CA3163239C - Dispositif à semi-conducteur, carte de circuit imprimé (pcb), et procédé d'interfaçage de broche de commande (broche de grille) de dispositif à semi-conducteur de puissance (mosfet) sur une carte de circuit imprimé (pcb) dans un système de gestion de batterie (bms) - Google Patents

Dispositif à semi-conducteur, carte de circuit imprimé (pcb), et procédé d'interfaçage de broche de commande (broche de grille) de dispositif à semi-conducteur de puissance (mosfet) sur une carte de circuit imprimé (pcb) dans un système de gestion de batterie (bms)

Info

Publication number
CA3163239C
CA3163239C CA3163239A CA3163239A CA3163239C CA 3163239 C CA3163239 C CA 3163239C CA 3163239 A CA3163239 A CA 3163239A CA 3163239 A CA3163239 A CA 3163239A CA 3163239 C CA3163239 C CA 3163239C
Authority
CA
Canada
Prior art keywords
gate pin
bms
printed circuit
management system
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA3163239A
Other languages
English (en)
Other versions
CA3163239A1 (fr
Inventor
James P. McBRIDE
James Richard Stanfield
Original Assignee
Noco Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/715,103 external-priority patent/USD920264S1/en
Priority claimed from US29/715,105 external-priority patent/USD932452S1/en
Application filed by Noco Co filed Critical Noco Co
Publication of CA3163239A1 publication Critical patent/CA3163239A1/fr
Application granted granted Critical
Publication of CA3163239C publication Critical patent/CA3163239C/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10492—Electrically connected to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Battery Mounting, Suspending (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Secondary Cells (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Electronic Switches (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Il est décrit un dispositif MOSFET destiné à être utilisé avec une carte de circuit imprimé (PCB) d'un système de gestion de batterie (BMS), le dispositif comprenant un corps semi-conducteur, un conducteur métallique s'étendant vers l'extérieur à partir d'un côté du corps semi-conducteur, une pluralité de broches d'alimentation s'étendant vers l'extérieur à partir d'au moins un côté du corps semi-conducteur, les broches d'alimentation ayant des pointes courbées vers le bas, une broche de grille s'étendant vers l'extérieur à partir d'au moins un côté du corps semi-conducteur, la pointe de la broche de grille étant élevée ou élevée par rapport aux pointes des broches de puissance de manière à éviter un contact électrique avec l'une des plaques de cuivre espacées, et la pointe de la broche de grille étant connectée à un circuit du système de gestion de batterie (BMS).
CA3163239A 2019-11-27 2020-11-25 Dispositif à semi-conducteur, carte de circuit imprimé (pcb), et procédé d'interfaçage de broche de commande (broche de grille) de dispositif à semi-conducteur de puissance (mosfet) sur une carte de circuit imprimé (pcb) dans un système de gestion de batterie (bms) Active CA3163239C (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201962941275P 2019-11-27 2019-11-27
US29/715,105 2019-11-27
US29/715,103 USD920264S1 (en) 2019-11-27 2019-11-27 Semiconductor device
US62/941,275 2019-11-27
US29/715,105 USD932452S1 (en) 2019-11-27 2019-11-27 Semiconductor device
US29/715,103 2019-11-27
PCT/US2020/062417 WO2021108706A1 (fr) 2019-11-27 2020-11-25 Dispositif à semi-conducteur, carte de circuit imprimé (pcb), et procédé d'interfaçage de broche de commande (broche de grille) de dispositif à semi-conducteur de puissance (mosfet) sur une carte de circuit imprimé (pcb) dans un système de gestion de batterie (bms)

Publications (2)

Publication Number Publication Date
CA3163239A1 CA3163239A1 (fr) 2021-06-03
CA3163239C true CA3163239C (fr) 2025-05-13

Family

ID=76129990

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3163239A Active CA3163239C (fr) 2019-11-27 2020-11-25 Dispositif à semi-conducteur, carte de circuit imprimé (pcb), et procédé d'interfaçage de broche de commande (broche de grille) de dispositif à semi-conducteur de puissance (mosfet) sur une carte de circuit imprimé (pcb) dans un système de gestion de batterie (bms)

Country Status (7)

Country Link
JP (2) JP7408804B2 (fr)
CN (1) CN114830439A (fr)
AU (2) AU2020393921B2 (fr)
CA (1) CA3163239C (fr)
GB (1) GB2605306B (fr)
MX (1) MX2022006313A (fr)
WO (1) WO2021108706A1 (fr)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846823A (en) * 1971-08-05 1974-11-05 Lucerne Products Inc Semiconductor assembly
JP3871486B2 (ja) * 1999-02-17 2007-01-24 株式会社ルネサステクノロジ 半導体装置
JP2003234442A (ja) 2002-02-06 2003-08-22 Hitachi Ltd 半導体装置及びその製造方法
US7540788B2 (en) * 2007-01-05 2009-06-02 Apple Inc. Backward compatible connector system
US7875962B2 (en) * 2007-10-15 2011-01-25 Power Integrations, Inc. Package for a power semiconductor device
JP2010087032A (ja) 2008-09-29 2010-04-15 Tdk-Lambda Corp 電子機器
CN104218633B (zh) * 2013-06-01 2017-01-04 快捷半导体(苏州)有限公司 电池管理和保护系统
US9831482B2 (en) * 2013-09-06 2017-11-28 Johnson Controls Technology Company Battery module lid system and method
DE102014006841A1 (de) * 2014-05-13 2015-11-19 Auto-Kabel Management Gmbh Schaltungsanordnung für Kraftfahrzeuge und Verwendung einer Schaltungsanordnung
FR3052013B1 (fr) 2016-05-25 2019-06-28 Aptiv Technologies Limited Module de commutation de puissance
JP7136767B2 (ja) 2017-03-28 2022-09-13 ローム株式会社 半導体装置および半導体装置の製造方法
JP6740959B2 (ja) * 2017-05-17 2020-08-19 株式会社オートネットワーク技術研究所 回路装置
US9978672B1 (en) * 2017-05-24 2018-05-22 Infineon Technologies Ag Transistor package with terminals coupled via chip carrier
CN109727943A (zh) * 2019-02-27 2019-05-07 无锡新洁能股份有限公司 一种具有低热阻的半导体器件封装结构及其制造方法

Also Published As

Publication number Publication date
WO2021108706A1 (fr) 2021-06-03
GB2605306A (en) 2022-09-28
AU2023204342B2 (en) 2024-08-15
JP2023503634A (ja) 2023-01-31
CN114830439A (zh) 2022-07-29
GB2605306B (en) 2025-01-08
JP7408804B2 (ja) 2024-01-05
CA3163239A1 (fr) 2021-06-03
AU2020393921A1 (en) 2022-06-09
MX2022006313A (es) 2022-06-22
AU2020393921B2 (en) 2023-04-06
AU2023204342A1 (en) 2023-07-27
GB202207806D0 (en) 2022-07-13
JP2024041768A (ja) 2024-03-27

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