CH384722A - Verfahren zur Herstellung von Kühlkörpern zur Kühlung von elektrischen Bauelementen - Google Patents

Verfahren zur Herstellung von Kühlkörpern zur Kühlung von elektrischen Bauelementen

Info

Publication number
CH384722A
CH384722A CH543660A CH543660A CH384722A CH 384722 A CH384722 A CH 384722A CH 543660 A CH543660 A CH 543660A CH 543660 A CH543660 A CH 543660A CH 384722 A CH384722 A CH 384722A
Authority
CH
Switzerland
Prior art keywords
production
electrical components
heat sinks
cooling electrical
cooling
Prior art date
Application number
CH543660A
Other languages
English (en)
Inventor
Wagner Hans
Original Assignee
Standard Telephon & Radio Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB13657/51A external-priority patent/GB716250A/en
Priority claimed from GB19173/53A external-priority patent/GB753488A/en
Priority claimed from US434865A external-priority patent/US2928030A/en
Priority claimed from GB4261/56A external-priority patent/GB797822A/en
Priority claimed from GB23454/58A external-priority patent/GB835865A/en
Application filed by Standard Telephon & Radio Ag filed Critical Standard Telephon & Radio Ag
Publication of CH384722A publication Critical patent/CH384722A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/26—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/36—Selection of substances as active materials, active masses, active liquids
    • H01M4/48—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides
    • H01M4/50—Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/045—Cells with aqueous electrolyte characterised by aqueous electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/06—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/04—Cells with aqueous electrolyte
    • H01M6/06—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid
    • H01M6/10—Dry cells, i.e. cells wherein the electrolyte is rendered non-fluid with wound or folded electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Food Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermistors And Varistors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Drying Of Solid Materials (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Lubricants (AREA)
  • Wire Bonding (AREA)
  • Primary Cells (AREA)
  • Hybrid Cells (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
CH543660A 1951-06-08 1960-05-12 Verfahren zur Herstellung von Kühlkörpern zur Kühlung von elektrischen Bauelementen CH384722A (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
GB13657/51A GB716250A (en) 1951-06-08 1951-06-08 Improvements in or relating to electric semi-conducting devices
GB19173/53A GB753488A (en) 1953-07-10 1953-07-10 Improvements in or relating to electrical couplings to semiconductor elements
US434865A US2928030A (en) 1954-06-07 1954-06-07 Semiconductor devices
GB4261/56A GB797822A (en) 1951-06-08 1956-02-10 Improvements in or relating to semi-conductor junction diodes
DEST13682A DE1098102B (de) 1951-06-08 1958-04-23 Verfahren zur Herstellung einer elektrischen Halbleitervorrichtung
GB23454/58A GB835865A (en) 1957-05-21 1958-07-22 Improvements in or relating to crystal rectifiers and methods of manufacture thereof
DE884824X 1958-09-30
DEST15123A DE1255823B (de) 1951-06-08 1959-05-13 Verfahren zum Herstellen von Kuehlkoerpern fuer elektrische Bauelemente aus auf einem Bolzen senkrecht zur Laengsachse angeordneten Kuehlplatten, insbesondere fuer Halbleiterleistungsgleichrichter und Transistoren

Publications (1)

Publication Number Publication Date
CH384722A true CH384722A (de) 1965-02-26

Family

ID=31982807

Family Applications (2)

Application Number Title Priority Date Filing Date
CH342657D CH342657A (de) 1951-06-08 1955-06-07 Verfahren zum Herstellen von Halbleiterelementen
CH543660A CH384722A (de) 1951-06-08 1960-05-12 Verfahren zur Herstellung von Kühlkörpern zur Kühlung von elektrischen Bauelementen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CH342657D CH342657A (de) 1951-06-08 1955-06-07 Verfahren zum Herstellen von Halbleiterelementen

Country Status (8)

