CA945271A - Electrical circuit packaging structure and method of fabrication thereof - Google Patents

Electrical circuit packaging structure and method of fabrication thereof

Info

Publication number: CA945271A
Authority: CA; Canada
Prior art keywords: fabrication; electrical circuit; packaging structure; circuit packaging; electrical
Prior art date: 1970-06-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA113,703A

Other languages

English (en)

Other versions

CA113703S (en

Inventor

Howard L. Parks

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Bunker Ramo Corp

Original Assignee

Bunker Ramo Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1970-06-25

Filing date

1971-05-21

Publication date

1974-04-09

1971-05-21 Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp

1973-09-05 Priority to CA180,354A priority Critical patent/CA965879A/en

1974-04-09 Application granted granted Critical

1974-04-09 Publication of CA945271A publication Critical patent/CA945271A/en

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying

CA113,703A 1970-06-25 1971-05-21 Electrical circuit packaging structure and method of fabrication thereof Expired CA945271A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA180,354A CA965879A (en)	1970-06-25	1973-09-05	Electrical circuit packaging structure and method of fabrication thereof

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US4987370A	1970-06-25	1970-06-25

Publications (1)

Publication Number	Publication Date
CA945271A true CA945271A (en)	1974-04-09

Family

ID=21962185

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA113,703A Expired CA945271A (en)	1970-06-25	1971-05-21	Electrical circuit packaging structure and method of fabrication thereof

Country Status (9)

Country	Link
US (1)	US3705332A (it)
JP (1)	JPS5529597B1 (it)
CA (1)	CA945271A (it)
CH (1)	CH539377A (it)
DE (1)	DE2129132A1 (it)
GB (1)	GB1337652A (it)
IT (1)	IT986807B (it)
NL (1)	NL7107988A (it)
ZA (1)	ZA713954B (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3813773A (en) *	1972-09-05	1974-06-04	Bunker Ramo	Method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure
US3952231A (en) *	1974-09-06	1976-04-20	International Business Machines Corporation	Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
US4095867A (en) *	1974-10-10	1978-06-20	Bunker Ramo Corporation	Component connection system
US4240198A (en) *	1979-02-21	1980-12-23	International Telephone And Telegraph Corporation	Method of making conductive elastomer connector
US4288841A (en) *	1979-09-20	1981-09-08	Bell Telephone Laboratories, Incorporated	Double cavity semiconductor chip carrier
US4283755A (en) *	1980-02-05	1981-08-11	The United States Of America As Represented By The Secretary Of The Air Force	Modulator multilayer detector
JPS57197604U (it) *	1981-06-09	1982-12-15
DE3319339A1 (de) *	1982-05-31	1983-12-29	Sharp K.K., Osaka	Treiberanordnung fuer eine x-y-elektrodenmatrix
US4597617A (en) *	1984-03-19	1986-07-01	Tektronix, Inc.	Pressure interconnect package for integrated circuits
US4739448A (en) *	1984-06-25	1988-04-19	Magnavox Government And Industrial Electronics Company	Microwave multiport multilayered integrated circuit chip carrier
US4704319A (en) *	1984-11-23	1987-11-03	Irvine Sensors Corporation	Apparatus and method for fabricating modules comprising stacked circuit-carrying layers
US4613892A (en) *	1985-02-19	1986-09-23	Sundstrand Corporation	Laminated semiconductor assembly
US4659931A (en) *	1985-05-08	1987-04-21	Grumman Aerospace Corporation	High density multi-layered integrated circuit package
JPS61288455A (ja) *	1985-06-17	1986-12-18	Fujitsu Ltd	多層半導体装置の製造方法
US4705332A (en) *	1985-08-05	1987-11-10	Criton Technologies	High density, controlled impedance connectors
US5227959A (en) *	1986-05-19	1993-07-13	Rogers Corporation	Electrical circuit interconnection
JPH0286166U (it) *	1988-12-23	1990-07-09
DE69015878T2 (de) *	1989-04-17	1995-07-13	Ibm	Mehrschichtleiterplattenstruktur.
US5089880A (en) *	1989-06-07	1992-02-18	Amdahl Corporation	Pressurized interconnection system for semiconductor chips
US5245751A (en) *	1990-04-27	1993-09-21	Circuit Components, Incorporated	Array connector
US5071359A (en) *	1990-04-27	1991-12-10	Rogers Corporation	Array connector
US5357403A (en) *	1990-06-29	1994-10-18	General Electric Company	Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns
US5714802A (en) *	1991-06-18	1998-02-03	Micron Technology, Inc.	High-density electronic module
US5383269A (en) *	1991-09-03	1995-01-24	Microelectronics And Computer Technology Corporation	Method of making three dimensional integrated circuit interconnect module
US5270571A (en) *	1991-10-30	1993-12-14	Amdahl Corporation	Three-dimensional package for semiconductor devices
US5343366A (en) *	1992-06-24	1994-08-30	International Business Machines Corporation	Packages for stacked integrated circuit chip cubes
DE4435121A1 (de) *	1994-09-30	1996-04-04	Siemens Ag	An Datenbus betreibbare tragbare Datenträgeranordnung
US5637920A (en) *	1995-10-04	1997-06-10	Lsi Logic Corporation	High contact density ball grid array package for flip-chips
US6661085B2 (en) *	2002-02-06	2003-12-09	Intel Corporation	Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
US6762076B2 (en) *	2002-02-20	2004-07-13	Intel Corporation	Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
US20030213619A1 (en) *	2002-05-14	2003-11-20	Denzene Quentin S.	Ground discontinuity improvement in RF device matching
US7030486B1 (en) *	2003-05-29	2006-04-18	Marshall Paul N	High density integrated circuit package architecture
US7087538B2 (en) *	2004-08-16	2006-08-08	Intel Corporation	Method to fill the gap between coupled wafers
US9084382B2 (en) *	2012-10-18	2015-07-14	Infineon Technologies Austria Ag	Method of embedding an electronic component into an aperture of a substrate

