CH546467A - Isolierkoerper mit zuleitungen fuer mikroschaltkreise. - Google Patents

Isolierkoerper mit zuleitungen fuer mikroschaltkreise.

Info

Publication number: CH546467A
Authority: CH; Switzerland
Prior art keywords: microcircuits; lines; insulating body; insulating
Prior art date: 1969-06-27

Application number

CH952570A

Other languages

English (en)

Original Assignee

Us Elect Services Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-06-27

Filing date

1970-06-24

Publication date

1974-02-28

1970-06-24 Application filed by Us Elect Services Corp filed Critical Us Elect Services Corp

1974-02-28 Publication of CH546467A publication Critical patent/CH546467A/de

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device

CH952570A 1969-06-27 1970-06-24 Isolierkoerper mit zuleitungen fuer mikroschaltkreise. CH546467A (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US83724469A	1969-06-27	1969-06-27

Publications (1)

Publication Number	Publication Date
CH546467A true CH546467A (de)	1974-02-28

Family

ID=25273925

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH952570A CH546467A (de)	1969-06-27	1970-06-24	Isolierkoerper mit zuleitungen fuer mikroschaltkreise.

Country Status (5)

Country	Link
US (1)	US3641254A (de)
CH (1)	CH546467A (de)
FR (1)	FR2048002B1 (de)
GB (1)	GB1312672A (de)
NL (1)	NL7009440A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3789341A (en) *	1971-01-29	1974-01-29	Olivetti & Co Spa	Circuit package
US3916513A (en) *	1974-05-03	1975-11-04	Ampex	Forming interconnections between circuit layers
US4067951A (en) *	1975-11-19	1978-01-10	Bactomatic Inc.	Process for making impedance measuring module
US4044374A (en) *	1976-01-19	1977-08-23	Texas Instruments Incorporated	Semiconductor device header suitable for vacuum tube applications
JPS52146890A (en) *	1976-06-01	1977-12-06	Olympus Optical Co Ltd	Manufacturing method of connecting terminal assembly
US4328399A (en) *	1979-02-05	1982-05-04	Northern Telecom Limited	Pushbutton switch assembly for telecommunications and other input
US4516148A (en) *	1982-08-30	1985-05-07	The Board Of Trustees Of The Leland Stanford, Jr. University	Semiconductor device having improved lead attachment
US4680617A (en) *	1984-05-23	1987-07-14	Ross Milton I	Encapsulated electronic circuit device, and method and apparatus for making same
JPH03234605A (ja) *	1990-02-13	1991-10-18	Toshiba Corp	レジン成形装置
US5344296A (en) *	1993-07-06	1994-09-06	Motorola, Inc.	Method and apparatus for forming a runner in a mold assembly
FR2741191B1 (fr) *	1995-11-14	1998-01-09	Sgs Thomson Microelectronics	Procede de fabrication d'un micromodule, notamment pour cartes a puces
WO2000079589A1 (de) *	1999-06-17	2000-12-28	Infineon Technologies Ag	Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zum herstellen eines derartigen bauelements

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3149266A (en) *	1960-11-09	1964-09-15	Ncr Co	Electrical circuit units
US3262022A (en) *	1964-02-13	1966-07-19	Gen Micro Electronics Inc	Packaged electronic device

1969
- 1969-06-27 US US837244A patent/US3641254A/en not_active Expired - Lifetime
1970
- 1970-06-24 CH CH952570A patent/CH546467A/de unknown
- 1970-06-26 FR FR707023876A patent/FR2048002B1/fr not_active Expired
- 1970-06-26 NL NL7009440A patent/NL7009440A/xx unknown
- 1970-06-26 GB GB3121470A patent/GB1312672A/en not_active Expired

Also Published As

Publication number	Publication date
US3641254A (en)	1972-02-08
GB1312672A (en)	1973-04-04
FR2048002A1 (de)	1971-03-19
FR2048002B1 (de)	1973-01-12
NL7009440A (de)	1970-12-29

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Legal Events

Date	Code	Title	Description
1976-01-30	PLZ	Patent of addition ceased