CH391109A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH391109A
CH391109A CH546861A CH546861A CH391109A CH 391109 A CH391109 A CH 391109A CH 546861 A CH546861 A CH 546861A CH 546861 A CH546861 A CH 546861A CH 391109 A CH391109 A CH 391109A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH546861A
Other languages
English (en)
Inventor
Geyer Karl-Heinz Dipl-Phys Dr
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH391109A publication Critical patent/CH391109A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
CH546861A 1960-05-18 1961-05-09 Halbleiteranordnung CH391109A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES68563A DE1185728B (de) 1960-05-18 1960-05-18 Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement

Publications (1)

Publication Number Publication Date
CH391109A true CH391109A (de) 1965-04-30

Family

ID=63144754

Family Applications (1)

Application Number Title Priority Date Filing Date
CH546861A CH391109A (de) 1960-05-18 1961-05-09 Halbleiteranordnung

Country Status (4)

Country Link
CH (1) CH391109A (de)
DE (1) DE1185728B (de)
FR (1) FR1289309A (de)
GB (1) GB971703A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1184000B (de) * 1962-05-18 1964-12-23 Siemens Ag Einbau eines scheibenfoermigen elektrischen Halbleiterbauelementes in einer Aussparung eines anderen Konstruktionsteiles, insbesondere einem Gehaeuse einer elektrischen Maschine oder einem von diesem getragenen Zusatzteil
CH410200A (de) * 1962-06-21 1966-03-31 Ckd Praha Narodni Podnik Vakuumdichter Verschluss für Halbleiterelemente und Verfahren zu dessen Herstellung
DE1279847B (de) * 1965-01-13 1968-10-10 Siemens Ag Kapazitive Halbleiterdiode und Verfahren zu ihrer Herstellung
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
JPS5030428B1 (de) * 1969-03-31 1975-10-01
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
CH592961A5 (de) * 1975-09-23 1977-11-15 Bbc Brown Boveri & Cie

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1108663A (fr) * 1953-10-19 1956-01-16 Licentia Gmbh Système conducteur électrique asymétrique
BE534817A (de) * 1954-01-14 1900-01-01
CH338903A (de) * 1954-10-04 1959-06-15 Westinghouse Electric Corp Kühlvorrichtung für Halbleiteranordnungen, insbesondere für p-n-Leistungsgleichrichter
DE1042762B (de) * 1955-02-26 1958-11-06 Siemens Ag Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht
DE1039648B (de) * 1955-04-30 1958-09-25 Siemens Ag Flaechengleichrichter bzw. -transistor

Also Published As

Publication number Publication date
FR1289309A (fr) 1962-03-30
DE1185728B (de) 1965-01-21
GB971703A (en) 1964-10-07

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