CH404335A - Process for copper-plating metal surfaces - Google Patents
Process for copper-plating metal surfacesInfo
- Publication number
- CH404335A CH404335A CH764661A CH764661A CH404335A CH 404335 A CH404335 A CH 404335A CH 764661 A CH764661 A CH 764661A CH 764661 A CH764661 A CH 764661A CH 404335 A CH404335 A CH 404335A
- Authority
- CH
- Switzerland
- Prior art keywords
- copper
- metal surfaces
- mixture
- plating metal
- suspension
- Prior art date
Links
- 239000002184 metal Substances 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 title claims description 8
- 238000000034 method Methods 0.000 title claims description 8
- 238000007747 plating Methods 0.000 title claims description 5
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000725 suspension Substances 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 150000001879 copper Chemical class 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000012266 salt solution Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Verfahren zum Verkupfern von Metalloberflächen Gegenstand der Erfindung ist ein Verfahren zum Verkupfern von Metalloberflächen ohne Verwendung von elektrischem Strom, aus einer Mischung von Kupfersalzlösung und Metallpulveraufschwemmung.
Es sind solche Mischungen bekannt, die lediglich ein einfaches Kupfersalz wie Kupfersulfat in der Lö sung enthalten. Bei diesen Mischungen fällt die Ver- kupferung meist ungleichmässig aus und geht verhält- nismässig langsam vonstatten.
Zweck der Erfindung ist, diese Mängel zu beheben. Das erfindungsgemässe Verfahren ist nun dadurch gekennzeichnet, dass die Mischung Schwefelsäure und eine organische Oxysäure, oder mehrere enthält. Zur Mischung kann Phosphorsäure zugegeben werden.
Zu der Aufschwemmung können auch bekannte Verteilungsmittel zugegeben werden.
<I>Beispiel ;</I> <I>Lösung</I> 50 Gramm Kupfersulfat 2 Gramm Zitronensäure 3 ccm Schwefelsäure vom spez Gew. 1.84 1 Liter Wasser.
Aufschwemmung 10 Gramm Zinkpulver 1 Liter Wasser Die Mischung der Lösung und Aufschwemmung wird unmittelbar vor dem Auftragen auf die Metall oberfläche vorgenommen werden. Eine bewährte Me thode besteht darin, die Lösung und die Aufschwem- mung gleichzeitig aufzuspritzen, so dass die Mischung in der Luft kurz vor dem Auftreffen auf die Metall fläche oder beim Auftreffen erfolgt.
Process for copper-plating metal surfaces The subject matter of the invention is a process for copper-plating metal surfaces without the use of electric current, from a mixture of copper salt solution and metal powder suspension.
Such mixtures are known which contain only a simple copper salt such as copper sulfate in the solution. In these mixtures, the copper plating is mostly uneven and takes place relatively slowly.
The purpose of the invention is to remedy these deficiencies. The method according to the invention is now characterized in that the mixture contains sulfuric acid and an organic oxy acid, or more. Phosphoric acid can be added to the mixture.
Known distributing agents can also be added to the suspension.
<I> Example; </I> <I> Solution </I> 50 grams of copper sulfate 2 grams of citric acid 3 ccm of sulfuric acid with a specific weight of 1.84 1 liter of water.
Suspension 10 grams of zinc powder 1 liter of water The mixture of the solution and suspension is made immediately prior to application to the metal surface. A tried and tested method is to spray the solution and the suspension at the same time so that the mixture takes place in the air shortly before or when it hits the metal surface.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH764661A CH404335A (en) | 1961-06-25 | 1961-06-25 | Process for copper-plating metal surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH764661A CH404335A (en) | 1961-06-25 | 1961-06-25 | Process for copper-plating metal surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH404335A true CH404335A (en) | 1965-12-15 |
Family
ID=4328357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH764661A CH404335A (en) | 1961-06-25 | 1961-06-25 | Process for copper-plating metal surfaces |
Country Status (1)
| Country | Link |
|---|---|
| CH (1) | CH404335A (en) |
-
1961
- 1961-06-25 CH CH764661A patent/CH404335A/en unknown
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