CH519592A - Verfahren zur Herstellung galvanisch verstärkter metallischer Mikrostrukturen - Google Patents

Verfahren zur Herstellung galvanisch verstärkter metallischer Mikrostrukturen

Info

Publication number
CH519592A
CH519592A CH1062269A CH1062269A CH519592A CH 519592 A CH519592 A CH 519592A CH 1062269 A CH1062269 A CH 1062269A CH 1062269 A CH1062269 A CH 1062269A CH 519592 A CH519592 A CH 519592A
Authority
CH
Switzerland
Prior art keywords
production
reinforced metallic
galvanically reinforced
metallic microstructures
microstructures
Prior art date
Application number
CH1062269A
Other languages
English (en)
Inventor
Martin Dr Schmidtke
Original Assignee
Siemens Ag Berlin Westberlin U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag Berlin Westberlin U filed Critical Siemens Ag Berlin Westberlin U
Publication of CH519592A publication Critical patent/CH519592A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CH1062269A 1968-08-29 1969-07-11 Verfahren zur Herstellung galvanisch verstärkter metallischer Mikrostrukturen CH519592A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681790025 DE1790025B1 (de) 1968-08-29 1968-08-29 Verfahren zur herstellung galvanisch verstaerkter m etallischer mikrostrukturen

Publications (1)

Publication Number Publication Date
CH519592A true CH519592A (de) 1972-02-29

Family

ID=5706846

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1062269A CH519592A (de) 1968-08-29 1969-07-11 Verfahren zur Herstellung galvanisch verstärkter metallischer Mikrostrukturen

Country Status (6)

Country Link
CH (1) CH519592A (de)
DE (1) DE1790025B1 (de)
FR (1) FR2016573A1 (de)
GB (1) GB1261057A (de)
NL (1) NL6912860A (de)
SE (1) SE352223B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2822011C3 (de) * 1978-05-19 1987-09-10 Fujitsu Ltd., Kawasaki, Kanagawa Halbleiteranordnung und Verfahren zu deren Herstellung
AT398675B (de) * 1989-08-29 1995-01-25 Austria Tech & System Tech Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen
CN111206245A (zh) * 2020-02-17 2020-05-29 江苏友润微电子有限公司 一种柔性湿度传感器用镍铬-铝电极图形制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1164528B (de) * 1960-02-10 1964-03-05 Ruwel Werke Gmbh Verfahren zum Herstellen von gedruckten Leiterplatten

Also Published As

Publication number Publication date
GB1261057A (en) 1972-01-19
NL6912860A (de) 1970-03-03
SE352223B (de) 1972-12-18
DE1790025B1 (de) 1972-05-04
FR2016573A1 (de) 1970-05-08

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Legal Events

Date Code Title Description
PL Patent ceased