CA919034A - Fabrication of printed circuit boards - Google Patents

Fabrication of printed circuit boards

Info

Publication number
CA919034A
CA919034A CA076968A CA76968A CA919034A CA 919034 A CA919034 A CA 919034A CA 076968 A CA076968 A CA 076968A CA 76968 A CA76968 A CA 76968A CA 919034 A CA919034 A CA 919034A
Authority
CA
Canada
Prior art keywords
fabrication
printed circuit
circuit boards
boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA076968A
Other languages
English (en)
Inventor
Alsberg Henry
A. Frederiksen Ronald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richardson Co
Original Assignee
Richardson Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richardson Co filed Critical Richardson Co
Application granted granted Critical
Publication of CA919034A publication Critical patent/CA919034A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S264/00—Plastic and nonmetallic article shaping or treating: processes
    • Y10S264/59—Processes in which a partial cure is involved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA076968A 1969-04-02 1970-03-10 Fabrication of printed circuit boards Expired CA919034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81290069A 1969-04-02 1969-04-02

Publications (1)

Publication Number Publication Date
CA919034A true CA919034A (en) 1973-01-16

Family

ID=25210915

Family Applications (1)

Application Number Title Priority Date Filing Date
CA076968A Expired CA919034A (en) 1969-04-02 1970-03-10 Fabrication of printed circuit boards

Country Status (9)

Country Link
US (1) US3770571A (fr)
AU (1) AU1305970A (fr)
BE (1) BE748208A (fr)
CA (1) CA919034A (fr)
DE (1) DE2012533A1 (fr)
ES (1) ES378055A1 (fr)
FR (1) FR2053895A5 (fr)
GB (1) GB1299275A (fr)
NL (1) NL7004614A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH578621A5 (fr) * 1972-03-16 1976-08-13 Bbc Brown Boveri & Cie
US3958317A (en) * 1974-09-25 1976-05-25 Rockwell International Corporation Copper surface treatment for epoxy bonding
NL181416C (nl) * 1976-03-29 1987-08-17 Philips Nv Werkwijze voor het vervaardigen van een gemetalliseerde kunststofreflector.
US4582564A (en) * 1982-01-04 1986-04-15 At&T Technologies, Inc. Method of providing an adherent metal coating on an epoxy surface
US4532015A (en) * 1982-08-20 1985-07-30 Phillips Petroleum Company Poly(arylene sulfide) printed circuit boards
DE3512342C2 (de) * 1985-04-04 1993-12-23 Daimler Benz Ag Verfahren zur Metallisierung einer elektrisch isolierenden Oberfläche
US5127158A (en) * 1989-09-06 1992-07-07 Idemitsu Kosan Co., Ltd. Process for producing a printed circuit board with a syndiotactic polystyrene support
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
US9055700B2 (en) 2008-08-18 2015-06-09 Semblant Limited Apparatus with a multi-layer coating and method of forming the same
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3267007A (en) * 1966-08-16 Bonding metal deposits to electrically non-conductive material
US2876530A (en) * 1955-03-31 1959-03-10 Glenn N Howatt Forming printed circuit conductors
US2912747A (en) * 1955-11-07 1959-11-17 Erie Resistor Corp Method of making printed circuit panels
US2965624A (en) * 1957-11-21 1960-12-20 Phillips Petroleum Co Carbon-alkali metal compounds as polymerization catalyst
US3240662A (en) * 1961-01-23 1966-03-15 Exxon Research Engineering Co Impregnated reinforcing element bonded to an oxide coating on a copper foil
US3198774A (en) * 1961-11-14 1965-08-03 Phillips Petroleum Co Continuous process for the preparation of block copolymers
US3333024A (en) * 1963-04-25 1967-07-25 Shell Oil Co Block polymers, compositions containing them and process of their preparation
US3305460A (en) * 1964-01-23 1967-02-21 Gen Electric Method of electroplating plastic articles
DE1287885B (fr) * 1964-05-27
US3518067A (en) * 1965-08-20 1970-06-30 Union Carbide Corp Method of plating polyarylene polyethers,polycarbonate or polyhydroxyethers and the resulting articles
US3479160A (en) * 1965-10-11 1969-11-18 Borg Warner Metal plating of plastic materials
US3466232A (en) * 1965-10-23 1969-09-09 Carlen Ind Inc Electroplating process
BE706158A (fr) * 1966-11-10 1968-05-07
US3515649A (en) * 1967-05-02 1970-06-02 Ivan C Hepfer Pre-plating conditioning process
US3472678A (en) * 1967-05-03 1969-10-14 Hexagon Lab Inc Surface treatment for polystyrene which is to be electroless plated and compositions therefor
US3567594A (en) * 1969-03-17 1971-03-02 Phillips Petroleum Co Electroplating plastics

Also Published As

Publication number Publication date
AU1305970A (en) 1971-09-30
NL7004614A (fr) 1970-10-06
US3770571A (en) 1973-11-06
BE748208A (fr) 1970-09-30
ES378055A1 (es) 1973-01-01
DE2012533A1 (de) 1970-10-08
FR2053895A5 (fr) 1971-04-16
GB1299275A (en) 1972-12-13

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