CH413041A - Verfahren und Vorrichtung zum Befestigen von elektrischen Bauelementen auf einer Trägerplatte - Google Patents

Verfahren und Vorrichtung zum Befestigen von elektrischen Bauelementen auf einer Trägerplatte

Info

Publication number
CH413041A
CH413041A CH1021464A CH1021464A CH413041A CH 413041 A CH413041 A CH 413041A CH 1021464 A CH1021464 A CH 1021464A CH 1021464 A CH1021464 A CH 1021464A CH 413041 A CH413041 A CH 413041A
Authority
CH
Switzerland
Prior art keywords
electrical components
carrier plate
fastening electrical
fastening
carrier
Prior art date
Application number
CH1021464A
Other languages
English (en)
Inventor
Nutt Robert De Witt Mc
Maxwell Jr Davis Edward
Harvey Mones Arthur
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH413041A publication Critical patent/CH413041A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CH1021464A 1963-08-08 1964-08-05 Verfahren und Vorrichtung zum Befestigen von elektrischen Bauelementen auf einer Trägerplatte CH413041A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US300855A US3292240A (en) 1963-08-08 1963-08-08 Method of fabricating microminiature functional components

Publications (1)

Publication Number Publication Date
CH413041A true CH413041A (de) 1966-05-15

Family

ID=23160870

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1021464A CH413041A (de) 1963-08-08 1964-08-05 Verfahren und Vorrichtung zum Befestigen von elektrischen Bauelementen auf einer Trägerplatte

Country Status (4)

Country Link
US (1) US3292240A (de)
CH (1) CH413041A (de)
GB (1) GB1013333A (de)
NL (1) NL140100B (de)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3456159A (en) * 1963-08-08 1969-07-15 Ibm Connections for microminiature functional components
US3488840A (en) * 1963-12-27 1970-01-13 Ibm Method of connecting microminiaturized devices to circuit panels
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
DE1201887B (de) * 1964-08-01 1965-09-30 Telefunken Patent Verfahren und Vorrichtung zum Einloeten von Transistoren od. dgl.
CA956038A (en) * 1964-08-20 1974-10-08 Roy W. Stiegler (Jr.) Semiconductor devices with field electrodes
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3414968A (en) * 1965-02-23 1968-12-10 Solitron Devices Method of assembly of power transistors
US3414969A (en) * 1965-02-25 1968-12-10 Solitron Devices Connection arrangement for three-element component to a micro-electronics circuit
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3391451A (en) * 1965-03-22 1968-07-09 Sperry Rand Corp Method for preparing electronic circuit units
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
FR1483574A (de) * 1965-06-24 1967-09-06
FR1486855A (de) * 1965-07-17 1967-10-05
US3512051A (en) * 1965-12-29 1970-05-12 Burroughs Corp Contacts for a semiconductor device
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3426252A (en) * 1966-05-03 1969-02-04 Bell Telephone Labor Inc Semiconductive device including beam leads
US3447038A (en) * 1966-08-01 1969-05-27 Us Navy Method and apparatus for interconnecting microelectronic circuit wafers
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung
US3470611A (en) * 1967-04-11 1969-10-07 Corning Glass Works Semiconductor device assembly method
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
US3460241A (en) * 1967-06-21 1969-08-12 Bendix Corp Method of counting semiconductor devices on thick film circuits
US3538597A (en) * 1967-07-13 1970-11-10 Us Navy Flatpack lid and method
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
US3878555A (en) * 1970-05-14 1975-04-15 Siemens Ag Semiconductor device mounted on an epoxy substrate
US3680198A (en) * 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
DE2228703A1 (de) * 1972-06-13 1974-01-10 Licentia Gmbh Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
JPS609349B2 (ja) * 1980-10-20 1985-03-09 三菱電機株式会社 ダイナミック・ランダム・アクセス半導体メモリ装置
FR2505367A1 (fr) * 1981-05-08 1982-11-12 Lignes Telegraph Telephon Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride
US4439813A (en) * 1981-07-21 1984-03-27 Ibm Corporation Thin film discrete decoupling capacitor
US4402450A (en) * 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
DE3173078D1 (en) * 1981-12-29 1986-01-09 Ibm Soldering method of pins to eyelets of conductors formed on a ceramic substrate
US4558812A (en) * 1984-11-07 1985-12-17 At&T Technologies, Inc. Method and apparatus for batch solder bumping of chip carriers
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
US4837928A (en) * 1986-10-17 1989-06-13 Cominco Ltd. Method of producing a jumper chip for semiconductor devices
US4805828A (en) * 1987-01-23 1989-02-21 Rockwell International Corporation Thermally durable surface mounted device printed wiring assemblies and apparatus and method for manufacture and repair
US5170931A (en) * 1987-03-11 1992-12-15 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4788767A (en) * 1987-03-11 1988-12-06 International Business Machines Corporation Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US5159535A (en) * 1987-03-11 1992-10-27 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens AG, 1000 Berlin und 8000 München Leiterplatte für die Elektronik
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
US5111991A (en) * 1990-10-22 1992-05-12 Motorola, Inc. Method of soldering components to printed circuit boards
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
US5540379A (en) * 1994-05-02 1996-07-30 Motorola, Inc. Soldering process
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
US5998875A (en) * 1996-12-19 1999-12-07 Telefonaktiebolaget Lm Ericsson Flip-chip type connection with elastic contacts
US6943423B2 (en) * 2003-10-01 2005-09-13 Optopac, Inc. Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
US6864116B1 (en) 2003-10-01 2005-03-08 Optopac, Inc. Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
US7122874B2 (en) * 2004-04-12 2006-10-17 Optopac, Inc. Electronic package having a sealing structure on predetermined area, and the method thereof
US6943424B1 (en) 2004-05-06 2005-09-13 Optopac, Inc. Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof
US20060043513A1 (en) * 2004-09-02 2006-03-02 Deok-Hoon Kim Method of making camera module in wafer level
KR100498708B1 (ko) * 2004-11-08 2005-07-01 옵토팩 주식회사 반도체 소자용 전자패키지 및 그 패키징 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2190478A (en) * 1938-05-12 1940-02-13 American District Telegraph Co Tube coupling and method and apparatus for making same
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
US2962801A (en) * 1955-06-14 1960-12-06 Pye Ltd Method of making electric circuits
US3098291A (en) * 1960-12-01 1963-07-23 Western Electric Co Apparatus for assembling articles

Also Published As

Publication number Publication date
NL140100B (nl) 1973-10-15
GB1013333A (en) 1965-12-15
NL6408894A (de) 1965-02-09
US3292240A (en) 1966-12-20

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