CH307776A - Kontaktvorrichtung an einem Halbleiterelement. - Google Patents

Kontaktvorrichtung an einem Halbleiterelement.

Info

Publication number
CH307776A
CH307776A CH307776DA CH307776A CH 307776 A CH307776 A CH 307776A CH 307776D A CH307776D A CH 307776DA CH 307776 A CH307776 A CH 307776A
Authority
CH
Switzerland
Prior art keywords
semiconductor element
contact device
contact
semiconductor
Prior art date
Application number
Other languages
English (en)
Inventor
Telefonaktiebolaget L Ericsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of CH307776A publication Critical patent/CH307776A/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
CH307776D 1952-01-08 1952-09-26 Kontaktvorrichtung an einem Halbleiterelement. CH307776A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE307776X 1952-01-08

Publications (1)

Publication Number Publication Date
CH307776A true CH307776A (de) 1955-06-15

Family

ID=20307567

Family Applications (1)

Application Number Title Priority Date Filing Date
CH307776D CH307776A (de) 1952-01-08 1952-09-26 Kontaktvorrichtung an einem Halbleiterelement.

Country Status (3)

Country Link
US (1) US2758263A (de)
CH (1) CH307776A (de)
GB (1) GB710245A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1207015B (de) * 1961-12-16 1965-12-16 Stanislas Teszner Transistor, insbesondere Unipolartransistor mit einem plattenfoermigen Halbleiterkoerper eines Leitungstyps und Verfahren zum Herstellen
DE1208824B (de) * 1960-11-21 1966-01-13 Tektronix Inc Verfahren zum Herstellen einer ohmschen metallischen Kontaktelektrode an einem Halbkoerper eines Halbleiterbauelements
DE1246898B (de) * 1962-06-01 1967-08-10 Ibm Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883592A (en) * 1955-12-30 1959-04-21 Gen Electric Encapsulated selenium rectifiers
NL255454A (de) * 1960-02-09
US3204159A (en) * 1960-09-14 1965-08-31 Bramley Jenny Rectifying majority carrier device
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby
US3312879A (en) * 1964-07-29 1967-04-04 North American Aviation Inc Semiconductor structure including opposite conductivity segments
US3448352A (en) * 1966-07-26 1969-06-03 Westinghouse Electric Corp Multiple electrical contact assembly for compression bonded electrical devices
US3577042A (en) * 1967-06-19 1971-05-04 Int Rectifier Corp Gate connection for controlled rectifiers
US4329701A (en) * 1978-03-20 1982-05-11 The Trane Company Semiconductor package
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2386218A (en) * 1945-10-09 Rectifier electrode connection
US2046686A (en) * 1934-05-22 1936-07-07 Bell Telephone Labor Inc Asymmetrical electrical conductor
GB500342A (en) * 1937-09-18 1939-02-07 British Thomson Houston Co Ltd Improvements relating to dry surface-contact electric rectifiers
GB500344A (en) * 1937-09-22 1939-02-07 British Thomson Houston Co Ltd Improvements in and relating to dry surface-contact electric rectifiers
GB500180A (en) * 1937-09-23 1939-02-03 British Thomson Houston Co Ltd Improvements in and relating to dry surface contact electric rectifiers
GB529754A (en) * 1939-06-07 1940-11-27 Henriette Rupp Method for controlling and amplifying electric currents by the use of asymmetricallyconducting layers
US2345122A (en) * 1939-10-17 1944-03-28 Herrmann Heinrich Dry rectifier
US2444385A (en) * 1945-07-06 1948-06-29 Union Switch & Signal Co Alternating electric current rectifier
US2595052A (en) * 1948-07-23 1952-04-29 Sylvania Electric Prod Crystal amplifier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208824B (de) * 1960-11-21 1966-01-13 Tektronix Inc Verfahren zum Herstellen einer ohmschen metallischen Kontaktelektrode an einem Halbkoerper eines Halbleiterbauelements
DE1207015B (de) * 1961-12-16 1965-12-16 Stanislas Teszner Transistor, insbesondere Unipolartransistor mit einem plattenfoermigen Halbleiterkoerper eines Leitungstyps und Verfahren zum Herstellen
DE1246898B (de) * 1962-06-01 1967-08-10 Ibm Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente

Also Published As

Publication number Publication date
US2758263A (en) 1956-08-07
GB710245A (en) 1954-06-09

Similar Documents

Publication Publication Date Title
NL178656B (nl) Pakkingelement voor contacttorens.
CH319749A (de) Schaltungsanordnung mit einem Transistor
NL172702B (nl) Informatieverwerkingsinrichting.
CH301665A (de) Bimetall-Kontakteinrichtung.
CH307776A (de) Kontaktvorrichtung an einem Halbleiterelement.
CH331014A (de) Schaltungsanordnung mit einem Transistor
CH321681A (de) Halbleiterelement
CH329187A (de) Halbleiteranordnung
NL169852C (nl) Transportinrichting.
CH337949A (de) Punktkontakt-Halbleitervorrichtung
NL182822B (nl) Preparatief elektroforese-apparaat.
CH322790A (de) Schaltungsanordnung mit einem Transistor
CH334924A (de) Elektrisches Halbleitergerät
NL178369B (nl) Geheugeninrichting.
CH329185A (de) Halbleiteranordnung
CH326329A (de) Schaltungsanordnung mit einem Transistor
FR1114651A (fr) Dispositif semi-conducteur à contact
FR1100533A (fr) Dispositif semi-conducteur
NL174892B (nl) Stroombegrenzingsinrichting.
NL178636B (nl) Getterinrichting.
CH328881A (de) Halbleiteranordnung
CH329544A (de) Halbleitervorrichtung
NL177539B (nl) Halfgeleider-schakelinrichting.
NL176054B (nl) Filterinrichting.
FR1064044A (fr) Dispositif de contact