CH546480A - Einrichtung zur absorption thermischer impulse. - Google Patents

Einrichtung zur absorption thermischer impulse.

Info

Publication number
CH546480A
CH546480A CH843772A CH546480DA CH546480A CH 546480 A CH546480 A CH 546480A CH 843772 A CH843772 A CH 843772A CH 546480D A CH546480D A CH 546480DA CH 546480 A CH546480 A CH 546480A
Authority
CH
Switzerland
Prior art keywords
absorption
thermal impulses
impulses
thermal
Prior art date
Application number
CH843772A
Other languages
English (en)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH546480A publication Critical patent/CH546480A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
CH843772A 1972-06-08 1972-06-08 Einrichtung zur absorption thermischer impulse. CH546480A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH843772 1972-06-08

Publications (1)

Publication Number Publication Date
CH546480A true CH546480A (de) 1974-02-28

Family

ID=4340332

Family Applications (1)

Application Number Title Priority Date Filing Date
CH843772A CH546480A (de) 1972-06-08 1972-06-08 Einrichtung zur absorption thermischer impulse.

Country Status (2)

Country Link
CH (1) CH546480A (de)
DE (1) DE2231282A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540278A1 (fr) * 1983-02-02 1984-08-03 Thomson Csf Dispositif de stockage d'energie thermique
EP0461544A1 (de) * 1990-06-15 1991-12-18 Battelle-Institut e.V. Wärmeableitungseinrichtung und Verfahren zu deren Herstellung
DE19932441A1 (de) * 1999-07-12 2001-01-25 Siemens Ag Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
WO2018133942A1 (de) * 2017-01-20 2018-07-26 Siemens Aktiengesellschaft Kühlplatte

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
JPH03257871A (ja) * 1990-03-07 1991-11-18 Mitsubishi Electric Corp パターン形成方法および半導体装置の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540278A1 (fr) * 1983-02-02 1984-08-03 Thomson Csf Dispositif de stockage d'energie thermique
EP0116503A1 (de) * 1983-02-02 1984-08-22 Thomson-Csf Wärmeaufnahmevorrichtung und Verfahren zu deren Herstellung
EP0461544A1 (de) * 1990-06-15 1991-12-18 Battelle-Institut e.V. Wärmeableitungseinrichtung und Verfahren zu deren Herstellung
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
US5223747A (en) * 1990-06-15 1993-06-29 Battelle-Institut E.V. Heat dissipating device
DE19932441A1 (de) * 1999-07-12 2001-01-25 Siemens Ag Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
WO2018133942A1 (de) * 2017-01-20 2018-07-26 Siemens Aktiengesellschaft Kühlplatte

Also Published As

Publication number Publication date
DE2231282A1 (de) 1973-12-20

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Legal Events

Date Code Title Description
PL Patent ceased