1970
- 1970-06-25 US US49873A patent/US3705332A/en not_active Expired - Lifetime
1971
- 1971-05-12 GB GB1454571*[A patent/GB1337652A/en not_active Expired
- 1971-05-21 CA CA113,703A patent/CA945271A/en not_active Expired
- 1971-06-09 IT IT25659/71A patent/IT986807B/it active
- 1971-06-10 JP JP4069171A patent/JPS5529597B1/ja active Pending
- 1971-06-10 NL NL7107988A patent/NL7107988A/xx not_active Application Discontinuation
- 1971-06-10 CH CH846671A patent/CH539377A/de not_active IP Right Cessation
- 1971-06-11 DE DE19712129132 patent/DE2129132A1/de not_active Ceased
- 1971-06-17 ZA ZA713954A patent/ZA713954B/xx unknown

Also Published As

Publication number	Publication date
DE2129132A1 (de)	1972-01-05
ZA713954B (en)	1972-02-23
JPS5529597B1 (it)	1980-08-05
NL7107988A (it)	1971-12-28
US3705332A (en)	1972-12-05
GB1337652A (en)	1973-11-21
CH539377A (de)	1973-07-15
IT986807B (it)	1975-01-30

Publication	Publication Date	Title
CA945271A (en)	1974-04-09	Electrical circuit packaging structure and method of fabrication thereof
CA953430A (en)	1974-08-20	Electrical circuit module and method of assembly
CA932478A (en)	1973-08-21	Wire scribed circuit boards and method of manufacture
CA932044A (en)	1973-08-14	Electrical coil and method of manufacturing same
CA977451A (en)	1975-11-04	Electrical circuit packaging structure and method of fabrication thereof
CA965879A (en)	1975-04-08	Electrical circuit packaging structure and method of fabrication thereof
CA858137A (en)	1970-12-08	Printed circuit structure and method of making same
CA954634A (en)	1974-09-10	Circuit structure wafer member and method of fabrication thereof
CA841831A (en)	1970-05-12	Electrical circuit module and method of manufacture
AU484269B2 (en)		Electrical circuit packaging structure and method of fabrication thereof
AU478221B2 (en)	1973-05-24	Circuit structure wafer member and method of fabrication thereof
CA955690A (en)	1974-10-01	Integrated circuit and method of manufacturing same
CA930048A (en)	1973-07-10	Electrical devices and methods of making same
CA816939A (en)	1969-07-01	Electrical circuit elements and method of manufacture
CA922357A (en)	1973-03-06	Electrical device and method of manufacture
CA871942A (en)	1971-05-25	Electric circuit structure and method of manufacture
CA838303A (en)	1970-03-31	Electrical terminal device and method of forming the same
CA836788A (en)	1970-03-10	Integrated circuit structure and method of making the same
CA843431A (en)	1970-06-02	Electrical connections and method of making same
CA836729A (en)	1970-03-10	Electrical insulator and method of making the same
CA787045A (en)	1968-06-04	Method of modifying electrical characteristic of semiconductor member
CA793411A (en)	1968-08-27	Encapsulated electrical members and method of making the same
CA856954A (en)	1970-11-24	Insulated electrical members and method of manufacture
CA858138A (en)	1970-12-08	Methods of manufacturing electrical circuits
AU458206B2 (en)	1971-05-20	Semiconductor structure and method of manufacturing same