CH506885A - Halbleiterelement - Google Patents

Halbleiterelement

Info

Publication number
CH506885A
CH506885A CH1456870A CH1456870A CH506885A CH 506885 A CH506885 A CH 506885A CH 1456870 A CH1456870 A CH 1456870A CH 1456870 A CH1456870 A CH 1456870A CH 506885 A CH506885 A CH 506885A
Authority
CH
Switzerland
Prior art keywords
semiconductor element
semiconductor
Prior art date
Application number
CH1456870A
Other languages
English (en)
Inventor
Buenger Ludwig
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH506885A publication Critical patent/CH506885A/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/10Arrangements for heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • H10W72/07336Soldering or alloying
CH1456870A 1969-10-02 1970-10-01 Halbleiterelement CH506885A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691949731 DE1949731A1 (de) 1969-10-02 1969-10-02 Halbleiterelement mit kombinierten Loet-Druckkontakten

Publications (1)

Publication Number Publication Date
CH506885A true CH506885A (de) 1971-04-30

Family

ID=5747136

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1456870A CH506885A (de) 1969-10-02 1970-10-01 Halbleiterelement

Country Status (3)

Country Link
CH (1) CH506885A (de)
DE (1) DE1949731A1 (de)
GB (1) GB1309119A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
DE19843309A1 (de) * 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul

Also Published As

Publication number Publication date
GB1309119A (en) 1973-03-07
DE1949731A1 (de) 1971-04-15

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Legal Events

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