CH484700A - Verfahren zum Eindiffundieren von Dotierungsstoff aus der Gasphase - Google Patents

Verfahren zum Eindiffundieren von Dotierungsstoff aus der Gasphase

Info

Publication number
CH484700A
CH484700A CH1011868A CH1011868A CH484700A CH 484700 A CH484700 A CH 484700A CH 1011868 A CH1011868 A CH 1011868A CH 1011868 A CH1011868 A CH 1011868A CH 484700 A CH484700 A CH 484700A
Authority
CH
Switzerland
Prior art keywords
gas phase
diffusing dopant
dopant
diffusing
phase
Prior art date
Application number
CH1011868A
Other languages
English (en)
Inventor
Eduard Dipl Ing Folkmann
Pammer Erich Dr Dipl-Chem
Staudacher Heinz
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH484700A publication Critical patent/CH484700A/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/32Anodisation of semiconducting materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6324Formation by anodic treatments, e.g. anodic oxidation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6304Formation by oxidation, e.g. oxidation of the substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/694Inorganic materials composed of nitrides
    • H10P14/6943Inorganic materials composed of nitrides containing silicon
    • H10P14/69433Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
CH1011868A 1967-05-07 1968-07-05 Verfahren zum Eindiffundieren von Dotierungsstoff aus der Gasphase CH484700A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1967S0110710 DE1644012B2 (de) 1967-05-07 1967-05-07 Verfahren zum eindiffundieren von dotierungsstoff aus der gasphase in eine lokal mit einer siliciumnitridschicht maskierte halbleiteroberflaeche

Publications (1)

Publication Number Publication Date
CH484700A true CH484700A (de) 1970-01-31

Family

ID=7530433

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1011868A CH484700A (de) 1967-05-07 1968-07-05 Verfahren zum Eindiffundieren von Dotierungsstoff aus der Gasphase

Country Status (7)

Country Link
AT (1) AT292786B (de)
CH (1) CH484700A (de)
DE (1) DE1644012B2 (de)
FR (1) FR1573470A (de)
GB (1) GB1234665A (de)
NL (1) NL6809330A (de)
SE (1) SE337361B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2967538D1 (en) * 1978-06-14 1985-12-05 Fujitsu Ltd Process for producing a semiconductor device having an insulating layer of silicon dioxide covered by a film of silicon oxynitride
EP0154670B1 (de) * 1978-06-14 1991-05-08 Fujitsu Limited Verfahren zur Herstellung einer Halbleiteranordnung mit einer Isolierschicht
JPS5621372A (en) * 1979-07-31 1981-02-27 Fujitsu Ltd Manufacture of semiconductor device
FR2675824B1 (fr) * 1991-04-26 1994-02-04 Alice Izrael Procede de traitement de la surface gravee d'un corps semi conducteur ou semi-isolant, circuits integres obtenus selon un tel procede et appareil d'oxydation anodique pour mettre en óoeuvre un tel procede.
DE102015102454A1 (de) 2015-02-20 2016-08-25 Osram Opto Semiconductors Gmbh Verfahren zur Strukturierung einer Nitridschicht, strukturierte Dielektrikumschicht, optoelektronisches Bauelement, Ätzverfahren zum Ätzen von Schichten und Umgebungssensor

Also Published As

Publication number Publication date
GB1234665A (de) 1971-06-09
AT292786B (de) 1971-08-15
NL6809330A (de) 1969-01-09
FR1573470A (de) 1969-07-04
SE337361B (de) 1971-08-09
DE1644012B2 (de) 1976-08-12
DE1644012A1 (de) 1970-09-24

Similar Documents

Publication Publication Date Title
AT277179B (de) Verfahren zum Verflüssigen von Gas
CH439501A (de) Verfahren zum Kontaktieren von Halbleiteranordnungen
AT286650B (de) Verfahren zum Stabilisieren von organischem Material
CH429291A (de) Verfahren zum Schützen von Textilien gegen Schädlinge
CH480168A (de) Verfahren zum Verformen von Faserplatten
CH432930A (de) Verfahren zum Schützen von Textilien
BG16329A3 (bg) Метод за получаване на нови1-фенокси-2-хидрокси-3- алкиламинопропани
AT250541B (de) Verfahren zum Überziehen von Gegenständen
AT264591B (de) Verfahren zum Eindiffundieren von aus der Gasphase dargebotenem Dotierungsmaterial in einen Halbleitergrundkristall
CH450862A (de) Verfahren zum Aluminisieren von Metallteilen
CH486361A (de) Verfahren zum manschettenartigen Verpacken von Gegenständen
CH419720A (de) Verfahren zum Schützen von Textilien
CH491163A (de) Verfahren zum Stabilisieren von Polyacetalen
AT305196B (de) Weichmachermischung für Textilien
CH476499A (de) Mischung zum Überziehen von Rektal-Kapseln
BG16442A3 (bg) Метод за получаване на нови о-изопропиламинобензофенони
CH484700A (de) Verfahren zum Eindiffundieren von Dotierungsstoff aus der Gasphase
AT286080B (de) Vorrichtung zum Abspulen von Drähten
CH496971A (de) Vorrichtung zum Aufspulen von Filmen
DK108120C (da) Fremgangsmåde til indpakning af emner.
DK119828B (da) Fremgangsmåde til fremstilling af opløsninger af Grignard-forbindelser i carbonhydrid-opløsningsmidler.
CH465994A (de) Verzinnungsverfahren
CH513252A (de) Verfahren zum thermischen Auftragen von Schichten
AT279556B (de) Verfahren zum Verhindern des Zusammenballens von kleinen Kapseln
AT278905B (de) Verfahren zum Eindiffundieren von Dotierungsstoff aus der Gasphase

Legal Events

Date Code Title Description
PL Patent ceased