CH415780A - Verfahren zum Zusammenbau und zum elektrischen Verbinden von mit einer gedruckten Schaltung versehenen Leiterplatten - Google Patents

Verfahren zum Zusammenbau und zum elektrischen Verbinden von mit einer gedruckten Schaltung versehenen Leiterplatten

Info

Publication number
CH415780A
CH415780A CH1434063A CH1434063A CH415780A CH 415780 A CH415780 A CH 415780A CH 1434063 A CH1434063 A CH 1434063A CH 1434063 A CH1434063 A CH 1434063A CH 415780 A CH415780 A CH 415780A
Authority
CH
Switzerland
Prior art keywords
assembling
printed circuit
circuit boards
electrically connecting
connecting printed
Prior art date
Application number
CH1434063A
Other languages
English (en)
Inventor
Arthur Prohofsky Leroy
Original Assignee
Sperry Rand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Rand Corp filed Critical Sperry Rand Corp
Publication of CH415780A publication Critical patent/CH415780A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/045—Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0475—Molten solder just before placing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CH1434063A 1962-12-10 1963-11-22 Verfahren zum Zusammenbau und zum elektrischen Verbinden von mit einer gedruckten Schaltung versehenen Leiterplatten CH415780A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US243533A US3214827A (en) 1962-12-10 1962-12-10 Electrical circuitry fabrication

Publications (1)

Publication Number Publication Date
CH415780A true CH415780A (de) 1966-06-30

Family

ID=22919119

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1434063A CH415780A (de) 1962-12-10 1963-11-22 Verfahren zum Zusammenbau und zum elektrischen Verbinden von mit einer gedruckten Schaltung versehenen Leiterplatten

Country Status (4)

