CH433510A - Verfahren zur Serienfertigung von Halbleiterbauelementen - Google Patents

Verfahren zur Serienfertigung von Halbleiterbauelementen

Info

Publication number
CH433510A
CH433510A CH413165A CH413165A CH433510A CH 433510 A CH433510 A CH 433510A CH 413165 A CH413165 A CH 413165A CH 413165 A CH413165 A CH 413165A CH 433510 A CH433510 A CH 433510A
Authority
CH
Switzerland
Prior art keywords
semiconductor components
series production
series
production
semiconductor
Prior art date
Application number
CH413165A
Other languages
English (en)
Inventor
Fritz-Werner Dipl Ch Beyerlein
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH433510A publication Critical patent/CH433510A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
CH413165A 1964-03-26 1965-03-25 Verfahren zur Serienfertigung von Halbleiterbauelementen CH433510A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0090233 1964-03-26
DES90234A DE1292755B (de) 1964-03-26 1964-03-26 Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
CH433510A true CH433510A (de) 1967-04-15

Family

ID=25997614

Family Applications (1)

Application Number Title Priority Date Filing Date
CH413165A CH433510A (de) 1964-03-26 1965-03-25 Verfahren zur Serienfertigung von Halbleiterbauelementen

Country Status (7)

Country Link
US (1) US3395447A (de)
AT (2) AT258363B (de)
CH (1) CH433510A (de)
DE (1) DE1292755B (de)
FR (1) FR1431305A (de)
GB (1) GB1075414A (de)
NL (1) NL6502202A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391426A (en) * 1965-10-22 1968-07-09 Motorola Inc Molding apparatus
US3490141A (en) * 1967-10-02 1970-01-20 Motorola Inc High voltage rectifier stack and method for making same
JPS553815B1 (de) * 1967-10-02 1980-01-26
US3679946A (en) * 1970-07-06 1972-07-25 Gen Motors Corp Strip mounted semiconductor device
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
US4689875A (en) * 1986-02-13 1987-09-01 Vtc Incorporated Integrated circuit packaging process
JP2824329B2 (ja) * 1990-10-16 1998-11-11 東光株式会社 可変容量ダイオード装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2962058A (en) * 1953-07-06 1960-11-29 Texas Instruments Inc Apparatus for forming point contacts for transistors
DE1041598B (de) * 1953-08-24 1958-10-23 Siemens Ag Verfahren zur Fertigung von Selengleichrichtern
GB803583A (en) * 1955-01-24 1958-10-29 Mullard Radio Valve Co Ltd Improvements in or relating to semi-conductive devices
DE1077790B (de) * 1955-03-10 1960-03-17 Texas Instruments Inc AEtzverfahren zur Herstellung von Halbleiteranordnungen
AT207417B (de) * 1957-11-05 1960-02-10 Philips Nv Verfahren zur Herstellung halbleitender Elektrodensysteme
US3092893A (en) * 1958-02-13 1963-06-11 Texas Instruments Inc Fabrication of semiconductor devices
US3030562A (en) * 1960-12-27 1962-04-17 Pacific Semiconductors Inc Micro-miniaturized transistor
FR1337660A (fr) * 1961-10-31 1963-09-13 Siemens Ag Procédé pour la fabrication de plaquettes semi-conductrices, en particulier de redresseurs au sélénium, avec une surface active de petite dimension par rapport à lasurface totale
US3264712A (en) * 1962-06-04 1966-08-09 Nippon Electric Co Semiconductor devices
US3235937A (en) * 1963-05-10 1966-02-22 Gen Electric Low cost transistor

Also Published As

Publication number Publication date
FR1431305A (fr) 1966-03-11
AT258363B (de) 1967-11-27
AT254947B (de) 1967-06-12
GB1075414A (en) 1967-07-12
US3395447A (en) 1968-08-06
NL6502202A (de) 1965-09-27
DE1292755B (de) 1969-04-17

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