CH438497A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH438497A
CH438497A CH355866A CH355866A CH438497A CH 438497 A CH438497 A CH 438497A CH 355866 A CH355866 A CH 355866A CH 355866 A CH355866 A CH 355866A CH 438497 A CH438497 A CH 438497A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH355866A
Other languages
English (en)
Inventor
Schaerli Otto
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH355866A priority Critical patent/CH438497A/de
Priority to DE19661539638 priority patent/DE1539638B2/de
Priority to US611332A priority patent/US3480842A/en
Priority to FR94440A priority patent/FR1510752A/fr
Priority to NL676702744A priority patent/NL154066B/xx
Priority to GB11234/67A priority patent/GB1161367A/en
Priority to SE8271/67*A priority patent/SE323749B/xx
Publication of CH438497A publication Critical patent/CH438497A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
CH355866A 1966-03-11 1966-03-11 Halbleiteranordnung CH438497A (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CH355866A CH438497A (de) 1966-03-11 1966-03-11 Halbleiteranordnung
DE19661539638 DE1539638B2 (de) 1966-03-11 1966-04-06 Halbleiterbauelement
US611332A US3480842A (en) 1966-03-11 1967-01-24 Semiconductor structure disc having pn junction with improved heat and electrical conductivity at outer layer
FR94440A FR1510752A (fr) 1966-03-11 1967-02-10 Dispositif à semi-conducteurs
NL676702744A NL154066B (nl) 1966-03-11 1967-02-23 Halfgeleiderelement.
GB11234/67A GB1161367A (en) 1966-03-11 1967-03-09 Semiconductor Devices
SE8271/67*A SE323749B (de) 1966-03-11 1967-03-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH355866A CH438497A (de) 1966-03-11 1966-03-11 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
CH438497A true CH438497A (de) 1967-06-30

Family

ID=4258568

Family Applications (1)

Application Number Title Priority Date Filing Date
CH355866A CH438497A (de) 1966-03-11 1966-03-11 Halbleiteranordnung

Country Status (7)

Country Link
US (1) US3480842A (de)
CH (1) CH438497A (de)
DE (1) DE1539638B2 (de)
FR (1) FR1510752A (de)
GB (1) GB1161367A (de)
NL (1) NL154066B (de)
SE (1) SE323749B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2556469C3 (de) * 1975-12-15 1978-09-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement mit Druckkontakt
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
US5069978A (en) * 1990-10-04 1991-12-03 Gte Products Corporation Brazed composite having interlayer of expanded metal
DE102014114096A1 (de) * 2014-09-29 2016-03-31 Danfoss Silicon Power Gmbh Sinterwerkzeug für den Unterstempel einer Sintervorrichtung
DE102014114097B4 (de) 2014-09-29 2017-06-01 Danfoss Silicon Power Gmbh Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe
DE102014114095B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Sintervorrichtung
DE102014114093B4 (de) 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE621965A (de) * 1961-09-02 1900-01-01
BE626623A (de) * 1961-12-30 1900-01-01
US3249829A (en) * 1962-05-18 1966-05-03 Transitron Electronic Corp Encapsulated diode assembly

Also Published As

Publication number Publication date
GB1161367A (en) 1969-08-13
DE1539638B2 (de) 1971-08-19
SE323749B (de) 1970-05-11
DE1539638A1 (de) 1970-09-17
NL154066B (nl) 1977-07-15
US3480842A (en) 1969-11-25
FR1510752A (fr) 1968-01-19
NL6702744A (de) 1967-09-12

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