dispositif de transport de liquide
JP3408060B2 (ja)	2003-05-19	液体吐出方法および装置とこれらに用いられる液体吐出ヘッド
JP3416465B2 (ja)	2003-06-16	液体吐出方法及び液体吐出ヘッド
JP3342279B2 (ja)	2002-11-05	液体吐出方法、液体吐出ヘッドおよび該液体吐出ヘッドの製造方法
CA2210377C (fr)	2002-07-30	Tete de distribution de liquide, cartouche, appareil de distribution de liquide, systeme d'enregistrement, et procede de fabrication d'une tete de distribution de liquide
KR100388180B1 (ko)	2003-06-19	액체 토출 헤드의 제조 방법
KR100350862B1 (ko)	2003-03-17	액체토출방법및액체토출헤드
CA2375897C (fr)	2003-09-16	Methode d'ejection de liquide et appareil correspondant
AU772797B2 (en)	2004-05-06	Liquid discharge method and liquid discharge apparatus
JPH1076682A (ja)	1998-03-24	液体吐出方法及び液体吐出ヘッド
JP3387735B2 (ja)	2003-03-17	液体吐出ヘッド、ヘッドカートリッジ及び液体吐出装置
JPH11348287A (ja)	1999-12-21	液体吐出ヘッド
JPH09323427A (ja)	1997-12-16	液体吐出ヘッドの製造方法および該製造方法により得られる液体吐出ヘッド
JPH09327919A (ja)	1997-12-22	液体吐出ヘッド、液体吐出装置、および記録方法
JPH04144752A (ja)	1992-05-19	インク飛翔記録装置