CH489116A - Verfahren zur Herstellung einer Hohlkehle an einem Halbleiterbauelement - Google Patents

Verfahren zur Herstellung einer Hohlkehle an einem Halbleiterbauelement

Info

Publication number
CH489116A
CH489116A CH733169A CH733169A CH489116A CH 489116 A CH489116 A CH 489116A CH 733169 A CH733169 A CH 733169A CH 733169 A CH733169 A CH 733169A CH 489116 A CH489116 A CH 489116A
Authority
CH
Switzerland
Prior art keywords
fillet
producing
semiconductor component
semiconductor
component
Prior art date
Application number
CH733169A
Other languages
English (en)
Inventor
Sattler Guenter
Klaus Dipl Ing Weimann
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH489116A publication Critical patent/CH489116A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Thyristors (AREA)
CH733169A 1968-05-17 1969-05-14 Verfahren zur Herstellung einer Hohlkehle an einem Halbleiterbauelement CH489116A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681764326 DE1764326A1 (de) 1968-05-17 1968-05-17 Verfahren zur Anbringung einer Hohlkehle an einem Halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH489116A true CH489116A (de) 1970-04-15

Family

ID=5697939

Family Applications (1)

Application Number Title Priority Date Filing Date
CH733169A CH489116A (de) 1968-05-17 1969-05-14 Verfahren zur Herstellung einer Hohlkehle an einem Halbleiterbauelement

Country Status (8)

Country Link
US (1) US3628294A (de)
JP (1) JPS4812551B1 (de)
CH (1) CH489116A (de)
DE (1) DE1764326A1 (de)
FR (1) FR2019280B1 (de)
GB (1) GB1214238A (de)
NL (1) NL6907502A (de)
SE (1) SE353816B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264700A1 (de) * 1986-10-22 1988-04-27 BBC Brown Boveri AG Verfahren zum Anbringen einer umlaufenden Hohlkehle am Rand einer Halbleiterscheibe eines Leistungshalbleiter-Bauelements

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2340107A1 (de) * 1973-07-06 1975-01-23 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement
US4344260A (en) * 1979-07-13 1982-08-17 Nagano Electronics Industrial Co., Ltd. Method for precision shaping of wafer materials
JPS57155620U (de) * 1981-03-27 1982-09-30
JPS61109976A (ja) * 1984-10-31 1986-05-28 東亜医用電子株式会社 ガラス精密弁およびその製法
US5154022A (en) * 1991-06-21 1992-10-13 International Business Machines Corporation High precision micromachining of very fine features
US5701373A (en) * 1995-10-12 1997-12-23 Sdl, Inc. Method for improving the coupling efficiency of elliptical light beams into optical waveguides

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1945935A (en) * 1930-12-18 1934-02-06 Siemens Ag Apparatus for making embossing cylinders
US2876599A (en) * 1956-03-09 1959-03-10 Rca Corp Tuning apparatus
DE1269732C2 (de) * 1962-12-24 1973-12-13 Verfahren zum herstellen von halbleiteranordnungen
US3299579A (en) * 1964-01-17 1967-01-24 Heald Machine Co Grinding machine
NL6603372A (de) * 1965-03-25 1966-09-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264700A1 (de) * 1986-10-22 1988-04-27 BBC Brown Boveri AG Verfahren zum Anbringen einer umlaufenden Hohlkehle am Rand einer Halbleiterscheibe eines Leistungshalbleiter-Bauelements

Also Published As

Publication number Publication date
JPS4812551B1 (de) 1973-04-21
FR2019280B1 (de) 1974-02-22
NL6907502A (de) 1969-11-19
GB1214238A (en) 1970-12-02
FR2019280A1 (de) 1970-07-03
SE353816B (de) 1973-02-12
US3628294A (en) 1971-12-21
DE1764326A1 (de) 1971-07-01

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Legal Events

Date Code Title Description
PL Patent ceased