Country Link
US (1) US2785349A (de)
BE (4) BE538791A (de)
CH (2) CH342657A (de)
DE (6) DE968077C (de)
FR (4) FR1066148A (de)
GB (4) GB795113A (de)
LU (1) LU37433A1 (de)
NL (3) NL86185C (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109513352A (zh) * 2019-01-10 2019-03-26 广东中烟工业有限责任公司 一种用于异味处理系统光化学管的防水装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2850707A (en) * 1954-04-15 1958-09-02 Sylvania Electric Prod Electromagnetic coils
NL236678A (de) * 1958-03-04 1900-01-01
NL101704C (de) * 1958-07-02
US2937110A (en) * 1958-07-17 1960-05-17 Westinghouse Electric Corp Protective treatment for semiconductor devices
NL113317C (de) * 1958-09-16 1900-01-01
DE1275690B (de) * 1960-10-01 1968-08-22 Telefunken Patent Gehaeuse fuer Halbleiterbauelemente
DE1237695B (de) * 1961-10-24 1967-03-30 Siemens Ag Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement
DE1229647B (de) * 1961-12-22 1966-12-01 Walter Brandt G M B H Verfahren zum Herstellen einer Flaechengleichrichteranordnung
US3216084A (en) * 1963-04-10 1965-11-09 Motorola Inc Semiconductor process control technique
US3265805A (en) * 1964-02-03 1966-08-09 Power Components Inc Semiconductor power device
DE1514473C3 (de) * 1965-06-05 1981-08-20 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement
DE2331106C2 (de) * 1973-06-19 1984-11-22 Hitachi Maxell, Ltd., Ibaraki, Osaka Trockenelement
US3945852A (en) * 1974-09-06 1976-03-23 P. R. Mallory & Co. Inc. Current collector for organic electrolyte batteries
USRE30458E (en) 1977-12-30 1980-12-23 Hitachi Maxell, Ltd. Dry cells
US4574330A (en) * 1982-12-20 1986-03-04 Burr-Brown Corporation Heat sink for dissipating heat generated by electronic displays
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement
DE10128970A1 (de) * 2001-06-15 2002-12-19 Fortu Bat Batterien Gmbh Bei Normaltemperatur betreibbare, wiederaufladbare Batteriezelle
JP2010165721A (ja) * 2009-01-13 2010-07-29 Honda Motor Co Ltd 太陽電池モジュール

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US756676A (en) * 1902-11-10 1904-04-05 Internat Wireless Telegraph Company Wave-responsive device.
US1058210A (en) * 1910-12-30 1913-04-08 Allie Ray Welch Method of finishing castings.
US1704228A (en) * 1928-01-30 1929-03-05 Packard Motor Car Co Fastening device
US1890312A (en) * 1931-03-30 1932-12-06 Tung Sol Condensers Inc Condenser
DE710631C (de) * 1938-08-06 1941-09-18 Versuchsanstalt Fuer Luftfahrt Empfangsvorrichtung fuer elektrische Wellen
DE891404C (de) * 1941-05-27 1953-09-28 Pertrix Union G M B H Galvanisches Element, insbesondere mit Luftdepolarisation
GB572511A (en) * 1941-11-05 1945-10-11 Gen Electric Co Ltd Improvements in electric rectifiers
US2503837A (en) * 1945-07-27 1950-04-11 Bell Telephone Labor Inc Electrical translating device
GB635690A (en) * 1946-07-31 1950-04-12 Gen Electric Co Ltd Improvements in and relating to crystal rectifiers
BE478029A (de) * 1946-10-10
US2635199A (en) * 1948-01-08 1953-04-14 John M Wolfskill Piezoelectric crystal apparatus
US2513870A (en) * 1948-01-23 1950-07-04 Reeves Hoffman Corp Hermetically sealed crystal
US2615965A (en) * 1948-07-24 1952-10-28 Sylvania Electric Prod Crystal amplifier device
US2626985A (en) * 1948-08-25 1953-01-27 Sylvania Electric Prod Electrical crystal unit
BE491276A (de) * 1948-11-05
US2631115A (en) * 1949-08-06 1953-03-10 Manganese Battery Corp Electrodes for electrochemical cells
US2595475A (en) * 1949-12-23 1952-05-06 Rca Corp Electrode support for semiconductor devices
NL78456C (de) * 1949-12-23
US2639392A (en) * 1949-12-30 1953-05-19 Bell Telephone Labor Inc Masking device for crystals
US2622133A (en) * 1950-05-01 1952-12-16 Sprague Electric Co Sealed electrical circuit components
US2651745A (en) * 1951-02-08 1953-09-08 Int Standard Electric Corp Dry rectifier assembly
NL96864C (de) * 1954-01-14 1900-01-01
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
GB785467A (en) * 1954-12-23 1957-10-30 Gen Electric Co Ltd Improvements in or relating to the manufacture of semi-conductor devices
NL203528A (de) * 1955-03-24
NL207356A (de) * 1955-05-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109513352A (zh) * 2019-01-10 2019-03-26 广东中烟工业有限责任公司 一种用于异味处理系统光化学管的防水装置

Also Published As

Publication number Publication date
BE512559A (de) 1900-01-01
LU37433A1 (de) 1900-01-01
DE1098102B (de) 1961-01-26
GB884824A (en) 1961-12-20
GB795113A (en) 1958-05-14
DE1255823B (de) 1967-12-07
DE1015934B (de) 1957-09-19
DE1060992B (de) 1959-07-09
GB914592A (en) 1963-01-02
DE968077C (de) 1958-01-16
FR69762E (fr) 1958-12-30
BE530249A (de) 1900-01-01
GB877644A (en) 1961-09-20
DE1069726B (de) 1959-11-26
CH342657A (de) 1959-11-30
BE538791A (de) 1900-01-01
FR1066148A (fr) 1954-06-02
BE554903A (de) 1900-01-01
FR66909E (fr) 1957-10-31
FR71643E (fr) 1960-01-13
US2785349A (en) 1957-03-12
NL238107A (de) 1900-01-01
NL86185C (de) 1900-01-01
NL170157B (nl) 1900-01-01

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