CH660551GA3 - - Google Patents

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Info

Publication number
CH660551GA3
CH660551GA3 CH694183A CH694183A CH660551GA3 CH 660551G A3 CH660551G A3 CH 660551GA3 CH 694183 A CH694183 A CH 694183A CH 694183 A CH694183 A CH 694183A CH 660551G A3 CH660551G A3 CH 660551GA3
Authority
CH
Switzerland
Prior art keywords
integrated circuit
circuit
substrate
chip
hole
Prior art date
Application number
CH694183A
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57228953A external-priority patent/JPS59120884A/en
Priority claimed from JP58179845A external-priority patent/JPS6071980A/en
Application filed filed Critical
Publication of CH660551GA3 publication Critical patent/CH660551GA3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Clocks (AREA)

Abstract

This invention describes an improved resin mounting structure for use with an integrated circuit. An integrated circuit chip is affixed to a circuit substrate which has a hole. Circuit patterns connect to the contact pads of the integrated circuit chip and are added along the circuit substrate. An epoxy resin material is gated through the hole to surround and enclose the integrated circuit chip. In this invention, circuit patterns which are added beneath the integrated circuit chip are positioned over the hole in the substrate to allow an unimpeded flow of resin material. In addition, conductive spacing pegs are provided at each integrated circuit contact pad to allow for a uniform spacing between the integrated circuit and the circuit substrate and to provide for a more electrically and mechanically secure connection between the IC chip and the circuit substrate. Also, the circuit substrate is formed from a flexible material to absorb the displacement caused by differential thermal expansion.
CH694183A 1982-12-27 1983-12-27 CH660551GA3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57228953A JPS59120884A (en) 1982-12-27 1982-12-27 Resin sealing construction of circuit block for wrist watch
JP58179845A JPS6071980A (en) 1983-09-28 1983-09-28 Circuit mounting structure

Publications (1)

Publication Number Publication Date
CH660551GA3 true CH660551GA3 (en) 1987-05-15

Family

ID=26499576

Family Applications (1)

Application Number Title Priority Date Filing Date
CH694183A CH660551GA3 (en) 1982-12-27 1983-12-27

Country Status (2)

Country Link
US (1) US4644445A (en)
CH (1) CH660551GA3 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5220726A (en) * 1991-06-26 1993-06-22 Xerox Corporation Method for manufacturing an electrically connectable module
EP0546285B1 (en) * 1991-12-11 1997-06-11 International Business Machines Corporation Electronic package assembly with protective encapsulant material
US5469333A (en) * 1993-05-05 1995-11-21 International Business Machines Corporation Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
EP0602298B1 (en) * 1992-12-15 1998-06-10 STMicroelectronics S.r.l. Support for a semiconductor package
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
JP3186925B2 (en) * 1994-08-04 2001-07-11 シャープ株式会社 Panel mounting structure, integrated circuit mounting tape and method of manufacturing the same
DE19810060B4 (en) * 1997-05-07 2005-10-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. A method of connecting a device to a substrate and an electrical circuit made therewith
DE19729073A1 (en) * 1997-07-08 1999-01-14 Bosch Gmbh Robert Method for producing an adhesive connection between an electronic component and a carrier substrate
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
DE59809584D1 (en) * 1998-12-24 2003-10-16 Nokia Corp Process for mechanically attaching electrical components to a circuit board and a device produced by this process
DE19954888C2 (en) * 1999-11-15 2002-01-10 Infineon Technologies Ag Packaging for a semiconductor chip
DE10016135A1 (en) * 2000-03-31 2001-10-18 Infineon Technologies Ag Housing assembly for an electronic component
DE102005054985A1 (en) * 2005-11-16 2007-05-24 Marker Völkl International GmbH Snow gliding board and shell component for a snow sliding board
DE102017204842A1 (en) * 2017-03-22 2018-09-27 Robert Bosch Gmbh Contact configuration
CN109152211B (en) * 2018-08-22 2020-04-28 惠州市华星光电技术有限公司 Flip-chip light emitting diode packaging module and manufacturing method thereof
KR20230023834A (en) * 2020-12-09 2023-02-20 주식회사 솔루엠 Air-Pocket Prevention PCB, Air-Pocket Prevention PCB Module and Electrical Device having the Same and Manufacturing Method of the Electrical Device having the Same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
US4065850A (en) * 1975-08-13 1978-01-03 Kollmorgen Technologies Corporation Method of making multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
DE3051195C2 (en) * 1980-08-05 1997-08-28 Gao Ges Automation Org Package for integrated circuit incorporated in identity cards
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
JPS5850572A (en) * 1981-09-22 1983-03-25 株式会社東芝 Manufacture of display
US4435740A (en) * 1981-10-30 1984-03-06 International Business Machines Corporation Electric circuit packaging member
US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof

Also Published As

Publication number Publication date
US4644445A (en) 1987-02-17

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Legal Events

Date Code Title Description
PL Patent ceased