CH74767A - Apparatus for grinding bevels on circular glass panes, such as watch glasses, etc. - Google Patents

Apparatus for grinding bevels on circular glass panes, such as watch glasses, etc.

Info

Publication number
CH74767A
CH74767A CH74767A CH74767DA CH74767A CH 74767 A CH74767 A CH 74767A CH 74767 A CH74767 A CH 74767A CH 74767D A CH74767D A CH 74767DA CH 74767 A CH74767 A CH 74767A
Authority
CH
Switzerland
Prior art keywords
glass panes
circular glass
watch glasses
bevels
grinding
Prior art date
Application number
CH74767A
Other languages
German (de)
Inventor
Bogoljub Dawidowatz
Original Assignee
Bogoljub Dawidowatz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bogoljub Dawidowatz filed Critical Bogoljub Dawidowatz
Publication of CH74767A publication Critical patent/CH74767A/en

Links

CH74767A 1916-08-03 1916-08-03 Apparatus for grinding bevels on circular glass panes, such as watch glasses, etc. CH74767A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH74767T 1916-08-03

Publications (1)

Publication Number Publication Date
CH74767A true CH74767A (en) 1917-09-01

Family

ID=4325712

Family Applications (1)

Application Number Title Priority Date Filing Date
CH74767A CH74767A (en) 1916-08-03 1916-08-03 Apparatus for grinding bevels on circular glass panes, such as watch glasses, etc.

Country Status (1)

Country Link
CH (1) CH74767A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6234879B1 (en) * 1992-07-31 2001-05-22 Shin-Etsu Handotai Co., Ltd. Method and apparatus for wafer chamfer polishing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6234879B1 (en) * 1992-07-31 2001-05-22 Shin-Etsu Handotai Co., Ltd. Method and apparatus for wafer chamfer polishing

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