CH284523A - Procédé de fabrication d'un élément feuilleté. - Google Patents

Procédé de fabrication d'un élément feuilleté.

Info

Publication number
CH284523A
CH284523A CH284523DA CH284523A CH 284523 A CH284523 A CH 284523A CH 284523D A CH284523D A CH 284523DA CH 284523 A CH284523 A CH 284523A
Authority
CH
Switzerland
Prior art keywords
manufacturing
laminated element
laminated
Prior art date
Application number
Other languages
English (en)
Inventor
Company American Cyanamid
Original Assignee
American Cyanamid Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Cyanamid Co filed Critical American Cyanamid Co
Publication of CH284523A publication Critical patent/CH284523A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CH284523D 1947-06-19 1948-06-17 Procédé de fabrication d'un élément feuilleté. CH284523A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US967530XA 1947-06-19 1947-06-19
US284523XA 1947-06-19 1947-06-19

Publications (1)

Publication Number Publication Date
CH284523A true CH284523A (fr) 1952-07-31

Family

ID=26703707

Family Applications (1)

Application Number Title Priority Date Filing Date
CH284523D CH284523A (fr) 1947-06-19 1948-06-17 Procédé de fabrication d'un élément feuilleté.

Country Status (2)

Country Link
CH (1) CH284523A (fr)
FR (1) FR967530A (fr)

Also Published As

Publication number Publication date
FR967530A (fr) 1950-11-06

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