CA2474054A1 - Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication - Google Patents

Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication Download PDF

Info

Publication number
CA2474054A1
CA2474054A1 CA002474054A CA2474054A CA2474054A1 CA 2474054 A1 CA2474054 A1 CA 2474054A1 CA 002474054 A CA002474054 A CA 002474054A CA 2474054 A CA2474054 A CA 2474054A CA 2474054 A1 CA2474054 A1 CA 2474054A1
Authority
CA
Canada
Prior art keywords
conductive medium
integrated circuit
substrate
scale component
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002474054A
Other languages
English (en)
Inventor
Glenn W. Gengel
Mark A. Hadley
Randolph W. Eisenhardt
Susan Swindlehurst
Paul S Drzaic
Frederick J. Vicentini
John Moon Hemingway
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alien Technology LLC
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2474054A1 publication Critical patent/CA2474054A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07131—Means for applying material, e.g. for deposition or forming coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

La présente invention porte sur la fabrication d'éléments sur un substrat. Selon une forme d'exécution, l'invention est un appareil comprenant une barrette dans laquelle est encastrée un circuit intégré pourvu d'une plage conductrice. L'appareil comprend également un support conducteur relié à la plage conductrice du circuit intégré. L'invention porte également sur un procédé visant à fixer un support conducteur à une barrette dans laquelle est encastré un circuit intégré de sorte que le support conducteur soit connecté électriquement au circuit intégré. Le procédé consiste à fixer un composant de grande taille au support conducteur de sorte que ceux-ci soient connectés électriquement. Cet appareil comprend également une couche de diélectrique à film mince formée sur une partie du circuit intégré et sur une partie du substrat.
CA002474054A 2002-01-23 2003-01-23 Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication Abandoned CA2474054A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5619202A 2002-01-23 2002-01-23
US10/056,192 2002-01-23
PCT/US2003/002115 WO2003063211A1 (fr) 2002-01-23 2003-01-23 Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication

Publications (1)

Publication Number Publication Date
CA2474054A1 true CA2474054A1 (fr) 2003-07-31

Family

ID=27609271

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002474054A Abandoned CA2474054A1 (fr) 2002-01-23 2003-01-23 Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication

Country Status (7)

Country Link
EP (1) EP1468443A1 (fr)
JP (1) JP2006504251A (fr)
KR (1) KR20040105705A (fr)
CN (1) CN1606796A (fr)
AU (1) AU2003205307B2 (fr)
CA (1) CA2474054A1 (fr)
WO (1) WO2003063211A1 (fr)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7214569B2 (en) 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7230580B1 (en) * 2003-08-29 2007-06-12 National Semiconductor Corporation Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same
JP2008507114A (ja) 2004-04-27 2008-03-06 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ ソフトリソグラフィ用複合パターニングデバイス
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
EP2650907B1 (fr) 2004-06-04 2024-10-23 The Board Of Trustees Of The University Of Illinois Procedes et dispositifs permettant de fabriquer et d'assembler des elements a semiconducteur imprimables
US7615479B1 (en) 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7353598B2 (en) 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7385284B2 (en) 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US7576656B2 (en) 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding
EP2104954B1 (fr) 2007-01-17 2022-03-16 The Board of Trustees of the University of Illinois Systèmes optiques fabriqués par un ensemble à base d'impression
TWI723953B (zh) 2008-03-05 2021-04-11 美國伊利諾大學理事會 可延展且可折疊的電子裝置
US8946683B2 (en) 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9289132B2 (en) 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
KR101706915B1 (ko) 2009-05-12 2017-02-15 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리
WO2011041727A1 (fr) 2009-10-01 2011-04-07 Mc10, Inc. Boîtiers protecteurs avec des circuits électroniques intégrés
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
EP2513953B1 (fr) 2009-12-16 2017-10-18 The Board of Trustees of the University of Illionis Électrophysiologie faisant intervenir des équipements électroniques conformes
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
CN104224171B (zh) 2010-03-17 2017-06-09 伊利诺伊大学评议会 基于生物可吸收基质的可植入生物医学装置
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
WO2012158709A1 (fr) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Barrettes de del à gestion thermique assemblées par impression
WO2012166686A2 (fr) 2011-05-27 2012-12-06 Mc10, Inc. Appareil électronique, optique et/ou mécanique et systèmes et procédés pour le fabriquer
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9691873B2 (en) 2011-12-01 2017-06-27 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
JP2015521303A (ja) 2012-03-30 2015-07-27 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシ 表面への形状適合可能な付属物装着可能電子デバイス
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
CN104224167B (zh) * 2014-09-21 2016-06-01 北京师范大学 一次性脑状态监测柔性贴片电极
US10677647B2 (en) 2015-06-01 2020-06-09 The Board Of Trustees Of The University Of Illinois Miniaturized electronic systems with wireless power and near-field communication capabilities
EP3304130B1 (fr) 2015-06-01 2021-10-06 The Board of Trustees of the University of Illinois Approche alternative de détection d'uv
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
JP4043601B2 (ja) * 1998-06-04 2008-02-06 大日本印刷株式会社 非接触型ｉｃカードとその製造方法、非接触型ｉｃカード用基体
JP2001175837A (ja) * 1999-12-22 2001-06-29 Toppan Printing Co Ltd Ｉｃカード
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures

Also Published As

Publication number Publication date
CN1606796A (zh) 2005-04-13
EP1468443A1 (fr) 2004-10-20
JP2006504251A (ja) 2006-02-02
AU2003205307B2 (en) 2009-03-26
WO2003063211A1 (fr) 2003-07-31
KR20040105705A (ko) 2004-12-16

Similar Documents

Publication Publication Date Title
AU2003205307B2 (en) Apparatus incorporating small-feature-size and large-feature-size components and method for making same
AU2003205307A1 (en) Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US7214569B2 (en) Apparatus incorporating small-feature-size and large-feature-size components and method for making same
JP4494771B2 (ja) スマートラベルおよびスマートラベルウェブ
US7342179B2 (en) Electronic device and method for producing the same
WO2010141311A1 (fr) Boîtier de dispositif à semi-conducteur matriciel à circuit imprimé adaptable
US8127438B2 (en) Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
WO2002097724A1 (fr) Structures electroniques multi-caracteristiques/dimensionnelles
US6864119B2 (en) COF semiconductor device and a manufacturing method for the same
CA2569694C (fr) Procede de formation d'un montage de circuits
EP1193755A4 (fr) Plaquage destine a former un element intercalaire dans un dispositif a semi-conducteur, un tel element intercalaire, et procede de fabrication associe
WO2006056999A2 (fr) Procedes de fabrication d'un ensemble capteur
US20050233620A1 (en) Anisotropic conductive sheet and its manufacturing method
US20030107129A1 (en) Resin encapsulated BGA-type semiconductor device
US7999191B2 (en) Method for making cable with a conductive bump array, and method for connecting the cable to a task object
JP2579458B2 (ja) 異方性導電フイルムおよびその製造方法
US20070159341A1 (en) Packaging structure for radio frequency identification devices
US7419387B2 (en) Electric connection member utilizing ansiotropically conductive sheets
GB2093401A (en) Composite film
JP2511909B2 (ja) 電気的接続材料のマイクロ形成方法
JPS63299242A (ja) 半導体装置の接続方法
JP2000149666A (ja) 異方性導電膜
JP2001358252A (ja) 半導体装置
JPH095769A (ja) 電子素子の配線接続構造

Legal Events

Date Code Title Description
FZDE Discontinued