CH641626GA3 - - Google Patents

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Publication number
CH641626GA3
CH641626GA3 CH40980A CH40980A CH641626GA3 CH 641626G A3 CH641626G A3 CH 641626GA3 CH 40980 A CH40980 A CH 40980A CH 40980 A CH40980 A CH 40980A CH 641626G A3 CH641626G A3 CH 641626GA3
Authority
CH
Switzerland
Prior art keywords
printed circuit
circuit board
flexible printed
chip
leads
Prior art date
Application number
CH40980A
Other languages
German (de)
English (en)
Other versions
CH641626B (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH641626B publication Critical patent/CH641626B/de
Priority claimed from JP339679U external-priority patent/JPS55105991U/ja
Priority claimed from JP4182079A external-priority patent/JPS55134386A/ja
Priority claimed from JP4607479A external-priority patent/JPS55138847A/ja
Priority claimed from JP4806579A external-priority patent/JPS55141742A/ja
Priority claimed from JP12258279A external-priority patent/JPS5646540A/ja
Application filed filed Critical
Publication of CH641626GA3 publication Critical patent/CH641626GA3/de

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electromechanical Clocks (AREA)
CH40980A 1979-01-18 1980-01-18 Verfahren zur herstellung von elektronischen uhrmodulen. CH641626B (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP339679U JPS55105991U (2) 1979-01-18 1979-01-18
JP4182079A JPS55134386A (en) 1979-04-06 1979-04-06 Circuit substrate for electronic watch
JP4607479A JPS55138847A (en) 1979-04-17 1979-04-17 Method of fabricating circuit substrate for watch
JP4806579A JPS55141742A (en) 1979-04-20 1979-04-20 Circuit board for watch
JP12258279A JPS5646540A (en) 1979-09-26 1979-09-26 Manufacture of circuit board for watch

Publications (2)

Publication Number Publication Date
CH641626B CH641626B (de)
CH641626GA3 true CH641626GA3 (2) 1984-03-15

Family

ID=27518355

Family Applications (1)

Application Number Title Priority Date Filing Date
CH40980A CH641626B (de) 1979-01-18 1980-01-18 Verfahren zur herstellung von elektronischen uhrmodulen.

Country Status (2)

Country Link
CH (1) CH641626B (2)
GB (1) GB2042774B (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653B1 (fr) * 1983-05-04 1986-06-06 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
US5111363A (en) * 1988-06-23 1992-05-05 Teikoku Tsushin Kogyo Co., Ltd. Mount for electronic parts
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors

Also Published As

Publication number Publication date
GB2042774B (en) 1983-04-13
GB2042774A (en) 1980-09-24
CH641626B (de)

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Legal Events

Date Code Title Description
PL Patent ceased