CH449751A - Circuit arrangement with several semiconductor components connected in parallel - Google Patents

Circuit arrangement with several semiconductor components connected in parallel

Info

Publication number
CH449751A
CH449751A CH1188466A CH1188466A CH449751A CH 449751 A CH449751 A CH 449751A CH 1188466 A CH1188466 A CH 1188466A CH 1188466 A CH1188466 A CH 1188466A CH 449751 A CH449751 A CH 449751A
Authority
CH
Switzerland
Prior art keywords
parallel
circuit arrangement
semiconductor components
components connected
several semiconductor
Prior art date
Application number
CH1188466A
Other languages
German (de)
Inventor
Feldmann Hans-Helmut Ing Dr
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of CH449751A publication Critical patent/CH449751A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • H01C1/082Cooling, heating or ventilating arrangements using forced fluid flow
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/08Cooling, heating or ventilating arrangements
    • H01C1/084Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00Arrangements for protection of devices
    • H10W42/80Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/231Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/231Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fluid Mechanics (AREA)
  • Control Of Electrical Variables (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH1188466A 1965-08-21 1966-08-17 Circuit arrangement with several semiconductor components connected in parallel CH449751A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL0051443 1965-08-21

Publications (1)

Publication Number Publication Date
CH449751A true CH449751A (en) 1968-01-15

Family

ID=7274058

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1188466A CH449751A (en) 1965-08-21 1966-08-17 Circuit arrangement with several semiconductor components connected in parallel

Country Status (5)

Country Link
CH (1) CH449751A (en)
DE (1) DE1540090A1 (en)
GB (1) GB1161789A (en)
NL (1) NL6611713A (en)
SE (1) SE328341B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525392A1 (en) * 1982-04-19 1983-10-21 Inst Elektrodinamiki Akademii Transistor module - with parallel elements of enhanced redundancy rate by fuse protection for pn-junctions
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
DE4105786A1 (en) * 1991-02-23 1992-08-27 Abb Patent Gmbh Liquid cooled electrical resistance - has track formed on housing that is box shaped and has liquid circulated through it
WO2009026038A1 (en) 2007-08-16 2009-02-26 Radian Research, Inc. Instrument transformer test equipment and method
DE102011003572A1 (en) * 2011-02-03 2012-08-09 Robert Bosch Gmbh Pulse inverter with cooled shunt resistor and electric drive system with pulse inverter with cooled shunt resistor

Also Published As

Publication number Publication date
NL6611713A (en) 1967-02-22
DE1540090A1 (en) 1970-05-21
GB1161789A (en) 1969-08-20
SE328341B (en) 1970-09-14

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