CH518005A - Electrical connection element for connecting a microelectronic circuit with external wiring - Google Patents

Electrical connection element for connecting a microelectronic circuit with external wiring

Info

Publication number
CH518005A
CH518005A CH1623870A CH1623870A CH518005A CH 518005 A CH518005 A CH 518005A CH 1623870 A CH1623870 A CH 1623870A CH 1623870 A CH1623870 A CH 1623870A CH 518005 A CH518005 A CH 518005A
Authority
CH
Switzerland
Prior art keywords
electrical connection
connection element
external wiring
microelectronic circuit
microelectronic
Prior art date
Application number
CH1623870A
Other languages
German (de)
Inventor
Martin Dr Schmidtke
Hans-Juergen Dipl Ing Hacke
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19702002571 external-priority patent/DE2002571C/en
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH518005A publication Critical patent/CH518005A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CH1623870A 1970-01-21 1970-11-03 Electrical connection element for connecting a microelectronic circuit with external wiring CH518005A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702002571 DE2002571C (en) 1970-01-21 Process for the production of connecting lines on an isolie-generating carrier for contacting a microelectronic circuit

Publications (1)

Publication Number Publication Date
CH518005A true CH518005A (en) 1972-01-15

Family

ID=5760151

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1623870A CH518005A (en) 1970-01-21 1970-11-03 Electrical connection element for connecting a microelectronic circuit with external wiring

Country Status (9)

Country Link
AT (1) AT315985B (en)
BE (1) BE761849A (en)
CA (1) CA971674A (en)
CH (1) CH518005A (en)
FR (1) FR2080918B1 (en)
GB (1) GB1320124A (en)
LU (1) LU62450A1 (en)
NL (1) NL7100522A (en)
SE (1) SE369467B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2424646A1 (en) * 1978-04-28 1979-11-23 Commissariat Energie Atomique CONNECTION PROCESS OF CONNECTION TERMINALS OF ELECTRICAL ASSEMBLIES
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
GB2218847B (en) * 1988-05-16 1991-04-24 Gen Electric Co Plc Carrier for semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1209901A (en) * 1967-01-11 1970-10-21 British Telecomm Res Ltd Improvements relating to the mounting of integrated circuit assemblies

Also Published As

Publication number Publication date
BE761849A (en) 1971-07-01
SE369467B (en) 1974-08-26
AT315985B (en) 1974-06-25
LU62450A1 (en) 1971-08-26
DE2002571B2 (en) 1972-08-17
FR2080918B1 (en) 1977-01-28
NL7100522A (en) 1971-07-23
CA971674A (en) 1975-07-22
GB1320124A (en) 1973-06-13
DE2002571A1 (en) 1971-12-23
FR2080918A1 (en) 1971-11-26

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Legal Events

Date Code Title Description
PL Patent ceased