CH449778A - Halbleiterelement und Verfahren zu dessen Herstellung - Google Patents

Halbleiterelement und Verfahren zu dessen Herstellung

Info

Publication number
CH449778A
CH449778A CH1342565A CH1342565A CH449778A CH 449778 A CH449778 A CH 449778A CH 1342565 A CH1342565 A CH 1342565A CH 1342565 A CH1342565 A CH 1342565A CH 449778 A CH449778 A CH 449778A
Authority
CH
Switzerland
Prior art keywords
manufacture
semiconductor element
semiconductor
Prior art date
Application number
CH1342565A
Other languages
English (en)
Inventor
Conrad Rosvold Warren
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of CH449778A publication Critical patent/CH449778A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/044—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of glass, glass-ceramic or ceramic material only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Joining Of Glass To Other Materials (AREA)
CH1342565A 1964-09-29 1965-09-29 Halbleiterelement und Verfahren zu dessen Herstellung CH449778A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40002164A 1964-09-29 1964-09-29

Publications (1)

Publication Number Publication Date
CH449778A true CH449778A (de) 1968-01-15

Family

ID=23581901

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1342565A CH449778A (de) 1964-09-29 1965-09-29 Halbleiterelement und Verfahren zu dessen Herstellung

Country Status (5)

Country Link
BE (1) BE669380A (de)
CH (1) CH449778A (de)
DE (1) DE1514369A1 (de)
GB (1) GB1115356A (de)
NL (2) NL6512505A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3136730A1 (de) * 1981-09-16 1983-03-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterdiode
JPH10501375A (ja) * 1995-03-20 1998-02-03 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ スラグと連結導体の間に銀−銅結合層を含む、ガラス中に封止された型の半導体装置

Also Published As

Publication number Publication date
NL128067C (de) 1900-01-01
NL6512505A (de) 1966-03-30
BE669380A (de) 1965-12-31
DE1514369A1 (de) 1970-07-23
GB1115356A (en) 1968-05-29

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