CH387809A - Soldered connection on a semiconductor element - Google Patents

Soldered connection on a semiconductor element

Info

Publication number
CH387809A
CH387809A CH1336361A CH1336361A CH387809A CH 387809 A CH387809 A CH 387809A CH 1336361 A CH1336361 A CH 1336361A CH 1336361 A CH1336361 A CH 1336361A CH 387809 A CH387809 A CH 387809A
Authority
CH
Switzerland
Prior art keywords
semiconductor element
soldered connection
soldered
connection
semiconductor
Prior art date
Application number
CH1336361A
Other languages
German (de)
Inventor
Giger Johannes
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1336361A priority Critical patent/CH387809A/en
Priority to DEA38930A priority patent/DE1226212B/en
Priority to FR915479A priority patent/FR1351456A/en
Priority to GB43339/62A priority patent/GB965158A/en
Publication of CH387809A publication Critical patent/CH387809A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
CH1336361A 1961-11-17 1961-11-17 Soldered connection on a semiconductor element CH387809A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1336361A CH387809A (en) 1961-11-17 1961-11-17 Soldered connection on a semiconductor element
DEA38930A DE1226212B (en) 1961-11-17 1961-12-04 Semiconductor device
FR915479A FR1351456A (en) 1961-11-17 1962-11-15 Improvements to solder connections for semiconductor elements
GB43339/62A GB965158A (en) 1961-11-17 1962-11-15 Semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1336361A CH387809A (en) 1961-11-17 1961-11-17 Soldered connection on a semiconductor element

Publications (1)

Publication Number Publication Date
CH387809A true CH387809A (en) 1965-02-15

Family

ID=4391770

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1336361A CH387809A (en) 1961-11-17 1961-11-17 Soldered connection on a semiconductor element

Country Status (3)

Country Link
CH (1) CH387809A (en)
DE (1) DE1226212B (en)
GB (1) GB965158A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008055134A1 (en) * 2008-12-23 2010-07-01 Robert Bosch Gmbh Electrical or electronic composite component and method for producing an electrical or electronic composite component
DE102015210061A1 (en) * 2015-06-01 2016-12-01 Siemens Aktiengesellschaft Method for electrical contacting of a component and component module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE537167A (en) * 1954-04-07
AT190593B (en) * 1954-07-01 1957-07-10 Philips Nv Barrier layer electrode system which contains a semiconducting body made of germanium or silicon, in particular a crystal diode or transistor
DE1105525B (en) * 1959-12-29 1961-04-27 Siemens Ag Semiconductor device

Also Published As

Publication number Publication date
GB965158A (en) 1964-07-29
DE1226212B (en) 1966-10-06

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