CA545179A - Agglomeration de metaux a des ceramiques - Google Patents

Agglomeration de metaux a des ceramiques

Info

Publication number: CA545179A
Authority: CA; Canada
Prior art keywords: ceramics; metals; bonding
Prior art date: 1957-08-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA545179A

Other languages

English (en)

Inventor

Frank N. Sayers

Original Assignee

LODGE PLUGS Ltd

Publication date

1957-08-20

1957-08-20 Application granted granted Critical

1957-08-20 Publication of CA545179A publication Critical patent/CA545179A/fr

Status Expired legal-status Critical Current

Links

CA545179A Agglomeration de metaux a des ceramiques Expired CA545179A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CA545179T

Publications (1)

Publication Number	Publication Date
CA545179A true CA545179A (fr)	1957-08-20

Family

ID=35702356

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA545179A Expired CA545179A (fr)			Agglomeration de metaux a des ceramiques

Country Status (1)

Country	Link
CA (1)	CA545179A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4129243A (en) *	1975-07-30	1978-12-12	General Electric Company	Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US5108026A (en) *	1991-05-14	1992-04-28	Motorola Inc.	Eutectic bonding of metal to ceramic
US5653379A (en) *	1989-12-18	1997-08-05	Texas Instruments Incorporated	Clad metal substrate

0
- CA CA545179A patent/CA545179A/fr not_active Expired

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4129243A (en) *	1975-07-30	1978-12-12	General Electric Company	Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US5653379A (en) *	1989-12-18	1997-08-05	Texas Instruments Incorporated	Clad metal substrate
US5108026A (en) *	1991-05-14	1992-04-28	Motorola Inc.	Eutectic bonding of metal to ceramic

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