CA977528A - Method of and device for mounting electric components on a mounting panel - Google Patents

Method of and device for mounting electric components on a mounting panel

Info

Publication number
CA977528A
CA977528A CA138,897A CA138897A CA977528A CA 977528 A CA977528 A CA 977528A CA 138897 A CA138897 A CA 138897A CA 977528 A CA977528 A CA 977528A
Authority
CA
Canada
Prior art keywords
mounting
electric components
mounting panel
panel
mounting electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA138,897A
Other languages
English (en)
Other versions
CA138897S (en
Inventor
Ludovicus Megens
Henri C.H. Van Rijsewijk
Gerard H. Oskam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA977528A publication Critical patent/CA977528A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CA138,897A 1971-04-09 1972-04-05 Method of and device for mounting electric components on a mounting panel Expired CA977528A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7104836.A NL165906C (nl) 1971-04-09 1971-04-09 Werkwijze voor het monteren van een aantal elektrische onderdelen op een montagepaneel, alsmede elektrisch on- derdeel geschikt voor het uitvoeren van de werkwijze.

Publications (1)

Publication Number Publication Date
CA977528A true CA977528A (en) 1975-11-11

Family

ID=19812892

Family Applications (1)

Application Number Title Priority Date Filing Date
CA138,897A Expired CA977528A (en) 1971-04-09 1972-04-05 Method of and device for mounting electric components on a mounting panel

Country Status (12)

Country Link
US (1) US3793720A (it)
JP (2) JPS579240B1 (it)
AT (1) AT332925B (it)
BE (1) BE781852A (it)
CA (1) CA977528A (it)
CH (1) CH550530A (it)
DE (1) DE2213823C3 (it)
FR (1) FR2132815B1 (it)
GB (1) GB1355292A (it)
IT (1) IT960872B (it)
NL (1) NL165906C (it)
SE (1) SE374479B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628595A (en) * 1983-06-07 1986-12-16 Matsushita Electric Industrial Co., Ltd. Automatic inserting apparatus for electronic parts

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2536957C2 (de) * 1975-08-20 1983-05-11 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektronisches Bauelement
EP0007183B1 (en) * 1978-07-17 1981-04-29 AMP INCORPORATED (a New Jersey corporation) An electrical connector assembly and apparatus for, and a method of, manufacturing the assembly
DE2930089C2 (de) * 1979-07-25 1984-02-09 Stettner & Co, 8560 Lauf Vorrichtung zum Einsetzen von Bauelementen in Öffnungen von gedruckten Schaltungsplatten
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
US4469387A (en) * 1982-08-23 1984-09-04 Amp Incorporated Printed circuit board connector
US4753601A (en) * 1983-10-14 1988-06-28 Amp Incorporated Circuit board thickness compensator
US4606120A (en) * 1983-10-26 1986-08-19 General Electric Company Process for mounting components on a printed circuit board
US4646419A (en) * 1986-04-14 1987-03-03 At&T Method for engaging a substrate
JPH0537435Y2 (it) * 1988-01-27 1993-09-21
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
CA2104438C (en) * 1992-11-02 1996-07-02 James Stephen Chapman Method and apparatus for mounting connectors
SE516207C2 (sv) * 1996-11-26 2001-12-03 Ericsson Telefon Ab L M Förfarande och anordning för att ytmontera en komponent stående på en bärare
US7029313B1 (en) * 2005-05-19 2006-04-18 Delta Electronics, Inc. Auxiliary device for assisting electrical connection
US8408923B2 (en) * 2010-08-26 2013-04-02 J. S. T. Corporation Dielectric part and an electrical connector assembly incorporating the same
DE102018203715B4 (de) * 2018-03-12 2026-04-23 Jumatech Gmbh Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer Form für Leiterelemente
EP3766310A1 (de) * 2018-03-12 2021-01-20 JUMATECH GmbH Verfahren zur herstellung einer leiterplatte unter verwendung einer form für leiterelemente
CN112752497A (zh) * 2020-11-30 2021-05-04 广州兴锐网络科技有限公司 一种基于智能制造的音箱电路板用免拆卸装配装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2871549A (en) * 1955-06-29 1959-02-03 Jr Albert E Arnold Method of assembling electrical components
US3058440A (en) * 1959-08-03 1962-10-16 Hughes Aircraft Co Circuit module reworking fixture
US3122679A (en) * 1959-10-05 1964-02-25 Hubert H Hoeltje Jr Transistor mounting pad
US3184536A (en) * 1962-12-26 1965-05-18 Douglas Aircraft Co Inc Electrical component mounting pad for printed circuit boards
NL6408087A (it) * 1964-07-16 1966-01-17
JPS4313576Y1 (it) * 1964-12-26 1968-06-10
US3388464A (en) * 1965-12-09 1968-06-18 Gen Precision Systems Inc Circuit board
GB1181111A (en) * 1966-02-16 1970-02-11 Hitachi Ltd A Method for Connecting an Electric Circuit Member to a Female Member and Means for Performing the Method
US3451131A (en) * 1966-06-27 1969-06-24 Lockheed Aircraft Corp Method for making an encapsulated electrical circuit module assembly
US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
US3512255A (en) * 1967-12-29 1970-05-19 Westinghouse Electric Corp Flat-pack circuit modules packaging

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628595A (en) * 1983-06-07 1986-12-16 Matsushita Electric Industrial Co., Ltd. Automatic inserting apparatus for electronic parts

Also Published As

Publication number Publication date
FR2132815B1 (it) 1979-04-13
FR2132815A1 (it) 1972-11-24
CH550530A (de) 1974-06-14
US3793720A (en) 1974-02-26
JPS6226567B2 (it) 1987-06-09
JPS56162826A (en) 1981-12-15
IT960872B (it) 1973-11-30
NL7104836A (it) 1972-10-11
GB1355292A (en) 1974-06-05
DE2213823A1 (de) 1972-10-19
ATA295972A (de) 1976-02-15
SE374479B (it) 1975-03-03
BE781852A (fr) 1972-10-09
JPS579240B1 (it) 1982-02-20
AT332925B (de) 1976-10-25
NL165906C (nl) 1981-05-15
DE2213823C3 (de) 1982-03-18
DE2213823B2 (de) 1981-06-25

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