CA985798A - Heat dissipation for power integrated circuit devices - Google Patents

Heat dissipation for power integrated circuit devices

Info

Publication number
CA985798A
CA985798A CA182,242A CA182242A CA985798A CA 985798 A CA985798 A CA 985798A CA 182242 A CA182242 A CA 182242A CA 985798 A CA985798 A CA 985798A
Authority
CA
Canada
Prior art keywords
integrated circuit
heat dissipation
circuit devices
power integrated
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA182,242A
Other languages
English (en)
Inventor
William B. Hall
Joseph A. Koskulitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Application granted granted Critical
Publication of CA985798A publication Critical patent/CA985798A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
CA182,242A 1972-10-06 1973-10-01 Heat dissipation for power integrated circuit devices Expired CA985798A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00295536A US3836825A (en) 1972-10-06 1972-10-06 Heat dissipation for power integrated circuit devices

Publications (1)

Publication Number Publication Date
CA985798A true CA985798A (en) 1976-03-16

Family

ID=23138119

Family Applications (1)

Application Number Title Priority Date Filing Date
CA182,242A Expired CA985798A (en) 1972-10-06 1973-10-01 Heat dissipation for power integrated circuit devices

Country Status (21)

Country Link
US (1) US3836825A (cs)
JP (1) JPS4974481A (cs)
AU (1) AU474327B2 (cs)
BE (1) BE805638A (cs)
BR (1) BR7307698D0 (cs)
CA (1) CA985798A (cs)
CS (1) CS166849B2 (cs)
DD (1) DD106925A5 (cs)
DE (1) DE2348743A1 (cs)
ES (1) ES419167A1 (cs)
FR (1) FR2202366B1 (cs)
GB (1) GB1393666A (cs)
HU (1) HU167161B (cs)
IN (1) IN139341B (cs)
IT (1) IT996751B (cs)
NL (1) NL7313447A (cs)
PL (1) PL95288B1 (cs)
RO (1) RO70806A (cs)
SE (1) SE396507B (cs)
SU (1) SU660610A3 (cs)
YU (1) YU35406B (cs)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3937976A (en) * 1974-09-20 1976-02-10 Wagner Electric Corporation Disguised coil for security system for automotive vehicles and the like
US4004195A (en) * 1975-05-12 1977-01-18 Rca Corporation Heat-sink assembly for high-power stud-mounted semiconductor device
DE2727178A1 (de) * 1977-06-16 1979-01-04 Bosch Gmbh Robert Gleichrichteranordnung
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
US4278991A (en) * 1979-08-13 1981-07-14 Burroughs Corporation IC Package with heat sink and minimal cross-sectional area
US4403102A (en) * 1979-11-13 1983-09-06 Thermalloy Incorporated Heat sink mounting
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4521827A (en) * 1981-10-23 1985-06-04 Thermalloy, Inc. Heat sink mounting
US4611238A (en) * 1982-05-05 1986-09-09 Burroughs Corporation Integrated circuit package incorporating low-stress omnidirectional heat sink
DE3237878C2 (de) * 1982-10-13 1984-11-15 ANT Nachrichtentechnik GmbH, 7150 Backnang Anordnung zur Abführung der Verlustwärme eines auf einer Leiterplatte montierten Halbleiterbauelementes
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
US5065281A (en) * 1990-02-12 1991-11-12 Rogers Corporation Molded integrated circuit package incorporating heat sink
US5055909A (en) * 1990-05-14 1991-10-08 Vlsi Technology, Inc System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink
JP2901091B2 (ja) * 1990-09-27 1999-06-02 株式会社日立製作所 半導体装置
US5155579A (en) * 1991-02-05 1992-10-13 Advanced Micro Devices Molded heat sink for integrated circuit package
JPH0582685A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
US5353193A (en) * 1993-02-26 1994-10-04 Lsi Logic Corporation High power dissipating packages with matched heatspreader heatsink assemblies
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
US5969949A (en) * 1998-03-31 1999-10-19 Sun Microsystems, Inc. Interfitting heat sink and heat spreader slug
US6781837B2 (en) * 2002-12-06 2004-08-24 Dell Products L.P. System and method for information handling system heat sink retention

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290564A (en) * 1963-02-26 1966-12-06 Texas Instruments Inc Semiconductor device
US3560808A (en) * 1968-04-18 1971-02-02 Motorola Inc Plastic encapsulated semiconductor assemblies
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3665256A (en) * 1968-10-15 1972-05-23 Rca Corp Heat dissipation for power integrated circuits
JPS4913660Y1 (cs) * 1969-06-16 1974-04-04

Also Published As

Publication number Publication date
NL7313447A (cs) 1974-04-09
BR7307698D0 (pt) 1974-08-22
SU660610A3 (ru) 1979-04-30
PL95288B1 (pl) 1977-10-31
DD106925A5 (cs) 1974-07-05
FR2202366B1 (cs) 1977-09-09
GB1393666A (en) 1975-05-07
CS166849B2 (cs) 1976-03-29
BE805638A (fr) 1974-02-01
YU35406B (en) 1980-12-31
HU167161B (cs) 1975-08-28
FR2202366A1 (cs) 1974-05-03
RO70806A (ro) 1982-02-01
IN139341B (cs) 1976-06-05
YU259773A (en) 1980-06-30
ES419167A1 (es) 1976-04-01
DE2348743A1 (de) 1974-04-11
IT996751B (it) 1975-12-10
AU6087473A (en) 1975-04-10
US3836825A (en) 1974-09-17
SE396507B (sv) 1977-09-19
AU474327B2 (en) 1976-07-22
JPS4974481A (cs) 1974-07-18

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