CA968461A - Universal four terminal semiconductor device chip for use in hybrid circuits - Google Patents

Universal four terminal semiconductor device chip for use in hybrid circuits

Info

Publication number
CA968461A
CA968461A CA153,260A CA153260A CA968461A CA 968461 A CA968461 A CA 968461A CA 153260 A CA153260 A CA 153260A CA 968461 A CA968461 A CA 968461A
Authority
CA
Canada
Prior art keywords
universal
semiconductor device
device chip
hybrid circuits
terminal semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA153,260A
Other languages
English (en)
Other versions
CA153260S (en
Inventor
Richard D. Snyder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Application granted granted Critical
Publication of CA968461A publication Critical patent/CA968461A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10D84/617—Combinations of vertical BJTs and only diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
CA153,260A 1971-11-05 1972-10-04 Universal four terminal semiconductor device chip for use in hybrid circuits Expired CA968461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19601671A 1971-11-05 1971-11-05

Publications (1)

Publication Number Publication Date
CA968461A true CA968461A (en) 1975-05-27

Family

ID=22723789

Family Applications (1)

Application Number Title Priority Date Filing Date
CA153,260A Expired CA968461A (en) 1971-11-05 1972-10-04 Universal four terminal semiconductor device chip for use in hybrid circuits

Country Status (7)

Country Link
JP (1) JPS4858370A (fr)
BE (1) BE790941A (fr)
CA (1) CA968461A (fr)
DE (1) DE2252793A1 (fr)
FR (1) FR2158337B1 (fr)
GB (1) GB1390944A (fr)
IT (1) IT968899B (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5623231A (en) * 1994-09-26 1997-04-22 Endgate Corporation Push-pull power amplifier

Also Published As

Publication number Publication date
IT968899B (it) 1974-03-20
BE790941A (fr) 1973-03-01
FR2158337A1 (fr) 1973-06-15
JPS4858370A (fr) 1973-08-16
FR2158337B1 (fr) 1976-05-21
GB1390944A (en) 1975-04-16
DE2252793A1 (de) 1973-05-10

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