CH528148A - Method for producing an electrical circuit arrangement - Google Patents

Method for producing an electrical circuit arrangement

Info

Publication number
CH528148A
CH528148A CH1480070A CH1480070A CH528148A CH 528148 A CH528148 A CH 528148A CH 1480070 A CH1480070 A CH 1480070A CH 1480070 A CH1480070 A CH 1480070A CH 528148 A CH528148 A CH 528148A
Authority
CH
Switzerland
Prior art keywords
producing
electrical circuit
circuit arrangement
arrangement
electrical
Prior art date
Application number
CH1480070A
Other languages
German (de)
Inventor
Andrew Burns John
Coucoulas Alexander
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH528148A publication Critical patent/CH528148A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CH1480070A 1969-10-08 1970-10-06 Method for producing an electrical circuit arrangement CH528148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
CH528148A true CH528148A (en) 1972-09-15

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1480070A CH528148A (en) 1969-10-08 1970-10-06 Method for producing an electrical circuit arrangement

Country Status (10)

Country Link
JP (1) JPS509342B1 (en)
BE (1) BE757162A (en)
CH (1) CH528148A (en)
DE (1) DE2049163C3 (en)
ES (1) ES384535A1 (en)
FR (1) FR2065090A5 (en)
GB (1) GB1315510A (en)
IE (1) IE34642B1 (en)
NL (1) NL145718B (en)
SE (1) SE365068B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (en) * 1976-11-26 1978-06-28
DE2823881C3 (en) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Process for the production of electrical thin-film circuits for the production of integrated conductor track crossings
EP0015100B1 (en) * 1979-02-26 1983-08-17 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (en) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 Resistance load kuppe

Also Published As

Publication number Publication date
IE34642L (en) 1971-04-08
DE2049163A1 (en) 1971-04-22
NL7014581A (en) 1971-04-14
DE2049163B2 (en) 1977-11-10
JPS509342B1 (en) 1975-04-11
SE365068B (en) 1974-03-11
IE34642B1 (en) 1975-07-09
GB1315510A (en) 1973-05-02
FR2065090A5 (en) 1971-07-23
DE2049163C3 (en) 1978-07-06
ES384535A1 (en) 1974-06-01
NL145718B (en) 1975-04-15
BE757162A (en) 1971-03-16

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Legal Events

Date Code Title Description
PL Patent ceased