CH621667GA3 - Electronic support - Google Patents

Electronic support Download PDF

Info

Publication number
CH621667GA3
CH621667GA3 CH520177A CH520177A CH621667GA3 CH 621667G A3 CH621667G A3 CH 621667GA3 CH 520177 A CH520177 A CH 520177A CH 520177 A CH520177 A CH 520177A CH 621667G A3 CH621667G A3 CH 621667GA3
Authority
CH
Switzerland
Prior art keywords
integrated circuit
connections
mass
network
support
Prior art date
Application number
CH520177A
Other versions
CH621667B (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH621667B publication Critical patent/CH621667B/fr
Application filed filed Critical
Priority to CH520177A priority Critical patent/CH621667GA3/en
Publication of CH621667GA3 publication Critical patent/CH621667GA3/en

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The support forms a self-contained electronic module. It comprises a network of metal interconnections (2) and at least one integrated circuit (1). The connections (3) between the integrated circuit (1) and the network (2) are made by fine gold or aluminium wires. The integrated circuit is entirely encapsulated in a mass (4) of thermosetting plastic or of resin. The assembly forming the support, and capable of accommodating electronic components other than the integrated circuit (1), is further encapsulated in a mass of thermoplastic (7). This makes it possible to avoid any risk of ionic contamination capable of contaminating the chip and the space between the connections and also makes it possible to avoid breakage of the fine wires (3) connecting the integrated circuit (1). <IMAGE>
CH520177A 1977-04-27 1977-04-27 Electronic support CH621667GA3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CH520177A CH621667GA3 (en) 1977-04-27 1977-04-27 Electronic support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH520177A CH621667GA3 (en) 1977-04-27 1977-04-27 Electronic support

Publications (2)

Publication Number Publication Date
CH621667B CH621667B (en)
CH621667GA3 true CH621667GA3 (en) 1981-02-27

Family

ID=4289625

Family Applications (1)

Application Number Title Priority Date Filing Date
CH520177A CH621667GA3 (en) 1977-04-27 1977-04-27 Electronic support

Country Status (1)

Country Link
CH (1) CH621667GA3 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0088557A3 (en) * 1982-03-10 1985-09-25 Hitachi, Ltd. Resin encapsulated semiconductor device
EP0253225A3 (en) * 1986-07-11 1988-03-23 Junghans Uhren Gmbh Method for mounting components on a conductor network for the circuit support of an electro-mechanic watch and partially equipped conductor network of a clock-circuit support
EP3968097A1 (en) * 2020-09-09 2022-03-16 Nivarox-FAR S.A. Clock assembly and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0088557A3 (en) * 1982-03-10 1985-09-25 Hitachi, Ltd. Resin encapsulated semiconductor device
EP0253225A3 (en) * 1986-07-11 1988-03-23 Junghans Uhren Gmbh Method for mounting components on a conductor network for the circuit support of an electro-mechanic watch and partially equipped conductor network of a clock-circuit support
EP3968097A1 (en) * 2020-09-09 2022-03-16 Nivarox-FAR S.A. Clock assembly and method for manufacturing same
US12332603B2 (en) 2020-09-09 2025-06-17 Nivarox-Far S.A. Timepiece assembly and method for manufacturing the same

Also Published As

Publication number Publication date
CH621667B (en)

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Legal Events

Date Code Title Description
PL Patent ceased