CH319751A - Cooling device for dry rectifier, which z. B. works with water as the liquid coolant - Google Patents

Cooling device for dry rectifier, which z. B. works with water as the liquid coolant

Info

Publication number
CH319751A
CH319751A CH319751DA CH319751A CH 319751 A CH319751 A CH 319751A CH 319751D A CH319751D A CH 319751DA CH 319751 A CH319751 A CH 319751A
Authority
CH
Switzerland
Prior art keywords
works
water
cooling device
liquid coolant
dry rectifier
Prior art date
Application number
Other languages
German (de)
Inventor
Nagorsen Hans
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH319751A publication Critical patent/CH319751A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
CH319751D 1952-08-27 1953-08-26 Cooling device for dry rectifier, which z. B. works with water as the liquid coolant CH319751A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES29953D DE967450C (en) 1952-08-27 1952-08-27 Cooling device for dry rectifier with cooling ducts

Publications (1)

Publication Number Publication Date
CH319751A true CH319751A (en) 1957-02-28

Family

ID=6152300

Family Applications (1)

Application Number Title Priority Date Filing Date
CH319751D CH319751A (en) 1952-08-27 1953-08-26 Cooling device for dry rectifier, which z. B. works with water as the liquid coolant

Country Status (4)

Country Link
CH (1) CH319751A (en)
DE (1) DE967450C (en)
FR (1) FR1081675A (en)
GB (1) GB758524A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2162074A1 (en) * 1971-12-04 1973-07-13 Siemens Ag
EP0234021A1 (en) * 1986-01-16 1987-09-02 Siemens Aktiengesellschaft Liquid cooling device for an electric component, in particular semiconductor component

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE974194C (en) * 1953-04-02 1960-10-13 Standard Elek K Lorenz Ag Process for making barrier cells of very small effective area
BE540197A (en) * 1954-06-22
BE543787A (en) * 1954-12-21
US2766409A (en) * 1955-02-28 1956-10-09 Internatioanl Rectifier Corp Fluid cooled encapsulated rectifier stack
DE1034723B (en) * 1955-07-15 1958-07-24 Siemens Edison Swan Ltd Electronic device with a device to dissipate the heat generated in the device
US3054032A (en) * 1958-11-17 1962-09-11 Rolland C Sabins Heat sink for a. c.-d. c. rectifier
US3800190A (en) * 1970-11-02 1974-03-26 Bbc Brown Boveri & Cie Cooling system for power semiconductor devices
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
CH677293A5 (en) * 1989-01-16 1991-04-30 Asea Brown Boveri Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid
WO1995017765A2 (en) * 1993-12-15 1995-06-29 Aavid Engineering, Inc. Liquid cooled heat sink for cooling electronic components
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
JP4048579B2 (en) * 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US7017651B1 (en) * 2000-09-13 2006-03-28 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
US6351381B1 (en) 2001-06-20 2002-02-26 Thermal Corp. Heat management system
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
DE102004057432B4 (en) * 2004-11-27 2006-10-19 Rittal Gmbh & Co. Kg cooling unit
WO2006100690A2 (en) * 2005-03-22 2006-09-28 Bharat Heavy Electricals Limited. Selectively grooved cold plate for electronics cooling
EP3459110B1 (en) * 2016-07-01 2020-08-26 Siemens Aktiengesellschaft Cooling box unit and power electronics device having a cooling box unit
DE202018102530U1 (en) * 2018-03-26 2019-02-26 TRUMPF Hüttinger GmbH + Co. KG Arrangement for cooling components
CN114068275B (en) * 2020-08-05 2024-06-07 中微半导体设备(上海)股份有限公司 Semiconductor component, plasma reaction apparatus, and coating forming method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE689105C (en) * 1937-11-03 1940-03-11 Siemens Schuckertwerke Akt Ges Dry rectifier arrangement with tubular rectifier elements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2162074A1 (en) * 1971-12-04 1973-07-13 Siemens Ag
EP0234021A1 (en) * 1986-01-16 1987-09-02 Siemens Aktiengesellschaft Liquid cooling device for an electric component, in particular semiconductor component

Also Published As

Publication number Publication date
DE967450C (en) 1957-11-14
GB758524A (en) 1956-10-03
FR1081675A (en) 1954-12-22

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