CH382300A - Method for manufacturing a semiconductor device - Google Patents

Method for manufacturing a semiconductor device

Info

Publication number
CH382300A
CH382300A CH7861A CH7861A CH382300A CH 382300 A CH382300 A CH 382300A CH 7861 A CH7861 A CH 7861A CH 7861 A CH7861 A CH 7861A CH 382300 A CH382300 A CH 382300A
Authority
CH
Switzerland
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
CH7861A
Other languages
German (de)
Inventor
Schering Hans
Kurt Dr Raithal
Reimer Dipl Phys Emeis
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH382300A publication Critical patent/CH382300A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
CH7861A 1960-01-13 1961-01-03 Method for manufacturing a semiconductor device CH382300A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES66619A DE1120603B (en) 1960-01-13 1960-01-13 Method for manufacturing a semiconductor device
DES68740A DE1125555B (en) 1960-01-13 1960-05-30 Method for producing a pn semiconductor device

Publications (1)

Publication Number Publication Date
CH382300A true CH382300A (en) 1964-09-30

Family

ID=25995956

Family Applications (1)

Application Number Title Priority Date Filing Date
CH7861A CH382300A (en) 1960-01-13 1961-01-03 Method for manufacturing a semiconductor device

Country Status (3)

Country Link
CH (1) CH382300A (en)
DE (2) DE1120603B (en)
GB (1) GB928664A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL264072A (en) * 1960-11-21 1900-01-01
US3248681A (en) * 1962-03-30 1966-04-26 Westinghouse Electric Corp Contacts for semiconductor devices

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT190593B (en) * 1954-07-01 1957-07-10 Philips Nv Barrier layer electrode system which contains a semiconducting body made of germanium or silicon, in particular a crystal diode or transistor
FR1192082A (en) * 1957-03-20 1959-10-23 Bosch Gmbh Robert Power semiconductor

Also Published As

Publication number Publication date
DE1120603B (en) 1961-12-28
DE1125555B (en) 1962-03-15
GB928664A (en) 1963-06-12

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