CH655132A5 - Waessriges bad fuer stromlose goldplattierung. - Google Patents

Waessriges bad fuer stromlose goldplattierung. Download PDF

Info

Publication number
CH655132A5
CH655132A5 CH3122/83A CH312283A CH655132A5 CH 655132 A5 CH655132 A5 CH 655132A5 CH 3122/83 A CH3122/83 A CH 3122/83A CH 312283 A CH312283 A CH 312283A CH 655132 A5 CH655132 A5 CH 655132A5
Authority
CH
Switzerland
Prior art keywords
gold
alkali metal
bath
potassium
cyanide
Prior art date
Application number
CH3122/83A
Other languages
German (de)
English (en)
Inventor
Mohamed Fathy El-Shazly
Alan Halecky
Kenneth Derek Baker
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Publication of CH655132A5 publication Critical patent/CH655132A5/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cosmetics (AREA)
CH3122/83A 1982-06-07 1983-06-07 Waessriges bad fuer stromlose goldplattierung. CH655132A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38561782A 1982-06-07 1982-06-07

Publications (1)

Publication Number Publication Date
CH655132A5 true CH655132A5 (de) 1986-03-27

Family

ID=23522165

Family Applications (1)

Application Number Title Priority Date Filing Date
CH3122/83A CH655132A5 (de) 1982-06-07 1983-06-07 Waessriges bad fuer stromlose goldplattierung.

Country Status (14)

Country Link
JP (1) JPS591668A (fr)
AT (1) AT380902B (fr)
AU (1) AU541923B2 (fr)
BE (1) BE896977A (fr)
CA (1) CA1188458A (fr)
CH (1) CH655132A5 (fr)
DE (1) DE3320308C2 (fr)
DK (1) DK231783A (fr)
ES (1) ES523032A0 (fr)
FR (1) FR2528073B1 (fr)
GB (1) GB2121444B (fr)
IT (1) IT1171818B (fr)
NL (1) NL8302029A (fr)
SE (1) SE8302798L (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050719A (en) * 1976-08-24 1977-09-27 Cunningham Walter F Color coded indexing system
EP0192776B1 (fr) * 1984-08-27 1990-11-14 Toyota Jidosha Kabushiki Kaisha Structure de support du tube d'une colonne de direction
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
DE3640028C1 (de) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Saures Bad fuer das stromlose Abscheiden von Goldschichten
JPS6452082A (en) * 1987-06-22 1989-02-28 Gen Electric Electroless gold plating composition and method
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
DE10101375A1 (de) * 2001-01-13 2002-07-18 Forschungszentrum Juelich Gmbh Punktkontakte für Halbleiter und deren Herstellung
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151637A (en) * 1976-04-29 1977-12-16 Trw Inc Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
FR2528073A1 (fr) 1983-12-09
ES8407520A1 (es) 1984-09-16
DE3320308C2 (de) 1985-05-15
BE896977A (fr) 1983-12-06
DE3320308A1 (de) 1983-12-08
DK231783D0 (da) 1983-05-24
AT380902B (de) 1986-07-25
SE8302798L (sv) 1983-12-08
FR2528073B1 (fr) 1986-02-14
AU1486083A (en) 1983-12-15
SE8302798D0 (sv) 1983-05-18
DK231783A (da) 1983-12-08
IT8348420A0 (it) 1983-06-03
GB2121444A (en) 1983-12-21
ATA193183A (de) 1985-12-15
GB8315556D0 (en) 1983-07-13
NL8302029A (nl) 1984-01-02
ES523032A0 (es) 1984-09-16
GB2121444B (en) 1986-03-12
AU541923B2 (en) 1985-01-31
IT1171818B (it) 1987-06-10
JPS591668A (ja) 1984-01-07
CA1188458A (fr) 1985-06-11

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PL Patent ceased
PL Patent ceased