CH467341A - Process and bath for the deposition of copper layers - Google Patents

Process and bath for the deposition of copper layers

Info

Publication number
CH467341A
CH467341A CH788164A CH788164A CH467341A CH 467341 A CH467341 A CH 467341A CH 788164 A CH788164 A CH 788164A CH 788164 A CH788164 A CH 788164A CH 467341 A CH467341 A CH 467341A
Authority
CH
Switzerland
Prior art keywords
bath
deposition
copper layers
copper
layers
Prior art date
Application number
CH788164A
Other languages
German (de)
Inventor
W Jr Schneble Frederick
John Zeblisky Rudolph
Francis Mccormack John
Duff Williamson John
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US288618A external-priority patent/US3257215A/en
Priority claimed from US288633A external-priority patent/US3361580A/en
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of CH467341A publication Critical patent/CH467341A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH788164A 1963-06-18 1964-06-17 Process and bath for the deposition of copper layers CH467341A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US288618A US3257215A (en) 1963-06-18 1963-06-18 Electroless copper plating
US288633A US3361580A (en) 1963-06-18 1963-06-18 Electroless copper plating

Publications (1)

Publication Number Publication Date
CH467341A true CH467341A (en) 1969-01-15

Family

ID=26965129

Family Applications (1)

Application Number Title Priority Date Filing Date
CH788164A CH467341A (en) 1963-06-18 1964-06-17 Process and bath for the deposition of copper layers

Country Status (6)

Country Link
AT (1) AT254649B (en)
CH (1) CH467341A (en)
DE (1) DE1521435B2 (en)
DK (1) DK131478B (en)
GB (1) GB1041975A (en)
NL (1) NL143282B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066809A (en) * 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition

Also Published As

Publication number Publication date
DE1521435B2 (en) 1972-06-15
DK131478C (en) 1975-12-08
DK131478B (en) 1975-07-21
AT254649B (en) 1967-05-26
GB1041975A (en) 1966-09-07
NL143282B (en) 1974-09-16
NL6406858A (en) 1964-12-21
DE1521435A1 (en) 1970-12-03

Similar Documents

Publication Publication Date Title
CH413540A (en) Bath and process for the electroless deposition of copper layers
CH451191A (en) Process for the continuous diazotization of amines
AT301978B (en) Process and bath for coating metallic objects
AT250541B (en) Process for coating objects
CH432855A (en) Process for hardening polyepoxides
CH432854A (en) Process for hardening polyepoxides
CH450862A (en) Process for aluminizing metal parts
AT254509B (en) Process for modifying polyolefins
CH408690A (en) Method and device for processing the surfaces of workpieces
AT267041B (en) Process for modifying the surface of polyester moldings
AT260642B (en) Process for cleaning and pickling heating devices made of iron alloys
AT258363B (en) Process for the series production of semiconductor components
CH433968A (en) Process for the substrate of film bases made of polyethylene terephthalate
CH479488A (en) Process for the digestion of bauxite
CH467341A (en) Process and bath for the deposition of copper layers
CH413019A (en) Process for improving the superconducting properties of superconducting material
CH437815A (en) Process for the reduction of copper oxide
AT254511B (en) Process for the processing of polyolefins
AT240059B (en) Process for the electrolytic deposition of sulfo-salt-forming metals
AT244078B (en) Process for the production of magnetogram carriers
CH471233A (en) Process for suppressing the formation of haze during electroplating
CH455049A (en) Process for treating the surface of semiconductor devices
CH463902A (en) Process for the electrodeposition of chromium
AT270331B (en) Bath for the deposition of copper coatings
CH490509A (en) Bath for the electroless deposition of metal layers