Country Link
US (1) US3214827A (de)
CH (1) CH415780A (de)
DE (1) DE1490492B2 (de)
GB (1) GB1026984A (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
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US3291578A (en) * 1963-11-04 1966-12-13 Gen Electric Metallized semiconductor support and mounting structure
US3467765A (en) * 1965-10-04 1969-09-16 Contemporary Research Inc Solder composition
DE1590345B1 (de) * 1966-05-10 1970-12-23 Electro Mechanismus Inc Verfahren zum Herstellen elektrischer Verbindungen zwischen gedruckten Schaltungen und Verbindungselemente zum Durchfuehren des Verfahrens
US3489877A (en) * 1966-09-23 1970-01-13 Texas Instruments Inc Method for forming brazed connections within a multilayer printed circuit board
US3591922A (en) * 1968-12-05 1971-07-13 Sperry Rand Corp Fabrication of electrical solder joints using electrodeposited solder
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
US3569607A (en) * 1969-08-01 1971-03-09 Ibm Resolderable connector
US3710196A (en) * 1970-04-27 1973-01-09 T Fifield Circuit board and method of making circuit connections
US3726007A (en) * 1971-02-02 1973-04-10 Martin Marietta Corp Component side printed circuit soldering
US3977075A (en) * 1971-10-28 1976-08-31 Amp Incorporated Method of fabricating multi-layer printed circuit board
US4334646A (en) * 1980-04-17 1982-06-15 Harris Corporation Method of solder reflow assembly
DE3108546A1 (de) * 1981-03-06 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Durchkontaktierung fuer mehrlagen-leiterplatten
US4472153A (en) * 1982-01-29 1984-09-18 Gte Products Corp. Subminiature array fabricating process
US4506442A (en) * 1982-09-29 1985-03-26 Lenkeit Industries, Inc. Method and apparatus for stacking a plurality of laminate layers to form a composite board
US4591088A (en) * 1983-05-31 1986-05-27 Hughes Aircraft Company Solder reflow process for soldering shaped articles together
US4605987A (en) * 1983-12-22 1986-08-12 Motorola, Inc. Method of controlling printed circuit board solder fillets and printed circuit boards including solder fillet control patterns
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components
US4935584A (en) * 1988-05-24 1990-06-19 Tektronix, Inc. Method of fabricating a printed circuit board and the PCB produced
US4872846A (en) * 1988-07-21 1989-10-10 Clark Thomas C Solder containing electrical connector and method for making same
US4984359A (en) * 1988-07-21 1991-01-15 Amp Incorporated Method of making a solder containing electrical connector
US5384433A (en) * 1991-10-29 1995-01-24 Aptix Corporation Printed circuit structure including power, decoupling and signal termination
US5367764A (en) * 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
WO1993019487A1 (en) * 1992-03-24 1993-09-30 Unisys Corporation Integrated circuit module having microscopic self-alignment features
JPH06132658A (ja) * 1992-10-19 1994-05-13 Cmk Corp プリント配線板における導通用部品
JPH06132656A (ja) * 1992-10-19 1994-05-13 Cmk Corp プリント配線板における導通用部品
JPH06132657A (ja) * 1992-10-19 1994-05-13 Cmk Corp プリント配線板における導通用部品
DE4238747C2 (de) * 1992-11-17 1997-04-24 Gore Enterprise Holdings Inc Anordnung zur Verbindung von Koaxialleitungen für koaxiale Hochfrequenzsteckverbindungen
CN1044762C (zh) 1993-09-22 1999-08-18 松下电器产业株式会社 印刷电路板及其制造方法
DE4432774C2 (de) * 1994-09-15 2000-04-06 Fraunhofer Ges Forschung Verfahren zur Herstellung meniskusförmiger Lotbumps
US5861666A (en) * 1995-08-30 1999-01-19 Tessera, Inc. Stacked chip assembly
US5837356A (en) * 1995-09-22 1998-11-17 Kyocera Corporation Wiring board and method for manufacturing the same
US7149095B2 (en) * 1996-12-13 2006-12-12 Tessera, Inc. Stacked microelectronic assemblies
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6225688B1 (en) 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
CA2233385C (en) * 1997-03-27 2002-10-22 Nec Corporation Electronic-circuit assembly and manufacturing method thereof
US7495179B2 (en) 2003-10-06 2009-02-24 Tessera, Inc. Components with posts and pads
US8641913B2 (en) * 2003-10-06 2014-02-04 Tessera, Inc. Fine pitch microcontacts and method for forming thereof
US6938334B2 (en) * 2003-10-31 2005-09-06 Honeywell International, Inc. Vibrating beam accelerometer two-wafer fabrication process
US7709968B2 (en) * 2003-12-30 2010-05-04 Tessera, Inc. Micro pin grid array with pin motion isolation
JP4059522B1 (ja) * 2006-10-27 2008-03-12 株式会社旭電化研究所 電気接続構造、それに用いる第１の接続部材
CN101874296B (zh) 2007-09-28 2015-08-26 泰塞拉公司 利用成对凸柱进行倒装芯片互连
JP4247798B1 (ja) * 2008-05-15 2009-04-02 株式会社旭電化研究所 コネクタ構造
FR2960378B1 (fr) * 2010-05-21 2014-11-21 Valeo Vision Assemblage d'au moins deux cartes electriques
US8330272B2 (en) 2010-07-08 2012-12-11 Tessera, Inc. Microelectronic packages with dual or multiple-etched flip-chip connectors
US8580607B2 (en) 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
US8853558B2 (en) 2010-12-10 2014-10-07 Tessera, Inc. Interconnect structure
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
TWI910033B (zh) 2016-10-27 2025-12-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
TW202618935A (zh) 2020-12-30 2026-05-01 美商艾德亞半導體接合科技有限公司 具有導電特徵的結構以及形成此結構的方法
TWI785621B (zh) * 2021-05-24 2022-12-01 環球聯通科技股份有限公司 電子元件載板及其佈線方法

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US2502291A (en) * 1946-02-27 1950-03-28 Lawrence H Taylor Method for establishing electrical connections in electrical apparatus
US2907925A (en) * 1955-09-29 1959-10-06 Gertrude M Parsons Printed circuit techniques
US2932772A (en) * 1956-06-11 1960-04-12 Western Electric Co Circuitry systems and methods of making the same

Also Published As

Publication number Publication date
DE1490492B2 (de) 1971-07-22
GB1026984A (en) 1966-04-20
DE1490492A1 (de) 1969-07-03
US3214827A (en) 1965-11-02

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