Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
  • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
  • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
  • H10P14/6302—Non-deposition formation processes
  • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
  • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
  • H10P14/6312—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group III-V semiconductors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
  • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
  • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
  • H10P14/6302—Non-deposition formation processes
  • H10P14/6322—Formation by thermal treatments
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
  • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed

Applications Claiming Priority (1)

Publications (1)

Family

ID=22941055

Family Applications (1)

Country Status (7)

Families Citing this family (4)

Family Cites Families (2)

• 1972
  • 1972-05-01 US US00248874A patent/US3776789A/en not_active Expired - Lifetime
• 1973
  • 1973-03-08 IT IT21310/73A patent/IT981200B/it active
  • 1973-03-30 JP JP48035904A patent/JPS5212057B2/ja not_active Expired
  • 1973-03-30 FR FR7313777A patent/FR2182969B1/fr not_active Expired
  • 1973-04-13 CA CA169,274A patent/CA980919A/en not_active Expired
  • 1973-04-17 DE DE2319286A patent/DE2319286C3/de not_active Expired
  • 1973-04-18 GB GB1859073A patent/GB1371188A/en not_active Expired

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