CH619823A5 - Method for producing printed circuit boards - Google Patents
Method for producing printed circuit boards Download PDFInfo
- Publication number
- CH619823A5 CH619823A5 CH1435375A CH1435375A CH619823A5 CH 619823 A5 CH619823 A5 CH 619823A5 CH 1435375 A CH1435375 A CH 1435375A CH 1435375 A CH1435375 A CH 1435375A CH 619823 A5 CH619823 A5 CH 619823A5
- Authority
- CH
- Switzerland
- Prior art keywords
- hole
- wire
- wall
- plastic
- weight loss
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 34
- 239000000243 solution Substances 0.000 claims description 33
- 230000004580 weight loss Effects 0.000 claims description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000080 wetting agent Substances 0.000 claims description 12
- 239000012286 potassium permanganate Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 5
- 239000003365 glass fiber Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 238000011010 flushing procedure Methods 0.000 claims 3
- 230000015556 catabolic process Effects 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000006731 degradation reaction Methods 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 229910001651 emery Inorganic materials 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010297 mechanical methods and process Methods 0.000 claims 1
- 230000005226 mechanical processes and functions Effects 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000088 plastic resin Substances 0.000 claims 1
- 238000009877 rendering Methods 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 231100000925 very toxic Toxicity 0.000 claims 1
- 239000002351 wastewater Substances 0.000 claims 1
- 238000002474 experimental method Methods 0.000 description 7
- 238000007654 immersion Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 230000003381 solubilizing effect Effects 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 potassium fluoroalkyl carboxylate Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52189074A | 1974-11-07 | 1974-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH619823A5 true CH619823A5 (en) | 1980-10-15 |
Family
ID=24078571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1435375A CH619823A5 (en) | 1974-11-07 | 1975-11-06 | Method for producing printed circuit boards |
Country Status (13)
| Country | Link |
|---|---|
| JP (1) | JPS595616B2 (da) |
| AT (1) | AT346957B (da) |
| AU (1) | AU500570B2 (da) |
| CH (1) | CH619823A5 (da) |
| DE (1) | DE2550598C3 (da) |
| DK (1) | DK154600C (da) |
| ES (1) | ES442440A1 (da) |
| FR (1) | FR2290822A1 (da) |
| GB (1) | GB1479556A (da) |
| IT (1) | IT1052168B (da) |
| NL (1) | NL180684C (da) |
| SE (1) | SE447045B (da) |
| ZA (1) | ZA756783B (da) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3110415C2 (de) * | 1981-03-18 | 1983-08-18 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten |
| US4525247A (en) * | 1982-07-12 | 1985-06-25 | Rogers Corporation | Microwave circuit boards and method of manufacture thereof |
| US4425380A (en) | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
| US4515829A (en) * | 1983-10-14 | 1985-05-07 | Shipley Company Inc. | Through-hole plating |
| JPS60154416U (ja) * | 1984-03-23 | 1985-10-15 | 三国 慶耿 | 除雪機の投雪シユ−ト |
| US4820548A (en) * | 1984-06-07 | 1989-04-11 | Enthone, Incorporated | Three step process for treating plastics with alkaline permanganate solutions |
| US4948630A (en) * | 1984-06-07 | 1990-08-14 | Enthone, Inc. | Three step process for treating plastics with alkaline permanganate solutions |
| US4601784A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
| US4601783A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards |
| DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
| US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
| US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
| AT1147U1 (de) * | 1996-01-10 | 1996-11-25 | Grundmann Schliesstechnik | Schliesszylinder und bzw. oder flachschlüssel |
| WO1999011847A1 (de) | 1997-09-01 | 1999-03-11 | Maschinenfabrik Rieter Ag | Reguliertes streckwerk |
| JP5330474B2 (ja) * | 2011-09-22 | 2013-10-30 | 上村工業株式会社 | デスミア液及びデスミア処理方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3276927A (en) * | 1963-07-01 | 1966-10-04 | North American Aviation Inc | Smoothing of mechanically drilled holes |
| US3276106A (en) * | 1963-07-01 | 1966-10-04 | North American Aviation Inc | Preparation of multilayer boards for electrical connections between layers |
| US3652351A (en) * | 1970-05-13 | 1972-03-28 | Carus Corp | Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions |
| GB1401600A (en) * | 1972-12-13 | 1975-07-16 | Kollmorgen Corp | Composition and process for the activation of resinous bodies for adherent metallization |
| DE2316720A1 (de) * | 1973-04-04 | 1974-10-31 | Licentia Gmbh | Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung |
-
1975
- 1975-10-28 ZA ZA00756783A patent/ZA756783B/xx unknown
- 1975-10-28 DK DK485175A patent/DK154600C/da not_active IP Right Cessation
- 1975-11-04 SE SE7512335A patent/SE447045B/xx not_active IP Right Cessation
- 1975-11-05 JP JP50133932A patent/JPS595616B2/ja not_active Expired
- 1975-11-05 GB GB45878/75A patent/GB1479556A/en not_active Expired
- 1975-11-05 NL NLAANVRAGE7512992,A patent/NL180684C/xx not_active IP Right Cessation
- 1975-11-05 AU AU86328/75A patent/AU500570B2/en not_active Expired
- 1975-11-06 AT AT845775A patent/AT346957B/de not_active IP Right Cessation
- 1975-11-06 CH CH1435375A patent/CH619823A5/de not_active IP Right Cessation
- 1975-11-07 FR FR7534080A patent/FR2290822A1/fr active Granted
- 1975-11-07 IT IT52113/75A patent/IT1052168B/it active
- 1975-11-07 ES ES442440A patent/ES442440A1/es not_active Expired
- 1975-11-07 DE DE752550598A patent/DE2550598C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| SE7512335L (sv) | 1976-05-10 |
| SE447045B (sv) | 1986-10-20 |
| DK154600C (da) | 1989-04-17 |
| GB1479556A (en) | 1977-07-13 |
| DK485175A (da) | 1976-05-08 |
| DE2550598C3 (de) | 1979-03-08 |
| JPS5170268A (da) | 1976-06-17 |
| AT346957B (de) | 1978-12-11 |
| NL180684B (nl) | 1986-11-03 |
| FR2290822A1 (fr) | 1976-06-04 |
| ES442440A1 (es) | 1977-04-01 |
| DE2550598A1 (de) | 1976-05-13 |
| JPS595616B2 (ja) | 1984-02-06 |
| IT1052168B (it) | 1981-06-20 |
| DK154600B (da) | 1988-11-28 |
| AU8632875A (en) | 1977-05-12 |
| DE2550598B2 (de) | 1978-07-13 |
| NL7512992A (nl) | 1976-05-11 |
| NL180684C (nl) | 1987-04-01 |
| ZA756783B (en) | 1976-10-27 |
| FR2290822B1 (da) | 1978-05-12 |
| AU500570B2 (en) | 1979-05-24 |
| ATA845775A (de) | 1978-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUE | Assignment |
Owner name: AMP-AKZO CORPORATION |
|
| PL | Patent ceased |