CH519029A - Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers - Google Patents

Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers

Info

Publication number
CH519029A
CH519029A CH1307368A CH1307368A CH519029A CH 519029 A CH519029 A CH 519029A CH 1307368 A CH1307368 A CH 1307368A CH 1307368 A CH1307368 A CH 1307368A CH 519029 A CH519029 A CH 519029A
Authority
CH
Switzerland
Prior art keywords
metallizing
openings
areas
insulating body
insulating
Prior art date
Application number
CH1307368A
Other languages
English (en)
Inventor
Hoffmann Herbert
Rosshaupter Erich
Weitze Arthur
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Priority to CH1307368A priority Critical patent/CH519029A/de
Priority to DE1931248A priority patent/DE1931248C3/de
Priority to NL696912613A priority patent/NL145433B/xx
Priority to JP6754769A priority patent/JPS5327284B1/ja
Priority to AT825369A priority patent/AT296866B/de
Priority to SE11995/69A priority patent/SE359014B/xx
Priority to BR211964/69A priority patent/BR6911964D0/pt
Priority to GB43036/69D priority patent/GB1283392A/en
Publication of CH519029A publication Critical patent/CH519029A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4572—Partial coating or impregnation of the surface of the substrate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Insulating Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
CH1307368A 1968-08-30 1968-08-30 Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers CH519029A (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CH1307368A CH519029A (de) 1968-08-30 1968-08-30 Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers
DE1931248A DE1931248C3 (de) 1968-08-30 1969-06-20 Verfahren zum bereichsweisen Metallisieren von Isolierstoffkörpern
NL696912613A NL145433B (nl) 1968-08-30 1969-08-19 Werkwijze voor het metalliseren van een gedeelte van het oppervlak van een elektrisch isolerend voorwerp en gedeeltelijk gemetalliseerd elektrisch isolerend voorwerp, vervaardigd onder toepassing van deze werkwijze.
JP6754769A JPS5327284B1 (de) 1968-08-30 1969-08-26
AT825369A AT296866B (de) 1968-08-30 1969-08-28 Verfahren zum bereichsweisen Metallisieren der Oberflächen eines Isolierstoffkörpers
SE11995/69A SE359014B (de) 1968-08-30 1969-08-29
BR211964/69A BR6911964D0 (pt) 1968-08-30 1969-08-29 Processo para metalizacao por zonas de corpos isolantes
GB43036/69D GB1283392A (en) 1968-08-30 1969-08-29 Improvements in or relating to the selective metallising of bodies of insulating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1307368A CH519029A (de) 1968-08-30 1968-08-30 Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers

Publications (1)

Publication Number Publication Date
CH519029A true CH519029A (de) 1972-02-15

Family

ID=4389062

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1307368A CH519029A (de) 1968-08-30 1968-08-30 Verfahren zum bereichsweisen Metallisieren der Oberflächen sowie zum Metallisieren von Durchbrüchen eines Isolierstoffkörpers

Country Status (8)

Country Link
JP (1) JPS5327284B1 (de)
AT (1) AT296866B (de)
BR (1) BR6911964D0 (de)
CH (1) CH519029A (de)
DE (1) DE1931248C3 (de)
GB (1) GB1283392A (de)
NL (1) NL145433B (de)
SE (1) SE359014B (de)

Also Published As

Publication number Publication date
NL145433B (nl) 1975-03-17
GB1283392A (en) 1972-07-26
JPS5327284B1 (de) 1978-08-08
SE359014B (de) 1973-08-13
NL6912613A (de) 1970-03-03
DE1931248C3 (de) 1974-01-31
AT296866B (de) 1972-02-25
BR6911964D0 (pt) 1973-06-12
DE1931248B2 (de) 1973-07-05
DE1931248A1 (de) 1970-03-05

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Legal Events

Date Code Title Description
PL Patent ceased