CA2387432C - Procede et dispositif d'attaque et de depot au moyen de micro-plasmas - Google Patents

Procede et dispositif d'attaque et de depot au moyen de micro-plasmas Download PDF

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Publication number
CA2387432C
CA2387432C CA2387432A CA2387432A CA2387432C CA 2387432 C CA2387432 C CA 2387432C CA 2387432 A CA2387432 A CA 2387432A CA 2387432 A CA2387432 A CA 2387432A CA 2387432 C CA2387432 C CA 2387432C
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CA
Canada
Prior art keywords
electrode
substrate
plasma
dielectric layer
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA2387432A
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English (en)
Other versions
CA2387432A1 (fr
Inventor
Yogesh B. Gianchandani
Chester G. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wisconsin Alumni Research Foundation
Original Assignee
Wisconsin Alumni Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wisconsin Alumni Research Foundation filed Critical Wisconsin Alumni Research Foundation
Publication of CA2387432A1 publication Critical patent/CA2387432A1/fr
Application granted granted Critical
Publication of CA2387432C publication Critical patent/CA2387432C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Cette invention concerne un procédé d'attaque et de dépôt plasmatiques sur des substrats au moyen de micro-plasmas localisés spatialement et agissant parallèlement les uns aux autres. Une électrode génératrice de plasma est disposée tout contre une surface exposée du substrat, comme sur la surface d'une couche diélectrique appliquée sur le substrat. On applique sous une pression déterminée du gaz dans la région de l'électrode et du substrat, ainsi qu'une tension entre l'électrode génératrice de plasma et le substrat ou une seconde électrode de manière à enflammer le plasma dans la région entre l'électrode génératrice de plasma et le substrat pendant un laps de temps déterminé. Ce plasma est limité à la région de ladite électrode qui se trouve contre la surface exposée de manière à ce que le substrat soit traité par plasma selon un motif déterminé.
CA2387432A 1999-10-12 2000-10-11 Procede et dispositif d'attaque et de depot au moyen de micro-plasmas Expired - Lifetime CA2387432C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15881799P 1999-10-12 1999-10-12
US60/158,817 1999-10-12
PCT/US2000/028083 WO2001027969A1 (fr) 1999-10-12 2000-10-11 Procede et dispositif d'attaque et de depot au moyen de micro-plasmas

Publications (2)

Publication Number Publication Date
CA2387432A1 CA2387432A1 (fr) 2001-04-19
CA2387432C true CA2387432C (fr) 2010-02-09

Family

ID=22569839

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2387432A Expired - Lifetime CA2387432C (fr) 1999-10-12 2000-10-11 Procede et dispositif d'attaque et de depot au moyen de micro-plasmas

Country Status (4)

Country Link
EP (1) EP1221174A1 (fr)
AU (1) AU1196001A (fr)
CA (1) CA2387432C (fr)
WO (1) WO2001027969A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE245310T1 (de) * 2000-03-14 2003-08-15 Fraunhofer Ges Forschung Verfahren und vorrichtung zur plasmagestützten oberflächenbehandlung und verwendung des verfahrens
DE10129313C1 (de) * 2001-06-19 2002-11-21 Fraunhofer Ges Forschung Sputterverfahren und Vorrichtung zur Beschichtung und/oder Oberflächenbehandlung von Substraten
EP1592052A4 (fr) * 2003-02-05 2014-04-23 Semiconductor Energy Lab Procede de fabrication d'un affichage
US7824520B2 (en) * 2003-03-26 2010-11-02 Semiconductor Energy Laboratory Co., Ltd. Plasma treatment apparatus
DE102005042754B4 (de) * 2005-09-08 2008-09-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur selektiven Plasmabehandlung von Substraten zur Vorbehandlung vor einem Beschichtungs- oder Bondprozess
US8609203B2 (en) 2008-06-06 2013-12-17 Fujifilm Manufacturing Europe B.V. Method and apparatus for plasma surface treatment of moving substrate
KR101594464B1 (ko) * 2013-10-02 2016-02-18 아주대학교산학협력단 마이크로 플라즈마 분사 소자, 적층형 마이크로 플라즈마 분사 모듈 및 마이크로 플라즈마 분사 소자의 제작 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302237A (en) * 1992-02-13 1994-04-12 The United States Of America As Represented By The Secretary Of Commerce Localized plasma processing
US5688415A (en) * 1995-05-30 1997-11-18 Ipec Precision, Inc. Localized plasma assisted chemical etching through a mask
DE19826418C2 (de) * 1998-06-16 2003-07-31 Horst Schmidt-Boecking Vorrichtung zur Erzeugung eines Plasma sowie ein Herstellungsverfahren für die Vorrichtung sowie Verwendung der Vorrichtung

Also Published As

Publication number Publication date
EP1221174A1 (fr) 2002-07-10
CA2387432A1 (fr) 2001-04-19
AU1196001A (en) 2001-04-23
WO2001027969A1 (fr) 2001-04-19

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